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89HPES5T5ZBBCG8

Description
CABGA-196, Reel
CategoryMicrocontrollers and processors   
File Size438KB,29 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance  
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89HPES5T5ZBBCG8 Overview

CABGA-196, Reel

89HPES5T5ZBBCG8 Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeCABGA
package instructionLBGA, BGA196,14X14,40
Contacts196
Manufacturer packaging codeBCG196
Reach Compliance Codecompliant
ECCN codeEAR99
Samacsys Confidence3
Samacsys StatusReleased
Samacsys PartID11130464
Samacsys Pin Count196
Samacsys Part CategoryIntegrated Circuit
Samacsys Package CategoryBGA
Samacsys Footprint NameBCG196
Samacsys Released Date2020-01-31 12:12:20
Is SamacsysN
Address bus width
Bus compatibilityPCI; SMBUS
maximum clock frequency125 MHz
Maximum data transfer rate2500 MBps
External data bus width
JESD-30 codeS-PBGA-B196
JESD-609 codee1
length15 mm
Humidity sensitivity level3
Number of terminals196
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Encapsulate equivalent codeBGA196,14X14,40
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)260
power supply1,3.3 V
Certification statusNot Qualified
Maximum seat height1.5 mm
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width15 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
Base Number Matches1
5-Lane 5-Port PCI Express®
Switch
®
89PES5T5
Data Sheet
The 89HPES5T5 is a member of IDT’s PRECISE™ family of PCI
Express switching solutions. The PES5T5 is an 5-lane, 5-port peripheral
chip that performs PCI Express Base switching. It provides connectivity
and switching functions between a PCI Express upstream port and up to
four downstream ports and supports switching between downstream
ports.
Device Overview
u
u
Features
u
u
u
High Performance PCI Express Switch
– Five 2.5Gbps PCI Express lanes
– Five switch ports
– Upstream port is x1
– Downstream ports are x1
– Low-latency cut-through switch architecture
– Support for Max Payload Sizes up to 256 bytes
– One virtual channel
– Eight traffic classes
– PCI Express Base Specification Revision 1.1 compliant
Flexible Architecture with Numerous Configuration Options
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Bus locking
u
u
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates five 2.5 Gbps embedded SerDes with 8B/10B
encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
– Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
– Supports ECRC and Advanced Error Reporting
– Supports PCI Express Native Hot-Plug, Hot-Swap capable I/O
– Compatible with Hot-Plug I/O expanders used on PC mother-
boards
Power Management
– Utilizes advanced low-power design techniques to achieve low
typical power consumption
– Supports PCI Power Management Interface specification (PCI-
PM 1.2)
– Unused SerDes are disabled.
– Supports Advanced Configuration and Power Interface Speci-
fication, Revision 2.0 (ACPI) supporting active link state
Testability and Debug Features
– Built in Pseudo-Random Bit Stream (PRBS) generator
– Numerous SerDes test modes
– Ability to read and write any internal register via the SMBus
– Ability to bypass link training and force any link into any mode
– Provides statistics and performance counters
Block Diagram
5-Port Switch Core / 5 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
SerDes
SerDes
SerDes
SerDes
SerDes
(Port 0)
(Port 2)
(Port 3)
Figure 1 Internal Block Diagram
(Port 4)
(Port 5)
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 28
June 18, 2014

89HPES5T5ZBBCG8 Related Products

89HPES5T5ZBBCG8 89HPES5T5ZBBCGI 89HPES5T5ZBBCG 89HPES5T5ZBBCGI8 89HPES5T5ZBBC 89HPES5T5ZBBCI 89HPES5T5ZBBC8 89HPES5T5ZBBCI8
Description CABGA-196, Reel CABGA-196, Tray CABGA-196, Tray CABGA-196, Reel CABGA-196, Tray CABGA-196, Tray CABGA-196, Reel CABGA-196, Reel
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
Is it lead-free? Lead free Lead free Lead free Lead free Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? conform to conform to conform to conform to incompatible incompatible incompatible incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code CABGA CABGA CABGA CABGA CABGA CABGA CABGA CABGA
package instruction LBGA, BGA196,14X14,40 CABGA-196 CABGA-196 LBGA, BGA196,14X14,40 CABGA-196 CABGA-196 CABGA-196 CABGA-196
Contacts 196 196 196 196 196 196 196 196
Manufacturer packaging code BCG196 BCG196 BCG196 BCG196 BC196 BC196 BC196 BC196
Reach Compliance Code compliant compliant compliant compliant not_compliant not_compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Is Samacsys N N N N N N N N
Bus compatibility PCI; SMBUS PCI PCI PCI; SMBUS PCI PCI PCI; SMBUS PCI; SMBUS
maximum clock frequency 125 MHz 125 MHz 125 MHz 125 MHz 125 MHz 125 MHz 125 MHz 125 MHz
JESD-30 code S-PBGA-B196 S-PBGA-B196 S-PBGA-B196 S-PBGA-B196 S-PBGA-B196 S-PBGA-B196 S-PBGA-B196 S-PBGA-B196
JESD-609 code e1 e1 e1 e1 e0 e0 e0 e0
length 15 mm 15 mm 15 mm 15 mm 15 mm 15 mm 15 mm 15 mm
Humidity sensitivity level 3 3 3 3 3 3 3 3
Number of terminals 196 196 196 196 196 196 196 196
Maximum operating temperature 70 °C 85 °C 70 °C 85 °C 70 °C 85 °C 70 °C 85 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA LBGA LBGA LBGA LBGA LBGA LBGA LBGA
Encapsulate equivalent code BGA196,14X14,40 BGA196,14X14,40 BGA196,14X14,40 BGA196,14X14,40 BGA196,14X14,40 BGA196,14X14,40 BGA196,14X14,40 BGA196,14X14,40
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius) 260 260 260 260 225 225 225 225
power supply 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.5 mm 1.5 mm 1.5 mm 1.5 mm 1.5 mm 1.5 mm 1.5 mm 1.5 mm
Maximum supply voltage 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V
Minimum supply voltage 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V
Nominal supply voltage 1 V 1 V 1 V 1 V 1 V 1 V 1 V 1 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal form BALL BALL BALL BALL BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED 30 30 NOT SPECIFIED 20 20 NOT SPECIFIED NOT SPECIFIED
width 15 mm 15 mm 15 mm 15 mm 15 mm 15 mm 15 mm 15 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Base Number Matches 1 1 1 1 1 1 1 1
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