IC 8-BIT, OTPROM, MICROCONTROLLER, CQCC44, Microcontroller
| Parameter Name | Attribute value |
| Maker | NXP |
| package instruction | QCCJ, |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.2.C |
| Has ADC | NO |
| Address bus width | 16 |
| bit size | 8 |
| maximum clock frequency | 12 MHz |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | 8 |
| JESD-30 code | S-GQCC-J44 |
| Number of I/O lines | 32 |
| Number of terminals | 44 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| PWM channel | YES |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | QCCJ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Certification status | Not Qualified |
| ROM programmability | OTPROM |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | J BEND |
| Terminal location | QUAD |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
| Base Number Matches | 1 |
| 87C51FC/BMA | 87C51FC-16/BMA-T | 5962-9169701MMX | 5962-9169702MQX | 87C51FC-16/BMA | 87C51FC/BMA-T | 87C51FC/BQA | RCWP1206208KDKET1C | 5962-9169702MMX | 5962-9169701MQX | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | IC 8-BIT, OTPROM, MICROCONTROLLER, CQCC44, Microcontroller | IC 8-BIT, OTPROM, MICROCONTROLLER, CQCC44, Microcontroller | IC 8-BIT, OTPROM, MICROCONTROLLER, CQCC44, Microcontroller | IC 8-BIT, OTPROM, MICROCONTROLLER, CDIP40, Microcontroller | IC 8-BIT, OTPROM, MICROCONTROLLER, CQCC44, Microcontroller | IC 8-BIT, OTPROM, MICROCONTROLLER, CQCC44, Microcontroller | IC 8-BIT, OTPROM, MICROCONTROLLER, CDIP40, Microcontroller | Fixed Resistor, Thick Film, 0.25W, 208000ohm, 100V, 0.5% +/-Tol, -100,100ppm/Cel, Surface Mount, 1206, CHIP | IC 8-BIT, OTPROM, MICROCONTROLLER, CQCC44, Microcontroller | IC 8-BIT, OTPROM, MICROCONTROLLER, CDIP40, Microcontroller |
| package instruction | QCCJ, | QCCJ, | QCCJ, | DIP, | QCCJ, | QCCJ, | DIP, | CHIP | QCCJ, | DIP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | EAR99 | 3A001.A.2.C | 3A001.A.2.C |
| Number of terminals | 44 | 44 | 44 | 40 | 44 | 44 | 40 | 2 | 44 | 40 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 155 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -65 °C | -55 °C | -55 °C |
| Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | SMT | CHIP CARRIER | IN-LINE |
| surface mount | YES | YES | YES | NO | YES | YES | NO | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | THICK FILM | CMOS | CMOS |
| Maker | NXP | NXP | - | NXP | NXP | NXP | NXP | - | NXP | NXP |
| Has ADC | NO | NO | NO | NO | NO | NO | NO | - | NO | NO |
| Address bus width | 16 | 16 | 16 | 16 | 16 | 16 | 16 | - | 16 | 16 |
| bit size | 8 | 8 | 8 | 8 | 8 | 8 | 8 | - | 8 | 8 |
| maximum clock frequency | 12 MHz | 16 MHz | 12 MHz | 16 MHz | 16 MHz | 12 MHz | 12 MHz | - | 16 MHz | 12 MHz |
| DAC channel | NO | NO | NO | NO | NO | NO | NO | - | NO | NO |
| DMA channel | NO | NO | NO | NO | NO | NO | NO | - | NO | NO |
| External data bus width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | - | 8 | 8 |
| JESD-30 code | S-GQCC-J44 | S-GQCC-J44 | S-GQCC-J44 | R-GDIP-T40 | S-GQCC-J44 | S-GQCC-J44 | R-GDIP-T40 | - | S-GQCC-J44 | R-GDIP-T40 |
| Number of I/O lines | 32 | 32 | 32 | 32 | 32 | 32 | 32 | - | 32 | 32 |
| PWM channel | YES | YES | YES | YES | YES | YES | YES | - | YES | YES |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | QCCJ | QCCJ | QCCJ | DIP | QCCJ | QCCJ | DIP | - | QCCJ | DIP |
| Package shape | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | - | SQUARE | RECTANGULAR |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| ROM programmability | OTPROM | OTPROM | OTPROM | OTPROM | OTPROM | OTPROM | OTPROM | - | OTPROM | OTPROM |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | - | MILITARY | MILITARY |
| Terminal form | J BEND | J BEND | J BEND | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | - | J BEND | THROUGH-HOLE |
| Terminal location | QUAD | QUAD | QUAD | DUAL | QUAD | QUAD | DUAL | - | QUAD | DUAL |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | - | MICROCONTROLLER | MICROCONTROLLER |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 |