K4H561638D-TCCC datasheet, PDF

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K4H561638D-TCCC: Description256Mb D-die DDR400 SDRAM Specification; File Size169KB，18 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K4H561638D-TCCC Overview

256Mb D-die DDR400 SDRAM Specification

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DDR SDRAM 256Mb D-die (x8, x16)

DDR SDRAM

256Mb D-die DDR400 SDRAM Specification

Revision 1.1

Rev. 1.1 Feb. 2003

K4H561638D-TCCC Related Products

	K4H561638D-TCCC	K4H56038D-TC	K4H561638D-TCC4	K4H560838D-TCCC	K4H560838D-TCC4
Description	256Mb D-die DDR400 SDRAM Specification	256Mb D-die DDR400 SDRAM Specification	256Mb D-die DDR400 SDRAM Specification	256Mb D-die DDR400 SDRAM Specification	256Mb D-die DDR400 SDRAM Specification
Is it lead-free?	-	-	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	-	-	incompatible	incompatible	incompatible
Maker	-	-	SAMSUNG	SAMSUNG	SAMSUNG
package instruction	-	-	TSOP2, TSSOP66,.46	TSOP2, TSSOP66,.46	TSOP2, TSSOP66,.46
Reach Compliance Code	-	-	compli	compli	compli
access mode	-	-	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
Maximum access time	-	-	0.65 ns	0.65 ns	0.65 ns
Other features	-	-	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	-	-	200 MHz	200 MHz	200 MHz
I/O type	-	-	COMMON	COMMON	COMMON
interleaved burst length	-	-	2,4,8	2,4,8	2,4,8
JESD-30 code	-	-	R-PDSO-G66	R-PDSO-G66	R-PDSO-G66
JESD-609 code	-	-	e0	e0	e0
length	-	-	22.22 mm	22.22 mm	22.22 mm
memory density	-	-	268435456 bi	268435456 bi	268435456 bi
Memory IC Type	-	-	DDR DRAM	DDR DRAM	DDR DRAM
memory width	-	-	16	8	8
Number of functions	-	-	1	1	1
Number of ports	-	-	1	1	1
Number of terminals	-	-	66	66	66
word count	-	-	16777216 words	33554432 words	33554432 words
character code	-	-	16000000	32000000	32000000
Operating mode	-	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	-	-	70 °C	70 °C	70 °C
organize	-	-	16MX16	32MX8	32MX8
Output characteristics	-	-	3-STATE	3-STATE	3-STATE
Package body material	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	-	TSOP2	TSOP2	TSOP2
Encapsulate equivalent code	-	-	TSSOP66,.46	TSSOP66,.46	TSSOP66,.46
Package shape	-	-	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	-	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)	-	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	-	-	2.6 V	2.6 V	2.6 V
Certification status	-	-	Not Qualified	Not Qualified	Not Qualified
refresh cycle	-	-	8192	8192	8192
Maximum seat height	-	-	1.2 mm	1.2 mm	1.2 mm
self refresh	-	-	YES	YES	YES
Continuous burst length	-	-	2,4,8	2,4,8	2,4,8
Maximum supply voltage (Vsup)	-	-	2.7 V	2.7 V	2.7 V
Minimum supply voltage (Vsup)	-	-	2.5 V	2.5 V	2.5 V
Nominal supply voltage (Vsup)	-	-	2.6 V	2.6 V	2.6 V
surface mount	-	-	YES	YES	YES
technology	-	-	CMOS	CMOS	CMOS
Temperature level	-	-	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	-	-	GULL WING	GULL WING	GULL WING
Terminal pitch	-	-	0.65 mm	0.65 mm	0.65 mm
Terminal location	-	-	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	-	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	-	-	10.16 mm	10.16 mm	10.16 mm

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