TLGU23TP(F),TLPGU23TP(F)
TOSHIBA
InGaAlP
LED
TLGU23TP(F),TLPGU23TP(F)
○
Panel Circuit Indicator
•
•
•
•
•
•
Lead(Pb)-free products (lead: Sn-Ag-Cu)
5mm package
InGaAℓP
Transparent lens.
Colors: Green, Pure green
Applications: Various types of information panels, indicators for
amusement equipment and panel backlighting
illumination sources.
Stopper lead type is also available.
TLGU23T(F), TLPGU23T(F)
Unit:
mm
•
Lineup
Product Name
TLGU23TP(F)
TLPGU23TP(F)
Color
Green
Pure green
Material
InGaAlP
JEDEC
JEITA
TOSHIBA
―
―
4-5AL2
Weight: 0.31 g (Typ.)
Absolute Maximum Ratings
(Ta
=
25°C)
Product Name
TLGU23TP(F)
TLPGU23TP(F)
Forward Current
I
F
(mA)
30
30
Reverse Voltage
V
R
(V)
4
4
Power Dissipation
P
D
(mW)
72
72
Operating
Temperature
T
opr
(°C)
−40~100
Storage
Temperature
T
stg
(°C)
−40~120
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
1
2007-10-01
TLGU23TP(F),TLPGU23TP(F)
Electrical and Optical Characteristics
(Ta
=
25°C)
Product Name
Typ. Emission Wavelength
λ
d
TLGU23TP(F)
TLPGU23TP(F)
Unit
571
558
λ
P
(574)
(562)
nm
Δλ
17
14
I
F
20
20
mA
Luminous Intensity
I
V
Min
1530
476
Typ.
4000
1600
mcd
I
F
20
20
mA
Forward Voltage
V
F
Typ.
2.1
2.1
V
Max
2.4
2.4
I
F
20
20
mA
Reverse Current
I
R
Max
50
50
μA
V
R
4
4
V
Precautions
Please be careful of the following:
•
Soldering temperature: 260°C max, soldering time: 3 s max
(soldering portion of lead: up to 1.6 mm from the body of the device)
•
If the lead is formed, the lead should be formed up to 1.6 mm from the body of the device without forming stress
to the resin. Soldering should be performed after lead forming.
•
This visible LED lamp also emits some IR light.
If a photo detector is located near the LED lamp, please ensure that it will not be affected by this IR light.
2
2007-10-01
TLGU23TP(F),TLPGU23TP(F)
RESTRICTIONS ON PRODUCT USE
•
The information contained herein is subject to change without notice.
20070701-EN
•
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
•
The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
•
The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
•
The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
•
GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break,
cut, crush or dissolve chemically.
•
Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
5
2007-10-01
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
