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89HPES4T4ZBBCGI8

Description
CABGA-144, Reel
CategoryMicrocontrollers and processors   
File Size529KB,31 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance  
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89HPES4T4ZBBCGI8 Overview

CABGA-144, Reel

89HPES4T4ZBBCGI8 Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeCABGA
package instructionLBGA, BGA144,12X12,40
Contacts144
Manufacturer packaging codeBCG144
Reach Compliance Codecompliant
ECCN codeEAR99
Samacsys Confidence3
Samacsys StatusReleased
Samacsys PartID11322057
Samacsys Pin Count144
Samacsys Part CategoryIntegrated Circuit
Samacsys Package CategoryBGA
Samacsys Footprint Name144-LEAD BGA [13 X 13]
Samacsys Released Date2020-01-24 12:25:47
Is SamacsysN
Address bus width
Bus compatibilityPCI; SMBUS
External data bus width
JESD-30 codeS-PBGA-B144
JESD-609 codee1
length13 mm
Humidity sensitivity level3
Number of terminals144
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Encapsulate equivalent codeBGA144,12X12,40
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)260
power supply1,3.3 V
Certification statusNot Qualified
Maximum seat height1.5 mm
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width13 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
Base Number Matches1
4-Lane 4-Port
PCI Express® Switch
®
89HPES4T4
Data Sheet
The 89HPES4T4 is a member of IDT’s PRECISE™ family of PCI
Express switching solutions. The PES4T4 is a 4-lane, 4-port peripheral
chip that performs PCI Express Base switching. It provides connectivity
and switching functions between a PCI Express upstream port and up to
four downstream ports and supports switching between downstream
ports.
Device Overview
Features
High Performance PCI Express Switch
– Four 2.5 Gbps PCI Express lanes
– Four switch ports
– x1 Upstream port
– Three x1 Downstream ports
– Low latency cut-through switch architecture
– Support for Max payload sizes up to 256 bytes
– One virtual channel
– Eight traffic classes
– PCI Express Base Specification Revision 1.1 compliant
Flexible Architecture with Numerous Configuration Options
– Automatic lane reversal on all ports
– Automatic polarity inversion on all lanes
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Bus locking
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates four 2.5 Gbps embedded SerDes with 8B/10B
encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
– Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
– Supports ECRC and Advanced Error Reporting
– Supports PCI Express Native Hot-Plug, Hot-Swap capable I/O
– Compatible with Hot-Plug I/O expanders used on PC mother-
boards
Power Management
– Utilizes advanced low-power design techniques to achieve low
typical power consumption
– Supports PCI Power Management Interface specification (PCI-
PM 1.2)
– Unused SerDes are disabled.
– Supports Advanced Configuration and Power Interface Speci-
fication, Revision 2.0 (ACPI) supporting active link state
Testability and Debug Features
– Built in Pseudo-Random Bit Stream (PRBS) generator
– Numerous SerDes test modes
– Ability to bypass link training and force any link into any mode
– Provides statistics and performance counters
Block Diagram
4-Port Switch Core / 4 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
SerDes
SerDes
SerDes
SerDes
(Port 0)
(Port 2)
(Port 3)
(Port 4)
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 30
June 12, 2014

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89HPES4T4ZBBCGI8 89HPES4T4ZBNQG 89HPES4T4ZBNQG8 89HPES4T4ZBBC 89HPES4T4ZBBCI 89HPES4T4ZBBC8 89HPES4T4ZBBCG 89HPES4T4BCGI
Description CABGA-144, Reel VFQFPN-132, Tray VFQFPN-132, Reel CABGA-144, Tray CABGA-144, Tray CABGA-144, Reel CABGA-144, Tray CABGA-144, Tray
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
Is it lead-free? Lead free Lead free Lead free Contains lead Contains lead Contains lead Lead free Lead free
Is it Rohs certified? conform to conform to conform to incompatible incompatible incompatible conform to conform to
Parts packaging code CABGA VFQFPN VFQFPN CABGA CABGA CABGA CABGA CABGA
Contacts 144 132 132 144 144 144 144 144
Manufacturer packaging code BCG144 NQG132 NQG132 BC144 BC144 BC144 BCG144 BCG144
Reach Compliance Code compliant compliant compliant not_compliant not_compliant not_compliant compliant compliant
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) - - - IDT (Integrated Device Technology) IDT (Integrated Device Technology)
package instruction LBGA, BGA144,12X12,40 QFN-132 QFN-132 CABGA-144 CABGA-144 CABGA-144 LBGA, BGA144,12X12,40 -
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 -
Bus compatibility PCI; SMBUS PCI PCI; SMBUS PCI PCI PCI; SMBUS PCI -
JESD-30 code S-PBGA-B144 S-XQCC-N132 S-XQCC-N132 S-PBGA-B144 S-PBGA-B144 S-PBGA-B144 S-PBGA-B144 -
JESD-609 code e1 e3 e3 e0 e0 e0 e1 -
length 13 mm 10 mm 10 mm 13 mm 13 mm 13 mm 13 mm -
Humidity sensitivity level 3 3 3 3 3 3 3 -
Number of terminals 144 132 132 144 144 144 144 -
Maximum operating temperature 85 °C 70 °C 70 °C 70 °C 85 °C 70 °C 70 °C -
Package body material PLASTIC/EPOXY UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code LBGA HVQCCN HVQCCN LBGA LBGA LBGA LBGA -
Encapsulate equivalent code BGA144,12X12,40 LGA132,20X20,20 SLGA132,18X18,20 BGA144,12X12,40 BGA144,12X12,40 BGA144,12X12,40 BGA144,12X12,40 -
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE -
Package form GRID ARRAY, LOW PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE -
Peak Reflow Temperature (Celsius) 260 260 260 225 225 225 260 -
power supply 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V -
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
Maximum seat height 1.5 mm 0.9 mm 0.9 mm 1.5 mm 1.5 mm 1.5 mm 1.5 mm -
Maximum supply voltage 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V -
Minimum supply voltage 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V -
Nominal supply voltage 1 V 1 V 1 V 1 V 1 V 1 V 1 V -
surface mount YES YES YES YES YES YES YES -
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS -
Temperature level INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL -
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Matte Tin (Sn) Matte Tin (Sn) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu) -
Terminal form BALL NO LEAD NO LEAD BALL BALL BALL BALL -
Terminal pitch 1 mm 0.65 mm 0.65 mm 1 mm 1 mm 1 mm 1 mm -
Terminal location BOTTOM QUAD QUAD BOTTOM BOTTOM BOTTOM BOTTOM -
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 20 20 NOT SPECIFIED 30 -
width 13 mm 10 mm 10 mm 13 mm 13 mm 13 mm 13 mm -
Base Number Matches 1 1 1 1 1 1 1 -
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