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79RC32H434-300BCGI

Description
CABGA-256, Tray
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1015KB,54 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
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79RC32H434-300BCGI Overview

CABGA-256, Tray

79RC32H434-300BCGI Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeCABGA
package instruction17 X 17 MM, MO-192AAF-1, CABGA-256
Contacts256
Manufacturer packaging codeBCG256
Reach Compliance Codecompliant
Address bus width14
bit size32
boundary scanYES
maximum clock frequency125 MHz
External data bus width16
FormatFIXED POINT
Integrated cacheYES
JESD-30 codeS-PBGA-B256
JESD-609 codee1
length17 mm
low power modeYES
Humidity sensitivity level3
Number of terminals256
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)260
Maximum seat height1.7 mm
speed300 MHz
Maximum supply voltage1.3 V
Minimum supply voltage1.1 V
Nominal supply voltage1.2 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width17 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Base Number Matches1
IDT
TM
Interprise
TM
Integrated
Communications Processor
RC32434
Device Overview
The RC32434 is a member of the IDT™ Interprise™ family of PCI
integrated communications processors. It incorporates a high perfor-
mance CPU core and a number of on-chip peripherals. The integrated
processor is designed to transfer information from I/O modules to main
memory with minimal CPU intervention, using a highly sophisticated
direct memory access (DMA) engine. All data transfers through the
RC32434 are achieved by writing data from an on-chip I/O peripheral to
main memory and then out to another I/O module.
Features
x
32-bit CPU Core
– MIPS32 instruction set
– Cache Sizes: 8KB instruction and data caches, 4-Way set
associative, cache line locking, non-blocking prefetches
– 16 dual-entry JTLB with variable page sizes
– 3-entry instruction TLB
– 3-entry data TLB
– Max issue rate of one 32x16 multiply per clock
– Max issue rate of one 32x32 multiply every other clock
– CPU control with start, stop, and single stepping
– Software breakpoints support
– Hardware breakpoints on virtual addresses
– ICE Interface that is compatible with v2.5 of the EJTAG Spec-
ification
PCI Interface
– 32-bit PCI revision 2.2 compliant
– Supports host or satellite operation in both master and target
modes
– Support for synchronous and asynchronous operation
– PCI clock supports frequencies from 16 MHz to 66 MHz
– PCI arbiter in Host mode: supports 6 external masters, fixed
priority or round robin arbitration
– I
2
O “like” PCI Messaging Unit
x
Ethernet Interface
– 10 and 100 Mb/s ISO/IEC 8802-3:1996 compliant
– Supports MII or RMII PHY interface
– Supports 64 entry hash table based multicast address filtering
– 512 byte transmit and receive FIFOs
– Supports flow control functions outlined in IEEE Std. 802.3x-
1997
x
DDR Memory Controller
– Supports up to 256MB of DDR SDRAM
– 1 chip select supporting 4 internal DDR banks
– Supports a 16-bit wide data port using x8 or x16 bit wide DDR
SDRAM devices
– Supports 64 Mb, 128 Mb, 256 Mb, 512 Mb, and 1Gb DDR
SDRAM devices
– Data bus multiplexing support allows interfacing to standard
DDR DIMMs and SODIMMs
– Automatic refresh generation
x
Block Diagram
MII/RMII
I
2
C Bus
MIPS-32
CPU Core
ICE
EJTAG
D. Cache
PMBus
Interrupt
Controller
:
:
1 Ethernet
10/100
Interface
MMU
I. Cache
3 Counter
Timers
IPBus
TM
I
2
C
Controller
DMA
Controller
DDR
(16-bit)
DDR
Controllers
Arbiter
Memory & I/O
Controller
Bus/System
Integrity
Monitor
1 UART
(16550)
GPIO
Interface
SPI
Controller
PCI
Master/Target
Interface
PCI Arbiter
(Host Mode)
Memory &
Peripheral Bus (8-bit)
Serial Channel
GPIO Pins
SPI Bus
PCI Bus
IDT and the IDT logo are trademarks of Integrated Device Technology, Inc.
1 of 53
January 19, 2006
DSC 6214

79RC32H434-300BCGI Related Products

79RC32H434-300BCGI 79RC32H434-350BCGI 79RC32H434-350BCI 79RC32H434-266BCG 79RC32H434-266BC 79RC32H434-300BCI 79RC32H434-300BC 79RC32H434-400BCG
Description CABGA-256, Tray CABGA-256, Tray CABGA-256, Tray CABGA-256, Tray CABGA-256, Tray CABGA-256, Tray CABGA-256, Tray CABGA-256, Tray
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
Is it lead-free? Lead free Lead free Contains lead Lead free Contains lead Contains lead Contains lead Lead free
Is it Rohs certified? conform to conform to incompatible conform to incompatible incompatible incompatible conform to
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code CABGA CABGA CABGA CABGA CABGA CABGA CABGA CABGA
package instruction 17 X 17 MM, MO-192AAF-1, CABGA-256 17 X 17 MM, MO-192AAF-1, CABGA-256 LBGA, BGA256,16X16,40 17 X 17 MM, MO-192AAF-1, CABGA-256 LBGA, BGA256,16X16,40 LBGA, BGA256,16X16,40 LBGA, BGA256,16X16,40 LBGA,
Contacts 256 256 256 256 256 256 256 256
Manufacturer packaging code BCG256 BCG256 BC256 BCG256 BC256 BC256 BC256 BCG256
Reach Compliance Code compliant compliant not_compliant compliant not_compliant not_compliant not_compliant compliant
Address bus width 14 14 32 14 32 32 32 14
bit size 32 32 32 32 32 32 32 32
boundary scan YES YES YES YES YES YES YES YES
maximum clock frequency 125 MHz 125 MHz 125 MHz 125 MHz 125 MHz 125 MHz 125 MHz 125 MHz
External data bus width 16 16 32 16 32 32 32 16
Format FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT
Integrated cache YES YES YES YES YES YES YES YES
JESD-30 code S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256
JESD-609 code e1 e1 e0 e1 e0 e0 e0 e1
length 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm
low power mode YES YES NO YES NO NO NO YES
Humidity sensitivity level 3 3 3 3 3 3 3 3
Number of terminals 256 256 256 256 256 256 256 256
Maximum operating temperature 85 °C 85 °C 85 °C 70 °C 70 °C 85 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA LBGA LBGA LBGA LBGA LBGA LBGA LBGA
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius) 260 260 225 260 225 225 225 260
Maximum seat height 1.7 mm 1.7 mm 1.7 mm 1.7 mm 1.7 mm 1.7 mm 1.7 mm 1.7 mm
speed 300 MHz 350 MHz 350 MHz 266 MHz 266 MHz 300 MHz 300 MHz 400 MHz
Maximum supply voltage 1.3 V 1.3 V 1.3 V 1.3 V 1.3 V 1.3 V 1.3 V 1.3 V
Minimum supply voltage 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V
Nominal supply voltage 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL BALL BALL BALL BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED 20 NOT SPECIFIED 20 20 20 NOT SPECIFIED
width 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1 1 1 1 1 1 -
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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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