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GE28F320B3BC90

Description
Flash, 2MX16, 90ns, PBGA48, VFBGA-48
Categorystorage    storage   
File Size601KB,71 Pages
ManufacturerNumonyx ( Micron )
Websitehttps://www.micron.com
Download Datasheet Parametric Compare View All

GE28F320B3BC90 Overview

Flash, 2MX16, 90ns, PBGA48, VFBGA-48

GE28F320B3BC90 Parametric

Parameter NameAttribute value
MakerNumonyx ( Micron )
Parts packaging codeBGA
package instructionVFBGA-48
Contacts48
Reach Compliance Codeunknown
ECCN code3A991.B.1.A
Maximum access time90 ns
Other featuresBOTTOM BOOT BLOCK
startup blockBOTTOM
JESD-30 codeR-PBGA-B48
length7.286 mm
memory density33554432 bit
Memory IC TypeFLASH
memory width16
Number of functions1
Number of terminals48
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2MX16
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Programming voltage2.7 V
Certification statusNot Qualified
Maximum seat height1 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.75 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
typeNOR TYPE
width6.964 mm
Base Number Matches1
Intel
®
Advanced Boot Block Flash
Memory (B3)
28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
Datasheet
Product Features
Flexible SmartVoltage Technology
— 2.7 V – 3.6 V read/program/erase
— 12 V V
PP
fast production programming
Intel
®
Flash Data Integrator Software
—Flash Memory Manager
—System Interrupt Manager
—Supports parameter storage, streaming
data (for example, voice)
1.65 V – .5 V or 2.7 V – 3.6 V I/O option
— Reduces overall system power
High Performance
— 2.7 V – 3.6 V: 70 ns max access time
Extended Cycling Capability
—Minimum 100,000 block erase cycles
Optimized Block Sizes
— Eight 8-KB blocks for data, top or
bottom locations
— Up to 127 x 64-KB blocks for code
Automatic Power Savings Feature
—Typical I
CCS
after bus inactivity
Standard Surface Mount Packaging
—48-Ball CSP packages
—40-Lead and 48-Lead TSOP packages
Block Locking
— V
CC
-level control through Write Protect
WP#
Density and Footprint Upgradeable for
common package
—8-, 16-, 32-, and 64-Mbit densities
Low Power Consumption
— 9 mA typical read current
ETOX™ VIII (0.13
µm)
Flash
Technology
—16-Mbit and 32-Mbit densities
Absolute Hardware-Protection
— V
PP
= GND option
— V
CC
lockout voltage
ETOX™ VII (0.18
µm)
Flash Technology
—16-, 32-, and 64-Mbit densities
Extended Temperature Operation
— –40 °C to +85 °C
ETOX ™ VI (0.25µm) Flash Technology
—8-, 16-, and 32-Mbit densities
Automated Program and Block Erase
— Status registers
Bo not use the x8 option for new designs
The Intel
®
Advanced Boot Block Flash Memory (B3) device, manufactured on the Intel 0.13
µm
and 0.18
µm
technologies, is a feature-rich solution at a low system cost. The B3 device in x16 is
available in 48-lead TSOP and 48-ball CSP packages. The x8 option of this product family is
available only in 40-lead TSOP and 48-ball µBGA* packages. For additional information about
this product family, see the Intel website:
http://www.intel.com/design/flash.
Notice:
This specification is subject to change without notice. Verify with your local Intel sales
office that you have the latest datasheet before finalizing a design.
Order Number: 290580, Revision: 020
18 Aug 2005

GE28F320B3BC90 Related Products

GE28F320B3BC90 PH28F320B3BD70 TE28F320B3BA110 TE28F320B3BC90 TE28F320B3TA100 TE28F320B3TC90 TE28F320B3BA100
Description Flash, 2MX16, 90ns, PBGA48, VFBGA-48 Flash, 2MX16, 70ns, PBGA48, LEAD FREE, VFBGA-48 Flash, 2MX16, 110ns, PDSO48, 12 X 20 MM, TSOP-48 Flash, 2MX16, 90ns, PDSO48, 12 X 20 MM, TSOP-48 Flash, 2MX16, 100ns, PDSO48, 12 X 20 MM, TSOP-48 Flash, 2MX16, 90ns, PDSO48, 12 X 20 MM, TSOP-48 Flash, 2MX16, 100ns, PDSO48, 12 X 20 MM, TSOP-48
Maker Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron )
Parts packaging code BGA BGA TSOP TSOP TSOP TSOP TSOP
package instruction VFBGA-48 LEAD FREE, VFBGA-48 12 X 20 MM, TSOP-48 12 X 20 MM, TSOP-48 12 X 20 MM, TSOP-48 12 X 20 MM, TSOP-48 12 X 20 MM, TSOP-48
Contacts 48 48 48 48 48 48 48
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown
ECCN code 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A
Maximum access time 90 ns 70 ns 110 ns 90 ns 100 ns 90 ns 100 ns
Other features BOTTOM BOOT BLOCK BOTTOM BOOT BLOCK BOTTOM BOOT BLOCK BOTTOM BOOT BLOCK TOP BOOT BLOCK TOP BOOT BLOCK BOTTOM BOOT BLOCK
startup block BOTTOM BOTTOM BOTTOM BOTTOM TOP TOP BOTTOM
JESD-30 code R-PBGA-B48 R-PBGA-B48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48
length 7.286 mm 7.286 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm
memory density 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH FLASH FLASH FLASH FLASH FLASH
memory width 16 16 16 16 16 16 16
Number of functions 1 1 1 1 1 1 1
Number of terminals 48 48 48 48 48 48 48
word count 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words
character code 2000000 2000000 2000000 2000000 2000000 2000000 2000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 2MX16 2MX16 2MX16 2MX16 2MX16 2MX16 2MX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code VFBGA VFBGA TSSOP TSSOP TSSOP TSSOP TSSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Programming voltage 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1 mm 1 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.3 V 3.6 V 3.3 V 3.6 V 3.3 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.75 mm 0.75 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location BOTTOM BOTTOM DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED 15 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 6.964 mm 6.964 mm 12 mm 12 mm 12 mm 12 mm 12 mm
Base Number Matches 1 1 1 1 1 1 1
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