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TC74AC174F

Description
CMOS Digital Integrated Circuit Silicon Monolithic Hex D-Type Flip Flop with Clear
Categorylogic    logic   
File Size267KB,10 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
Download Datasheet Parametric Compare View All

TC74AC174F Overview

CMOS Digital Integrated Circuit Silicon Monolithic Hex D-Type Flip Flop with Clear

TC74AC174F Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerToshiba Semiconductor
Parts packaging codeSOIC
package instruction0.300 INCH, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOP-16
Contacts16
Reach Compliance Codeunknow
seriesAC
JESD-30 codeR-PDSO-G16
JESD-609 codee0
length10.3 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeD FLIP-FLOP
Maximum Frequency@Nom-Su60000000 Hz
MaximumI(ol)0.012 A
Number of digits6
Number of functions1
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP16,.3
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3/5 V
propagation delay (tpd)16.6 ns
Certification statusNot Qualified
Maximum seat height1.9 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Trigger typePOSITIVE EDGE
width5.3 mm
minfmax90 MHz
TC74AC174P/F/FN/FT
TOSHIBA CMOS Digital Integrated Circuit
Silicon Monolithic
TC74AC174P,TC74AC174F,TC74AC174FN,TC74AC174FT
Hex D-Type Flip Flop with Clear
The TC74AC174 is an advanced high speed CMOS HEX
D-TYPE FLIP FLOP fabricated with silicon gate and
double-layer metal wiring C
2
MOS technology.
It achieves the high speed operation similar to equivalent
Bipolar Schottky TTL while maintaining the CMOS low power
dissipation.
Information signals applied to D inputs are transferred to the
Q output on the positive going edge of the clock pulse.
When the
CLR
input is held low, the Q output are in the low
logic level independent of the other inputs.
All inputs are equipped with protection circuits against static
discharge or transient excess voltage.
Note: xxxFN (JEDEC SOP) is not available in
Japan.
TC74AC174P
TC74AC174F
Features
High speed: f
max
= 180 MHz (typ.) at V
CC
= 5 V
Low power dissipation: I
CC
= 8
μA
(max) at Ta = 25°C
High noise immunity: V
NIH
= V
NIL
= 28% V
CC
(min)
Symmetrical output impedance: |I
OH
| = I
OL
= 24 mA (min)
Capability of driving 50
Ω
transmission lines.
Balanced propagation delays: t
pLH
t
pHL
Wide operating voltage range: V
CC (opr)
= 2 to 5.5 V
Pin and function compatible with 74F174
TC74AC174FN
TC74AC174FT
Weight
DIP16-P-300-2.54A
SOP16-P-300-1.27A
SOL16-P-150-1.27
TSSOP16-P-0044-0.65A
: 1.00 g (typ.)
: 0.18 g (typ.)
: 0.13 g (typ.)
: 0.06 g (typ.)
1
2007-10-01

TC74AC174F Related Products

TC74AC174F TC74AC174FN TC74AC174P TC74AC174P_07 TC74AC174FT
Description CMOS Digital Integrated Circuit Silicon Monolithic Hex D-Type Flip Flop with Clear CMOS Digital Integrated Circuit Silicon Monolithic Hex D-Type Flip Flop with Clear CMOS Digital Integrated Circuit Silicon Monolithic Hex D-Type Flip Flop with Clear CMOS Digital Integrated Circuit Silicon Monolithic Hex D-Type Flip Flop with Clear CMOS Digital Integrated Circuit Silicon Monolithic Hex D-Type Flip Flop with Clear
Is it Rohs certified? incompatible conform to conform to - conform to
Maker Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor - Toshiba Semiconductor
Parts packaging code SOIC SOIC DIP - TSSOP
package instruction 0.300 INCH, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOP-16 SOP, SOP16,.25 DIP, DIP16,.3 - TSSOP, TSSOP16,.25
Contacts 16 16 16 - 16
Reach Compliance Code unknow unknow unknow - unknow
series AC AC AC - AC
JESD-30 code R-PDSO-G16 R-PDSO-G16 R-PDIP-T16 - R-PDSO-G16
length 10.3 mm 9.9 mm 19.25 mm - 5 mm
Load capacitance (CL) 50 pF 50 pF 50 pF - 50 pF
Logic integrated circuit type D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP - D FLIP-FLOP
Maximum Frequency@Nom-Su 60000000 Hz 60000000 Hz 60000000 Hz - 60000000 Hz
MaximumI(ol) 0.012 A 0.012 A 0.012 A - 0.012 A
Number of digits 6 6 6 - 6
Number of functions 1 1 1 - 1
Number of terminals 16 16 16 - 16
Maximum operating temperature 85 °C 85 °C 85 °C - 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C - -40 °C
Output polarity TRUE TRUE TRUE - TRUE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code SOP SOP DIP - TSSOP
Encapsulate equivalent code SOP16,.3 SOP16,.25 DIP16,.3 - TSSOP16,.25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE IN-LINE - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED
power supply 3.3/5 V 3.3/5 V 3.3/5 V - 3.3/5 V
propagation delay (tpd) 16.6 ns 16.6 ns 16.6 ns - 16.6 ns
Certification status Not Qualified Not Qualified Not Qualified - Not Qualified
Maximum seat height 1.9 mm 1.75 mm 4.45 mm - 1.2 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V - 5.5 V
Minimum supply voltage (Vsup) 2 V 2 V 2 V - 2 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V - 3.3 V
surface mount YES YES NO - YES
technology CMOS CMOS CMOS - CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL - INDUSTRIAL
Terminal form GULL WING GULL WING THROUGH-HOLE - GULL WING
Terminal pitch 1.27 mm 1.27 mm 2.54 mm - 0.65 mm
Terminal location DUAL DUAL DUAL - DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED
Trigger type POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE - POSITIVE EDGE
width 5.3 mm 3.9 mm 7.62 mm - 4.4 mm
minfmax 90 MHz 90 MHz 90 MHz - 90 MHz
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