5962-9461106HXX datasheet, PDF

5962-9461106HXX: DescriptionSRAM Module, 2MX8, 45ns, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66; Categorystorage storage; File Size316KB，10 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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5962-9461106HXX Overview

SRAM Module, 2MX8, 45ns, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Microsemi
package instruction	PGA,
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	45 ns
Other features	CONFIGURABLE AS 512K X 32 OR 1M X 16; TTL COMPATIBLE INPUT OUTPUT
JESD-30 code	S-CPGA-P66
JESD-609 code	e4
length	35.2 mm
memory density	16777216 bit
Memory IC Type	SRAM MODULE
memory width	8
Number of functions	1
Number of terminals	66
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	2MX8
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	5.7 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	GOLD
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED
width	35.2 mm
Base Number Matches	1

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