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MGFC39V3742A_04

Description
3.7 ~ 4.2GHz BAND 8W INTERNALLY MATCHED GaAs FET
File Size181KB,2 Pages
ManufacturerMitsubishi
Websitehttp://www.mitsubishielectric.com/semiconductors/
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MGFC39V3742A_04 Overview

3.7 ~ 4.2GHz BAND 8W INTERNALLY MATCHED GaAs FET

MITSUBISHI SEMICONDUCTOR <GaAs FET>
MGFC39V3742A
3.7 ~ 4.2GHz BAND 8W INTERNALLY MATCHED GaAs FET
DESCRIPTION
The MGFC39V3742A is an internally impedance-matched
GaAs power FET especially designed for use in 3.7 ~ 4.2 GHz
band amplifiers.The hermetically sealed metal-ceramic
package guarantees high reliability.
OUTLINE DRAWING
Unit : millimeters
21.0 +/-0.3
FEATURES
Class A operation
Internally matched to 50(ohm) system
High output power
P1dB = 8W (TYP.) @ f=3.7~4.2GHz
High power gain
GLP = 12 dB (TYP.) @ f=3.7~4.2GHz
High power added efficiency
P.A.E. = 31 % (TYP.) @ f=3.7~4.2GHz
Low distortion [ item -51 ]
IM3= -45 dBc(TYP.) @Po=28dBm S.C.L.
2MIN
(1)
0.6 +/-0.15
12.9 +/-0.2
(2)
(2)
R-1.6
11.3
2MIN
(3)
10.7
17.0 +/-0.2
4.5 +/-0.4
item 01 : 3.7~4.2 GHz band power amplifier
item 51 : 3.7~4.2 GHz band digital radio communication
IG
RECOMMENDED BIAS CONDITIONS
VDS = 10(V)
ID = 2.4 (A)
Rg = 50(ohm)
GF-8
0.2
QUALITY GRADE
1.6
12.0
(1) GATE
(2) SOURCE (FLANGE)
(3) DRAIN
Refer to Bias Procedure
(Ta=25 deg.C)
Ratings
-15
-15
7.5
-20
42
42.8
175
-65 / +175
Unit
V
V
A
mA
mA
W
deg.C
deg.C
< Keep safety first in your circuit designs! >
Mitsubishi Electric Corporation puts the maximum effort into
making semiconductor products better and more reliable, but
there is always the possibility that trouble may occur with them.
Trouble with semiconductors may lead to personal injury, fire or
property damage. Remember to give due consideration to safety
when making your circuit designs, with appropriate measures
such as (1)placement of substitutive, auxiliary circuits, (2)use of
non-flammable material or (3)prevention against any malfunction
or mishap.
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
VGDO
Gate to drain voltage
VGSO
Gate to source voltage
ID
Drain current
IGR
Reverse gate current
IGF
Forward gate current
PT
Total power dissipation *1
Tch
Channel temperature
Tstg
Storage temperature
*1 : Tc=25 deg.C
ELECTRICAL CHARACTERISTICS
Symbol
Parameter
(Ta=25 deg.C)
Test conditions
Min.
-
-
-
38
9
-
-
-42
-
Limits
Typ.
-
2
-
39.5
12
-
31
-45
-
Max.
7.5
-
-4.5
-
-
3
-
-
3.5
Unit
A
S
V
dBm
dB
A
%
dBc
deg.C/W
IDSS
Saturated drain current
VDS=3V, VGS=0V
gm
Transconductance
VDS=3V, ID=2.2A
Gate to source cut-off voltage
VGS(off)
VDS=3V, ID=20mA
P1dB
Output power at 1dB gain compression
GLP
Linear power gain
VDS=10V, ID(RF off)=2.4A, f=3.7~4.2GHz
ID
Drain current
P.A.E.
Power added efficiency
IM3
3rd order IM distortion
*1
Rth(ch-c) Thermal resistance
*2
Delta Vf method
*1 : item -51, 2 tone test, Po=28dBm Single Carrier Level, f=4.2GHz, Delta f=10MHz
*2 : Channel to case
MITSUBISHI
ELECTRIC
June/2004
2.6 +/-0.2
APPLICATION
0.1

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