|
5962-8984105LA |
5962-89841053X |
| Description |
Flash PLD, 15ns, PAL-Type, CMOS, CDIP24, CERAMIC, DIP-24 |
EE PLD, 15ns, CMOS, CQCC28, CERAMIC, LCC-28 |
| Is it lead-free? |
Contains lead |
Contains lead |
| Is it Rohs certified? |
incompatible |
incompatible |
| Parts packaging code |
DIP |
QLCC |
| package instruction |
DIP, DIP24,.3 |
QCCN, |
| Contacts |
24 |
28 |
| Reach Compliance Code |
compliant |
compliant |
| ECCN code |
3A001.A.2.C |
3A001.A.2.C |
| maximum clock frequency |
42 MHz |
55.55 MHz |
| JESD-30 code |
R-CDIP-T24 |
S-CQCC-N28 |
| JESD-609 code |
e0 |
e0 |
| length |
32 mm |
11.43 mm |
| Dedicated input times |
11 |
11 |
| Number of I/O lines |
10 |
10 |
| Number of terminals |
24 |
28 |
| Maximum operating temperature |
125 °C |
125 °C |
| Minimum operating temperature |
-55 °C |
-55 °C |
| organize |
11 DEDICATED INPUTS, 10 I/O |
11 DEDICATED INPUTS, 10 I/O |
| Output function |
MACROCELL |
REGISTERED |
| Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
| encapsulated code |
DIP |
QCCN |
| Package shape |
RECTANGULAR |
SQUARE |
| Package form |
IN-LINE |
CHIP CARRIER |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
| Programmable logic type |
FLASH PLD |
EE PLD |
| propagation delay |
15 ns |
15 ns |
| Certification status |
Qualified |
Qualified |
| Maximum seat height |
5.08 mm |
2.54 mm |
| Maximum supply voltage |
5.5 V |
5.5 V |
| Minimum supply voltage |
4.5 V |
4.5 V |
| Nominal supply voltage |
5 V |
5 V |
| surface mount |
NO |
YES |
| technology |
CMOS |
CMOS |
| Temperature level |
MILITARY |
MILITARY |
| Terminal surface |
TIN LEAD |
TIN LEAD |
| Terminal form |
THROUGH-HOLE |
NO LEAD |
| Terminal pitch |
2.54 mm |
1.27 mm |
| Terminal location |
DUAL |
QUAD |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
7.62 mm |
11.43 mm |
| Base Number Matches |
1 |
1 |