TE28F320B3BA100 datasheet, PDF

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TE28F320B3BA100: DescriptionFlash, 2MX16, 100ns, PDSO48, 12 X 20 MM, TSOP-48; Categorystorage storage; File Size601KB，71 Pages; ManufacturerNumonyx ( Micron ); Websitehttps://www.micron.com

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TE28F320B3BA100 Overview

Flash, 2MX16, 100ns, PDSO48, 12 X 20 MM, TSOP-48

TE28F320B3BA100 Parametric

Parameter Name	Attribute value
Maker	Numonyx ( Micron )
Parts packaging code	TSOP
package instruction	12 X 20 MM, TSOP-48
Contacts	48
Reach Compliance Code	unknown
ECCN code	3A991.B.1.A
Maximum access time	100 ns
Other features	BOTTOM BOOT BLOCK
startup block	BOTTOM
JESD-30 code	R-PDSO-G48
length	18.4 mm
memory density	33554432 bit
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of terminals	48
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Programming voltage	2.7 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
type	NOR TYPE
width	12 mm
Base Number Matches	1

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Intel

Advanced Boot Block Flash

Memory (B3)

28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3

Datasheet

Product Features

•

Flexible SmartVoltage Technology

— 2.7 V – 3.6 V read/program/erase

— 12 V V

fast production programming

•

Intel

Flash Data Integrator Software

—Flash Memory Manager

—System Interrupt Manager

—Supports parameter storage, streaming

data (for example, voice)

•

1.65 V – .5 V or 2.7 V – 3.6 V I/O option

— Reduces overall system power

•

High Performance

— 2.7 V – 3.6 V: 70 ns max access time

•

Extended Cycling Capability

—Minimum 100,000 block erase cycles

•

Optimized Block Sizes

— Eight 8-KB blocks for data, top or

bottom locations

— Up to 127 x 64-KB blocks for code

•

Automatic Power Savings Feature

—Typical I

CCS

after bus inactivity

•

Standard Surface Mount Packaging

—48-Ball CSP packages

—40-Lead and 48-Lead TSOP packages

•

Block Locking

— V

-level control through Write Protect

WP#

•

Density and Footprint Upgradeable for

common package

—8-, 16-, 32-, and 64-Mbit densities

•

Low Power Consumption

— 9 mA typical read current

•

ETOX™ VIII (0.13

µm)

Flash

Technology

—16-Mbit and 32-Mbit densities

•

Absolute Hardware-Protection

— V

= GND option

— V

lockout voltage

•

ETOX™ VII (0.18

µm)

Flash Technology

—16-, 32-, and 64-Mbit densities

•

Extended Temperature Operation

— –40 °C to +85 °C

•

ETOX ™ VI (0.25µm) Flash Technology

—8-, 16-, and 32-Mbit densities

•

Automated Program and Block Erase

— Status registers

•

Bo not use the x8 option for new designs

The Intel

Advanced Boot Block Flash Memory (B3) device, manufactured on the Intel 0.13

µm

and 0.18

µm

technologies, is a feature-rich solution at a low system cost. The B3 device in x16 is

available in 48-lead TSOP and 48-ball CSP packages. The x8 option of this product family is

available only in 40-lead TSOP and 48-ball µBGA* packages. For additional information about

this product family, see the Intel website:

http://www.intel.com/design/flash.

Notice:

This specification is subject to change without notice. Verify with your local Intel sales

office that you have the latest datasheet before finalizing a design.

Order Number: 290580, Revision: 020

18 Aug 2005

28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3

Contents

1.0 Introduction

............................................................................................................................... 7

1.1

1.2

Nomenclature ....................................................................................................................... 7

Conventions .......................................................................................................................... 8

2.0 Functional Overview

.............................................................................................................. 8

3.0 Functional Overview

.............................................................................................................. 9

3.1

3.2

Architecture Diagram .......................................................................................................... 10

Memory Maps and Block Organization ............................................................................... 11

3.2.1 Parameter Blocks .................................................................................................. 11

3.2.2 Main Blocks ........................................................................................................... 11

3.2.3 4-Mbit, 8-Mbit, 16-Mbit, 32-Mbit, and 64-Mbit Word-Wide Memory Maps ............. 11

3.2.4 4-Mbit, 8-Mbit, and 16-Mbit Byte-Wide Memory Maps........................................... 20

4.0 Package Information

............................................................................................................ 24

4.1

4.2

4.3

mBGA* and Very Thin Profile Fine Pitch Ball Grid Array (VF BGA) Package .................... 24

TSOP Package ................................................................................................................... 25

Easy BGA Package ............................................................................................................ 26

5.0 Pinout and Signal Descriptions

....................................................................................... 27

5.1

5.2

Signal Pinouts ..................................................................................................................... 27

5.1.1 40-Lead and 48-Lead TSOP Packages ................................................................. 27

Signal Descriptions ............................................................................................................. 30

6.0 Maximum Ratings and Operating Conditions

...........................................................32

6.1

6.2

Absolute Maximum Ratings ................................................................................................ 32

Operating Conditions .......................................................................................................... 33

7.0 Electrical Specifications

..................................................................................................... 34

7.1

7.2

DC Current Characteristics .................................................................................................34

DC Voltage Characteristics.................................................................................................36

8.0 AC Characteristics

................................................................................................................ 37

8.1

8.2

8.3

8.4

8.5

AC Read Characteristics .................................................................................................... 37

AC Write Characteristics..................................................................................................... 41

Erase and Program Timing .................................................................................................45

AC I/O Test Conditions ....................................................................................................... 46

