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79RC32K438K438200BBI

Description
RISC Microprocessor, 32-Bit, 200MHz, PBGA416, 27 X 27 MM, PLASTIC, BGA-416
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,59 Pages
ManufacturerIDT (Integrated Device Technology)
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79RC32K438K438200BBI Overview

RISC Microprocessor, 32-Bit, 200MHz, PBGA416, 27 X 27 MM, PLASTIC, BGA-416

79RC32K438K438200BBI Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instructionBGA,
Contacts416
Reach Compliance Codecompliant
ECCN code3A001.A.3
Address bus width32
bit size32
boundary scanYES
maximum clock frequency66.6 MHz
External data bus width32
FormatFIXED POINT
Integrated cacheYES
JESD-30 codeS-PBGA-B416
JESD-609 codee0
length27 mm
Humidity sensitivity level3
Number of terminals416
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)225
Certification statusNot Qualified
Maximum seat height2.5 mm
speed200 MHz
Maximum supply voltage1.3 V
Minimum supply voltage1.1 V
Nominal supply voltage1.2 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature20
width27 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Base Number Matches1
IDT
TM
Interprise
TM
Integrated
Communications Processor
79RC32438
Features
32-bit CPU Core
– MIPS32 instruction set
– Cache Sizes: 16KB instruction and data caches, 4-Way set
associative, cache line locking, non-blocking prefetches
– 16 dual-entry JTLB with variable page sizes
– 3-entry instruction TLB
– 3-entry data TLB
– Max issue rate of one 32x16 multiply per clock
– Max issue rate of one 32x32 multiply every other clock
– CPU control with start, stop and single stepping
– Software breakpoints support
– Hardware breakpoints on virtual addresses
– Enhanced JTAG and ICE Interface that is compatible with v2.5
of the EJTAG Specification
DDR Memory Controller
– Supports up to 2GB of DDR SDRAM
– 2 chip selects (each chip select supports 4 internal DDR
banks)
– Supports 16-bit or 32-bit data bus width using 8, 16, or 32-bit
devices
– Supports 64Mb, 128Mb, 256Mb, 512Mb, and 1Gb DDR
SDRAM devices
– Data bus multiplexing support allows interfacing to standard
DDR DIMMs and SODIMMs
– Automatic refresh generation
Memory and Peripheral Device Controller
– Provides “glueless” interface to standard SRAM, Flash, ROM,
dual-port memory, and peripheral devices
– Demultiplexed address and data buses: 16-bit data bus, 26-bit
address bus, 6 chip selects, supports alternate bus masters,
control for external data bus buffers
– Supports 8-bit and 16-bit width devices
Automatic byte gathering and scattering
– Flexible protocol configuration parameters: programmable
number of wait states (0 to 63), programmable postread/post-
write delay (0 to 31), supports external wait state generation,
supports Intel and Motorola style peripherals
– Write protect capability per chip select
– Programmable bus transaction timer generates warm reset
when counter expires
– Supports up to 64 MB of memory per chip select
Counter/Timers
– Three general purpose 32-bit counter timers
PCI Interface
– 32-bit PCI revision 2.2 compliant (3.3V only)
– Supports host or satellite operation in both master and target
modes
– Support for synchronous and asynchronous operation
– PCI clock supports frequencies from 16 MHz to 66 MHz
– PCI arbiter in Host mode: supports 6 external masters, fixed
priority or round robin arbitration
– I
2
O “like” PCI Messaging Unit
Block Diagram
MII
MII
MIPS-32
CPU Core
ICE
EJTAG
D. Cache
MMU
I. Cache
Interrupt
Controller
:
:
2 Ethernet
10/100
Interfaces
3 Counter
Timers
IPBus
TM
On-Chip
Memory
DMA
Controller
DDR
DDR &
Device
Controllers
I
2
C
Controller
2 UARTS
(16550)
Arbiter
GPIO
Interface
SPI
Controller
PCI
Master/Target
Interface
PCI Arbiter
(Host Mode)
Memory &
Peripheral Bus
I
2
C Bus
Ch. 1 Ch. 2
Serial Channels
GPIO Pins
SPI Bus
PCI Bus
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 59
2003 Integrated Device Technology, Inc.
July 9, 2003
DSC 6148

