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82V3285DQ8

Description
Telecom Circuit, 1-Func, PQFP100, TQFP-100
CategoryWireless rf/communication    Telecom circuit   
File Size1MB,143 Pages
ManufacturerIDT (Integrated Device Technology)
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82V3285DQ8 Overview

Telecom Circuit, 1-Func, PQFP100, TQFP-100

82V3285DQ8 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
package instructionTQFP-100
Reach Compliance Codenot_compliant
JESD-30 codeS-PQFP-G100
JESD-609 codee0
Humidity sensitivity level3
Number of functions1
Number of terminals100
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Package shapeSQUARE
Package formFLATPACK
Peak Reflow Temperature (Celsius)225
Nominal supply voltage3.3 V
surface mountYES
Telecom integrated circuit typesTELECOM CIRCUIT
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn85Pb15)
Terminal formGULL WING
Terminal locationQUAD
Maximum time at peak reflow temperature30
Base Number Matches1
WAN PLL
IDT82V3285
Version -
March 02, 2009
6024 Silver Creek Valley Road, San Jose, CA 95138
Telephone: (800) 345-7015 • TWX: 910-338-2070 • FAX: (408) 284-2775
Printed in U.S.A.
© 2006 Integrated Device Technology, Inc.

82V3285DQ8 Related Products

82V3285DQ8 82V3285DQ 82V3285DQG8 82V3285DQG
Description Telecom Circuit, 1-Func, PQFP100, TQFP-100 Telecom Circuit, 1-Func, PQFP100, TQFP-100 Telecom Circuit, 1-Func, PQFP100, GREEN, TQFP-100 Telecom Circuit, 1-Func, PQFP100, GREEN, TQFP-100
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
package instruction TQFP-100 TQFP-100 GREEN, TQFP-100 LFQFP,
Reach Compliance Code not_compliant not_compliant compliant unknown
JESD-30 code S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100
Number of functions 1 1 1 1
Number of terminals 100 100 100 100
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QFP LFQFP QFP LFQFP
Package shape SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK FLATPACK, LOW PROFILE, FINE PITCH FLATPACK FLATPACK, LOW PROFILE, FINE PITCH
Nominal supply voltage 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES
Telecom integrated circuit types TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING GULL WING GULL WING
Terminal location QUAD QUAD QUAD QUAD
Base Number Matches 1 1 1 1
Is it lead-free? Contains lead Contains lead Lead free -
Is it Rohs certified? incompatible incompatible conform to -
JESD-609 code e0 e0 e3 -
Humidity sensitivity level 3 3 3 -
Peak Reflow Temperature (Celsius) 225 225 260 -
Terminal surface Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Matte Tin (Sn) - annealed -
Maximum time at peak reflow temperature 30 30 30 -
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