Device Capacitance ............................................................................................................ 46

9.0 Power and Reset Specifications

.....................................................................................47

9.1

Power-Up/Down Characteristics ......................................................................................... 47

9.1.1 RP# Connected to System Reset .......................................................................... 47

9.1.2 V

, V

PP,

and RP# Transitions..............................................................................47

Reset Specifications ........................................................................................................... 48

Power Supply Decoupling................................................................................................... 49

9.2

9.3

Datasheet

Intel

Advanced Boot Block Flash Memory (B3)

Order Number: 290580, Revision: 020

18 Aug 2005

28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3

9.4

Power Consumption ........................................................................................................... 49

9.4.1 Active Power.......................................................................................................... 49

9.4.2 Automatic Power Savings (APS) ........................................................................... 49

9.4.3 Standby Power ...................................................................................................... 49

9.4.4 Deep Power-Down Mode....................................................................................... 50

10.0 Operations Overview

........................................................................................................... 50

10.1

Bus Operations ................................................................................................................... 51

10.1.1 Read ...................................................................................................................... 51

10.1.2 Output Disable ....................................................................................................... 52

10.1.3 Standby.................................................................................................................. 52

10.1.4 Deep Power-Down / Reset .................................................................................... 52

10.1.5 Write ...................................................................................................................... 53

11.0 Operating Modes

................................................................................................................... 53

11.1

11.2

11.3

11.4

11.5

Read Array.......................................................................................................................... 54

Read Identifier .................................................................................................................... 56

Read Status Register.......................................................................................................... 56

11.3.1 Clearing the Status Register.................................................................................. 57

Program Mode .................................................................................................................... 57

11.4.1 Suspending and Resuming Programming ............................................................. 58

Erase Mode ........................................................................................................................ 58

11.5.1 Suspending and Resuming Erase ......................................................................... 59

12.0 Block Locking

......................................................................................................................... 62

12.1

12.2

WP# = V

for Block Locking............................................................................................... 62

WP# = V

for Block Unlocking........................................................................................... 62

= V

for Complete Protection...................................................................................... 63

13.0 V

Program and Erase Voltages

................................................................................... 63

13.1

14.0 Additional Information

........................................................................................................ 63

Appendix A

Appendix B

Appendix C

Write State Machine Current/Next States

................................................. 64

Program and Erase Flowcharts

.................................................................... 66

Ordering Information

......................................................................................... 70

18 Aug 2005

Intel

Advanced Boot Block Flash Memory (B3)

Order Number: 290580, Revision: 020

Datasheet

TE28F320B3BA100 Related Products

	TE28F320B3BA100	PH28F320B3BD70	GE28F320B3BC90	TE28F320B3BA110	TE28F320B3BC90	TE28F320B3TA100	TE28F320B3TC90
Description	Flash, 2MX16, 100ns, PDSO48, 12 X 20 MM, TSOP-48	Flash, 2MX16, 70ns, PBGA48, LEAD FREE, VFBGA-48	Flash, 2MX16, 90ns, PBGA48, VFBGA-48	Flash, 2MX16, 110ns, PDSO48, 12 X 20 MM, TSOP-48	Flash, 2MX16, 90ns, PDSO48, 12 X 20 MM, TSOP-48	Flash, 2MX16, 100ns, PDSO48, 12 X 20 MM, TSOP-48	Flash, 2MX16, 90ns, PDSO48, 12 X 20 MM, TSOP-48
Maker	Numonyx ( Micron )	Numonyx ( Micron )	Numonyx ( Micron )	Numonyx ( Micron )	Numonyx ( Micron )	Numonyx ( Micron )	Numonyx ( Micron )
Parts packaging code	TSOP	BGA	BGA	TSOP	TSOP	TSOP	TSOP
package instruction	12 X 20 MM, TSOP-48	LEAD FREE, VFBGA-48	VFBGA-48	12 X 20 MM, TSOP-48	12 X 20 MM, TSOP-48	12 X 20 MM, TSOP-48	12 X 20 MM, TSOP-48
Contacts	48	48	48	48	48	48	48
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A
Maximum access time	100 ns	70 ns	90 ns	110 ns	90 ns	100 ns	90 ns
Other features	BOTTOM BOOT BLOCK	BOTTOM BOOT BLOCK	BOTTOM BOOT BLOCK	BOTTOM BOOT BLOCK	BOTTOM BOOT BLOCK	TOP BOOT BLOCK	TOP BOOT BLOCK
startup block	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	TOP	TOP
JESD-30 code	R-PDSO-G48	R-PBGA-B48	R-PBGA-B48	R-PDSO-G48	R-PDSO-G48	R-PDSO-G48	R-PDSO-G48
length	18.4 mm	7.286 mm	7.286 mm	18.4 mm	18.4 mm	18.4 mm	18.4 mm
memory density	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1
Number of terminals	48	48	48	48	48	48	48
word count	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words
character code	2000000	2000000	2000000	2000000	2000000	2000000	2000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	2MX16	2MX16	2MX16	2MX16	2MX16	2MX16	2MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	VFBGA	VFBGA	TSSOP	TSSOP	TSSOP	TSSOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Programming voltage	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1 mm	1 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	3.3 V	3.6 V	3.6 V	3.3 V	3.6 V	3.3 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	BALL	BALL	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.75 mm	0.75 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	DUAL	BOTTOM	BOTTOM	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	15	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
width	12 mm	6.964 mm	6.964 mm	12 mm	12 mm	12 mm	12 mm
Base Number Matches	1	1	1	1	1	1	1

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