FEATURES AND SPECIFICATIONS
Features and Benefits
s
Sizes 16 to 64 circuits
s
DIN 41612 and IEC 603-2 compatible
s
Two points of contact provide low insertion force and
reliable connection
s
The 52482 has slight dimensional differences from the
52299/52479, contact factory for details
Reference Information
Packaging: Tray
UL File No.: E29179 (for 52299 and 52479)
CSA File No.: LR19980
Mates With: 53229, 53315, 53230, 53316, 53294
and 53319
Designed In: Millimeters
Electrical
Voltage: 300V
Current: 2.0A
Contact Resistance: 20m
Ω
max.
Dielectric Withstanding Voltage: 1000V AC
Insulation Resistance: 10
6
M
Ω
min.
Physical
Housing: Glass-filled PBT, UL 94V-O
Contact: Phosphor Bronze
Metal Peg: Phosphor Bronze
Plating: See Table
Temperature: -55 to +105˚C
2.54mm (.100") Pitch
DIN 41612
Receptacle
52299/52479/52482
Vertical
Note: 52479 shown
ORDERING INFORMATION AND DIMENSIONS
Circuits
10
16
20
32
44
50
64
Order No.
Without Metal Peg
52299-016X
52299-020X
52299-032X
52299-044X
52299-050X
52299-064X
With Metal Peg
52482-0100
52479-016X
52479-020X
52479-032X
52479-044X
52479-050X
52479-064X
A
26.22 (1.032)
33.84 (1.332)
38.92 (1.532)
54.16 (2.132)
69.40 (2.732)
77.02 (3.032)
94.80 (3.732)
Replace X with plating no., 0-3
10.16
17.78
22.86
38.10
53.34
60.96
78.74
B
(.400)
(.700)
(.900)
(1.500)
(2.100)
(2.400)
(3.100)
Dimension
21.42
29.04
34.12
49.36
64.60
72.22
90.00
C
(.843)
(1.143)
(1.343)
(1.943)
(2.543)
(2.843)
(3.543)
16.32
23.94
29.02
44.26
59.50
67.12
84.90
D
(.643)
(.943)
(1.143)
(1.743)
(2.343)
(2.643)
(3.343)
Plating No. 0: 0.1
µ
m Gold with Nickel underplate overall and Tin/Lead in solder area
Plating No. 1: 0.3
µ
m Gold with Nickel underplate overall and Tin/Lead in solder area
Plating No. 2: 0.5
µ
m Gold with Nickel underplate overall and Tin/Lead in solder area
Plating No. 3: 0.76
µ
m Gold with Nickel underplate overall and Tin/Lead in solder area
990
C-89
Backplane Connectors
C
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