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TC74HC365AP

Description
Hex Bus Buffer
Categorylogic    logic   
File Size246KB,7 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
Environmental Compliance
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TC74HC365AP Overview

Hex Bus Buffer

TC74HC365AP Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerToshiba Semiconductor
Parts packaging codeDIP
package instruction0.300 INCH, 2.54 MM PITCH, LEAD FREE, PLASTIC, DIP-16
Contacts16
Reach Compliance Codeunknown
Control typeENABLE LOW
seriesHC/UH
JESD-30 codeR-PDIP-T16
length19.25 mm
Load capacitance (CL)150 pF
Logic integrated circuit typeBUS DRIVER
MaximumI(ol)0.006 A
Number of digits6
Number of functions1
Number of ports2
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2/6 V
Prop。Delay @ Nom-Sup23 ns
propagation delay (tpd)165 ns
Certification statusNot Qualified
Maximum seat height4.45 mm
Maximum supply voltage (Vsup)6 V
Minimum supply voltage (Vsup)2 V
Nominal supply voltage (Vsup)4.5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
Base Number Matches1
TC74HC365,366AP/AF
TOSHIBA CMOS Digital Integrated Circuit
Silicon Monolithic
TC74HC365AP,TC74HC365AF,TC74HC366AP,TC74HC366AF
Hex Bus Buffer
TC74HC365AP/AF
TC74HC366AP/AF
Non-Inverted (3-state)
Inverted (3-state)
TC74HC365AP, TC74HC366AP
The TC74HC365A and TC74HC366A are high speed CMOS
3-STATE BUFFERs fabricated with silicon gate C
2
MOS
technology.
They achieve the high speed operation similar to equivalent
LSTTL while maintaining the CMOS low power dissipation.
The TC74HC366A is an inverting type, while the TC74HC365A
is non-inverting.
All six buffers are controlled by the combination of two enable
inputs (
G1
and
G2
); the outputs of these buffers are enabled only
when both
G1
and
G2
inputs held low, and at the other
combinations, these outputs are disabled to the high impedance
state.
All inputs are equipped with protection circuits against static
discharge or transient excess voltage.
TC74HC365AF, TC74HC366AF
Features
High speed: t
pd
=
9 ns (typ.) at V
CC
=
5 V
Low power dissipation: I
CC
=
4
μA
(max) at Ta
=
25°C
High noise immunity: V
NIH
=
V
NIL
=
28% V
CC
(min)
Output drive capability: 15 LSTTL loads
Symmetrical output impedance: |I
OH
|
=
I
OL
=
6 mA (min)
Balanced propagation delays: t
pLH
t
pHL
Wide operating voltage range: V
CC
(opr)
=
2 to 6 V
Pin and function compatible with 74LS365/366
Weight
DIP16-P-300-2.54A
SOP16-P-300-1.27A
: 1.00 g (typ.)
: 0.18 g (typ.)
Pin Assignment
TC74HC365A
TC74HC366A
1
2007-10-01

TC74HC365AP Related Products

TC74HC365AP TC74HC365AF TC74HC366AP TC74HC365AP_07 TC74HC366AF
Description Hex Bus Buffer Hex Bus Buffer Hex Bus Buffer Hex Bus Buffer Hex Bus Buffer
Is it Rohs certified? conform to conform to conform to - incompatible
Maker Toshiba Semiconductor Toshiba Semiconductor - - Toshiba Semiconductor
Parts packaging code DIP SOIC DIP - SOIC
package instruction 0.300 INCH, 2.54 MM PITCH, LEAD FREE, PLASTIC, DIP-16 0.300 INCH, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOP-16 DIP, DIP16,.3 - SOP, SOP16,.3
Contacts 16 16 16 - 16
Reach Compliance Code unknown unknown unknow - unknow
Control type ENABLE LOW ENABLE LOW ENABLE LOW - ENABLE LOW
series HC/UH HC/UH HC/UH - HC/UH
JESD-30 code R-PDIP-T16 R-PDSO-G16 R-PDIP-T16 - R-PDSO-G16
length 19.25 mm 10.3 mm 19.25 mm - 10.3 mm
Load capacitance (CL) 150 pF 150 pF 150 pF - 150 pF
Logic integrated circuit type BUS DRIVER BUS DRIVER BUS DRIVER - BUS DRIVER
MaximumI(ol) 0.006 A 0.006 A 0.006 A - 0.006 A
Number of digits 6 6 6 - 6
Number of functions 1 1 1 - 1
Number of ports 2 2 2 - 2
Number of terminals 16 16 16 - 16
Maximum operating temperature 85 °C 85 °C 85 °C - 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C - -40 °C
Output characteristics 3-STATE 3-STATE 3-STATE - 3-STATE
Output polarity TRUE TRUE INVERTED - INVERTED
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code DIP SOP DIP - SOP
Encapsulate equivalent code DIP16,.3 SOP16,.3 DIP16,.3 - SOP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR
Package form IN-LINE SMALL OUTLINE IN-LINE - SMALL OUTLINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - -
power supply 2/6 V 2/6 V 2/6 V - 2/6 V
propagation delay (tpd) 165 ns 165 ns 165 ns - 165 ns
Certification status Not Qualified Not Qualified Not Qualified - Not Qualified
Maximum seat height 4.45 mm 1.9 mm 4.45 mm - 1.9 mm
Maximum supply voltage (Vsup) 6 V 6 V 6 V - 6 V
Minimum supply voltage (Vsup) 2 V 2 V 2 V - 2 V
Nominal supply voltage (Vsup) 4.5 V 4.5 V 4.5 V - 4.5 V
surface mount NO YES NO - YES
technology CMOS CMOS CMOS - CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL - INDUSTRIAL
Terminal form THROUGH-HOLE GULL WING THROUGH-HOLE - GULL WING
Terminal pitch 2.54 mm 1.27 mm 2.54 mm - 1.27 mm
Terminal location DUAL DUAL DUAL - DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - -
width 7.62 mm 5.3 mm 7.62 mm - 5.3 mm
Base Number Matches 1 1 1 - -
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