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Description RISC Microprocessor, 32-Bit, 200MHz, PBGA416, 27 X 27 MM, PLASTIC, BGA-416 Fixed Resistor, Metal Glaze/thick Film, 0.75W, 80600000ohm, 2500V, 1% +/-Tol, 25ppm/Cel, Fixed Resistor, Metal Film, 0.4W, 264ohm, 200V, 0.5% +/-Tol, 100ppm/Cel, RISC Microprocessor, 32-Bit, 200MHz, PBGA416, 27 X 27 MM, PLASTIC, BGA-416 RISC Microprocessor, 32-Bit, 266MHz, PBGA416, 27 X 27 MM, PLASTIC, BGA-416 RISC Microprocessor, 32-Bit, 266MHz, PBGA416, 27 X 27 MM, PLASTIC, BGA-416
Is it Rohs certified? incompatible conform to conform to incompatible incompatible incompatible
Reach Compliance Code compliant compliant compliant compliant compliant compliant
ECCN code 3A001.A.3 EAR99 EAR99 3A001.A.3 3A001.A.3 3A001.A.3
Number of terminals 416 2 2 416 416 416
Maximum operating temperature 85 °C 110 °C 160 °C 70 °C 70 °C 85 °C
Minimum operating temperature -40 °C -55 °C -55 °C - - -40 °C
Package shape SQUARE TUBULAR PACKAGE CYLINDRICAL PACKAGE SQUARE SQUARE SQUARE
Package form GRID ARRAY Axial Axial GRID ARRAY GRID ARRAY GRID ARRAY
technology CMOS METAL GLAZE/THICK FILM METAL FILM CMOS CMOS CMOS
Is it lead-free? Contains lead - - Contains lead Contains lead Contains lead
Maker IDT (Integrated Device Technology) - - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code BGA - - BGA BGA BGA
package instruction BGA, - - BGA, BGA, BGA,
Contacts 416 - - 416 416 416
Address bus width 32 - - 32 32 32
bit size 32 - - 32 32 32
boundary scan YES - - YES YES YES
maximum clock frequency 66.6 MHz - - 66.6 MHz 88.6 MHz 88.6 MHz
External data bus width 32 - - 32 32 32
Format FIXED POINT - - FIXED POINT FIXED POINT FIXED POINT
Integrated cache YES - - YES YES YES
JESD-30 code S-PBGA-B416 - - S-PBGA-B416 S-PBGA-B416 S-PBGA-B416
JESD-609 code e0 - e3 e0 e0 e0
length 27 mm - - 27 mm 27 mm 27 mm
Humidity sensitivity level 3 - - 3 3 3
Package body material PLASTIC/EPOXY - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA - - BGA BGA BGA
Peak Reflow Temperature (Celsius) 225 - - 225 225 225
Certification status Not Qualified - - Not Qualified Not Qualified Not Qualified
Maximum seat height 2.5 mm - - 2.5 mm 2.5 mm 2.5 mm
speed 200 MHz - - 200 MHz 266 MHz 266 MHz
Maximum supply voltage 1.3 V - - 1.3 V 1.4 V 1.4 V
Minimum supply voltage 1.1 V - - 1.1 V 1.2 V 1.2 V
Nominal supply voltage 1.2 V - - 1.2 V 1.3 V 1.3 V
surface mount YES - - YES YES YES
Temperature level INDUSTRIAL - - COMMERCIAL COMMERCIAL INDUSTRIAL
Terminal surface TIN LEAD - Matte Tin (Sn) TIN LEAD TIN LEAD TIN LEAD
Terminal form BALL - - BALL BALL BALL
Terminal pitch 1 mm - - 1 mm 1 mm 1 mm
Terminal location BOTTOM - - BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 20 - - 20 20 20
width 27 mm - - 27 mm 27 mm 27 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC - - MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 - - 1 1 1
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