256Mb D-die DDR400 SDRAM Specification
| K4H56038D-TC | K4H561638D-TCC4 | K4H561638D-TCCC | K4H560838D-TCCC | K4H560838D-TCC4 | |
|---|---|---|---|---|---|
| Description | 256Mb D-die DDR400 SDRAM Specification | 256Mb D-die DDR400 SDRAM Specification | 256Mb D-die DDR400 SDRAM Specification | 256Mb D-die DDR400 SDRAM Specification | 256Mb D-die DDR400 SDRAM Specification |
| Is it lead-free? | - | Contains lead | - | Contains lead | Contains lead |
| Is it Rohs certified? | - | incompatible | - | incompatible | incompatible |
| Maker | - | SAMSUNG | - | SAMSUNG | SAMSUNG |
| package instruction | - | TSOP2, TSSOP66,.46 | - | TSOP2, TSSOP66,.46 | TSOP2, TSSOP66,.46 |
| Reach Compliance Code | - | compli | - | compli | compli |
| access mode | - | FOUR BANK PAGE BURST | - | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
| Maximum access time | - | 0.65 ns | - | 0.65 ns | 0.65 ns |
| Other features | - | AUTO/SELF REFRESH | - | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| Maximum clock frequency (fCLK) | - | 200 MHz | - | 200 MHz | 200 MHz |
| I/O type | - | COMMON | - | COMMON | COMMON |
| interleaved burst length | - | 2,4,8 | - | 2,4,8 | 2,4,8 |
| JESD-30 code | - | R-PDSO-G66 | - | R-PDSO-G66 | R-PDSO-G66 |
| JESD-609 code | - | e0 | - | e0 | e0 |
| length | - | 22.22 mm | - | 22.22 mm | 22.22 mm |
| memory density | - | 268435456 bi | - | 268435456 bi | 268435456 bi |
| Memory IC Type | - | DDR DRAM | - | DDR DRAM | DDR DRAM |
| memory width | - | 16 | - | 8 | 8 |
| Number of functions | - | 1 | - | 1 | 1 |
| Number of ports | - | 1 | - | 1 | 1 |
| Number of terminals | - | 66 | - | 66 | 66 |
| word count | - | 16777216 words | - | 33554432 words | 33554432 words |
| character code | - | 16000000 | - | 32000000 | 32000000 |
| Operating mode | - | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | - | 70 °C | - | 70 °C | 70 °C |
| organize | - | 16MX16 | - | 32MX8 | 32MX8 |
| Output characteristics | - | 3-STATE | - | 3-STATE | 3-STATE |
| Package body material | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | - | TSOP2 | - | TSOP2 | TSOP2 |
| Encapsulate equivalent code | - | TSSOP66,.46 | - | TSSOP66,.46 | TSSOP66,.46 |
| Package shape | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| Package form | - | SMALL OUTLINE, THIN PROFILE | - | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| power supply | - | 2.6 V | - | 2.6 V | 2.6 V |
| Certification status | - | Not Qualified | - | Not Qualified | Not Qualified |
| refresh cycle | - | 8192 | - | 8192 | 8192 |
| Maximum seat height | - | 1.2 mm | - | 1.2 mm | 1.2 mm |
| self refresh | - | YES | - | YES | YES |
| Continuous burst length | - | 2,4,8 | - | 2,4,8 | 2,4,8 |
| Maximum supply voltage (Vsup) | - | 2.7 V | - | 2.7 V | 2.7 V |
| Minimum supply voltage (Vsup) | - | 2.5 V | - | 2.5 V | 2.5 V |
| Nominal supply voltage (Vsup) | - | 2.6 V | - | 2.6 V | 2.6 V |
| surface mount | - | YES | - | YES | YES |
| technology | - | CMOS | - | CMOS | CMOS |
| Temperature level | - | COMMERCIAL | - | COMMERCIAL | COMMERCIAL |
| Terminal surface | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | - | GULL WING | - | GULL WING | GULL WING |
| Terminal pitch | - | 0.65 mm | - | 0.65 mm | 0.65 mm |
| Terminal location | - | DUAL | - | DUAL | DUAL |
| Maximum time at peak reflow temperature | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| width | - | 10.16 mm | - | 10.16 mm | 10.16 mm |
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