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TC74AC174P_07

Description
CMOS Digital Integrated Circuit Silicon Monolithic Hex D-Type Flip Flop with Clear
File Size267KB,10 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
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TC74AC174P_07 Overview

CMOS Digital Integrated Circuit Silicon Monolithic Hex D-Type Flip Flop with Clear

TC74AC174P/F/FN/FT
TOSHIBA CMOS Digital Integrated Circuit
Silicon Monolithic
TC74AC174P,TC74AC174F,TC74AC174FN,TC74AC174FT
Hex D-Type Flip Flop with Clear
The TC74AC174 is an advanced high speed CMOS HEX
D-TYPE FLIP FLOP fabricated with silicon gate and
double-layer metal wiring C
2
MOS technology.
It achieves the high speed operation similar to equivalent
Bipolar Schottky TTL while maintaining the CMOS low power
dissipation.
Information signals applied to D inputs are transferred to the
Q output on the positive going edge of the clock pulse.
When the
CLR
input is held low, the Q output are in the low
logic level independent of the other inputs.
All inputs are equipped with protection circuits against static
discharge or transient excess voltage.
Note: xxxFN (JEDEC SOP) is not available in
Japan.
TC74AC174P
TC74AC174F
Features
High speed: f
max
= 180 MHz (typ.) at V
CC
= 5 V
Low power dissipation: I
CC
= 8
μA
(max) at Ta = 25°C
High noise immunity: V
NIH
= V
NIL
= 28% V
CC
(min)
Symmetrical output impedance: |I
OH
| = I
OL
= 24 mA (min)
Capability of driving 50
Ω
transmission lines.
Balanced propagation delays: t
pLH
t
pHL
Wide operating voltage range: V
CC (opr)
= 2 to 5.5 V
Pin and function compatible with 74F174
TC74AC174FN
TC74AC174FT
Weight
DIP16-P-300-2.54A
SOP16-P-300-1.27A
SOL16-P-150-1.27
TSSOP16-P-0044-0.65A
: 1.00 g (typ.)
: 0.18 g (typ.)
: 0.13 g (typ.)
: 0.06 g (typ.)
1
2007-10-01

TC74AC174P_07 Related Products

TC74AC174P_07 TC74AC174F TC74AC174FN TC74AC174P TC74AC174FT
Description CMOS Digital Integrated Circuit Silicon Monolithic Hex D-Type Flip Flop with Clear CMOS Digital Integrated Circuit Silicon Monolithic Hex D-Type Flip Flop with Clear CMOS Digital Integrated Circuit Silicon Monolithic Hex D-Type Flip Flop with Clear CMOS Digital Integrated Circuit Silicon Monolithic Hex D-Type Flip Flop with Clear CMOS Digital Integrated Circuit Silicon Monolithic Hex D-Type Flip Flop with Clear
Is it Rohs certified? - incompatible conform to conform to conform to
Maker - Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor
Parts packaging code - SOIC SOIC DIP TSSOP
package instruction - 0.300 INCH, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOP-16 SOP, SOP16,.25 DIP, DIP16,.3 TSSOP, TSSOP16,.25
Contacts - 16 16 16 16
Reach Compliance Code - unknow unknow unknow unknow
series - AC AC AC AC
JESD-30 code - R-PDSO-G16 R-PDSO-G16 R-PDIP-T16 R-PDSO-G16
length - 10.3 mm 9.9 mm 19.25 mm 5 mm
Load capacitance (CL) - 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type - D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP
Maximum Frequency@Nom-Su - 60000000 Hz 60000000 Hz 60000000 Hz 60000000 Hz
MaximumI(ol) - 0.012 A 0.012 A 0.012 A 0.012 A
Number of digits - 6 6 6 6
Number of functions - 1 1 1 1
Number of terminals - 16 16 16 16
Maximum operating temperature - 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature - -40 °C -40 °C -40 °C -40 °C
Output polarity - TRUE TRUE TRUE TRUE
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - SOP SOP DIP TSSOP
Encapsulate equivalent code - SOP16,.3 SOP16,.25 DIP16,.3 TSSOP16,.25
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form - SMALL OUTLINE SMALL OUTLINE IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply - 3.3/5 V 3.3/5 V 3.3/5 V 3.3/5 V
propagation delay (tpd) - 16.6 ns 16.6 ns 16.6 ns 16.6 ns
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height - 1.9 mm 1.75 mm 4.45 mm 1.2 mm
Maximum supply voltage (Vsup) - 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) - 2 V 2 V 2 V 2 V
Nominal supply voltage (Vsup) - 3.3 V 3.3 V 3.3 V 3.3 V
surface mount - YES YES NO YES
technology - CMOS CMOS CMOS CMOS
Temperature level - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form - GULL WING GULL WING THROUGH-HOLE GULL WING
Terminal pitch - 1.27 mm 1.27 mm 2.54 mm 0.65 mm
Terminal location - DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Trigger type - POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE
width - 5.3 mm 3.9 mm 7.62 mm 4.4 mm
minfmax - 90 MHz 90 MHz 90 MHz 90 MHz

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