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89HPES4T4BCGI

Description
CABGA-144, Tray
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size529KB,31 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance  
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89HPES4T4BCGI Overview

CABGA-144, Tray

89HPES4T4BCGI Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeCABGA
Contacts144
Manufacturer packaging codeBCG144
Reach Compliance Codecompliant
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
4-Lane 4-Port
PCI Express® Switch
®
89HPES4T4
Data Sheet
The 89HPES4T4 is a member of IDT’s PRECISE™ family of PCI
Express switching solutions. The PES4T4 is a 4-lane, 4-port peripheral
chip that performs PCI Express Base switching. It provides connectivity
and switching functions between a PCI Express upstream port and up to
four downstream ports and supports switching between downstream
ports.
Device Overview
Features
High Performance PCI Express Switch
– Four 2.5 Gbps PCI Express lanes
– Four switch ports
– x1 Upstream port
– Three x1 Downstream ports
– Low latency cut-through switch architecture
– Support for Max payload sizes up to 256 bytes
– One virtual channel
– Eight traffic classes
– PCI Express Base Specification Revision 1.1 compliant
Flexible Architecture with Numerous Configuration Options
– Automatic lane reversal on all ports
– Automatic polarity inversion on all lanes
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Bus locking
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates four 2.5 Gbps embedded SerDes with 8B/10B
encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
– Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
– Supports ECRC and Advanced Error Reporting
– Supports PCI Express Native Hot-Plug, Hot-Swap capable I/O
– Compatible with Hot-Plug I/O expanders used on PC mother-
boards
Power Management
– Utilizes advanced low-power design techniques to achieve low
typical power consumption
– Supports PCI Power Management Interface specification (PCI-
PM 1.2)
– Unused SerDes are disabled.
– Supports Advanced Configuration and Power Interface Speci-
fication, Revision 2.0 (ACPI) supporting active link state
Testability and Debug Features
– Built in Pseudo-Random Bit Stream (PRBS) generator
– Numerous SerDes test modes
– Ability to bypass link training and force any link into any mode
– Provides statistics and performance counters
Block Diagram
4-Port Switch Core / 4 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
SerDes
SerDes
SerDes
SerDes
(Port 0)
(Port 2)
(Port 3)
(Port 4)
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 30
June 12, 2014

89HPES4T4BCGI Related Products

89HPES4T4BCGI 89HPES4T4ZBNQG 89HPES4T4ZBNQG8 89HPES4T4ZBBCGI8 89HPES4T4ZBBC 89HPES4T4ZBBCI 89HPES4T4ZBBC8 89HPES4T4ZBBCG
Description CABGA-144, Tray VFQFPN-132, Tray VFQFPN-132, Reel CABGA-144, Reel CABGA-144, Tray CABGA-144, Tray CABGA-144, Reel CABGA-144, Tray
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
Is it lead-free? Lead free Lead free Lead free Lead free Contains lead Contains lead Contains lead Lead free
Is it Rohs certified? conform to conform to conform to conform to incompatible incompatible incompatible conform to
Parts packaging code CABGA VFQFPN VFQFPN CABGA CABGA CABGA CABGA CABGA
Contacts 144 132 132 144 144 144 144 144
Manufacturer packaging code BCG144 NQG132 NQG132 BCG144 BC144 BC144 BC144 BCG144
Reach Compliance Code compliant compliant compliant compliant not_compliant not_compliant not_compliant compliant
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) - - - IDT (Integrated Device Technology)
package instruction - QFN-132 QFN-132 LBGA, BGA144,12X12,40 CABGA-144 CABGA-144 CABGA-144 LBGA, BGA144,12X12,40
ECCN code - EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Bus compatibility - PCI PCI; SMBUS PCI; SMBUS PCI PCI PCI; SMBUS PCI
JESD-30 code - S-XQCC-N132 S-XQCC-N132 S-PBGA-B144 S-PBGA-B144 S-PBGA-B144 S-PBGA-B144 S-PBGA-B144
JESD-609 code - e3 e3 e1 e0 e0 e0 e1
length - 10 mm 10 mm 13 mm 13 mm 13 mm 13 mm 13 mm
Humidity sensitivity level - 3 3 3 3 3 3 3
Number of terminals - 132 132 144 144 144 144 144
Maximum operating temperature - 70 °C 70 °C 85 °C 70 °C 85 °C 70 °C 70 °C
Package body material - UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - HVQCCN HVQCCN LBGA LBGA LBGA LBGA LBGA
Encapsulate equivalent code - LGA132,20X20,20 SLGA132,18X18,20 BGA144,12X12,40 BGA144,12X12,40 BGA144,12X12,40 BGA144,12X12,40 BGA144,12X12,40
Package shape - SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form - CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius) - 260 260 260 225 225 225 260
power supply - 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height - 0.9 mm 0.9 mm 1.5 mm 1.5 mm 1.5 mm 1.5 mm 1.5 mm
Maximum supply voltage - 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V
Minimum supply voltage - 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V
Nominal supply voltage - 1 V 1 V 1 V 1 V 1 V 1 V 1 V
surface mount - YES YES YES YES YES YES YES
technology - CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level - COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL
Terminal surface - Matte Tin (Sn) Matte Tin (Sn) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form - NO LEAD NO LEAD BALL BALL BALL BALL BALL
Terminal pitch - 0.65 mm 0.65 mm 1 mm 1 mm 1 mm 1 mm 1 mm
Terminal location - QUAD QUAD BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 20 20 NOT SPECIFIED 30
width - 10 mm 10 mm 13 mm 13 mm 13 mm 13 mm 13 mm
Base Number Matches - 1 1 1 1 1 1 1
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