ZSSC3123 TSSOP14 — Temperature range: -40°C to +125°C – Lead-free package
ZSSC3123 TSSOP14 — Temperature range: -40°C to +85°C – Lead-free package
Package
Tested dice on un-sawn wafer
Tested dice on un-sawn wafer
Tested dice on frame
Tested dice on frame
Tube: add “T” to code; reel: add “R”
Tube: add “T” to code; reel: add “R”
Kit
ZSSC3123 SSC Evaluation Kit: Communication Board, SSC Board, Sensor Replacement
Board, USB Cable, 5 IC Samples (software can be downloaded from
www.IDT.com/ZSSC3123)
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specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The
information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an
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All contents of this document are copyright of Integrated
List of Figures ............................................................................................................................................................. 4
List of Tables .............................................................................................................................................................. 5
1 IC Characteristics ................................................................................................................................................ 7
1.1
Absolute Maximum Ratings .......................................................................................................................... 7
Signal Flow and Block Diagram.................................................................................................................. 14
2.2
Analog Front End ........................................................................................................................................ 14
Temperature Measurement ................................................................................................................. 19
2.3
Digital Core ................................................................................................................................................. 21
3 Normal Operation Mode .................................................................................................................................... 21
Status and Diagnostics ............................................................................................................................... 29
3.4.1
EEPROM Error Detection and Correction............................................................................................ 30
I C™ and SPI ............................................................................................................................................. 31
2
3.6.1
I C™ Features and Timing................................................................................................................... 31
3.6.2
SPI Features and Timing ..................................................................................................................... 32
2
3.6.3
I C™ and SPI Commands ................................................................................................................... 33
3.6.4
Data Fetch (DF) ................................................................................................................................... 34
Command Format ....................................................................................................................................... 41
Capacitance Analog Front End Configuration (C_Config, EEPROM Word 06
HEX
) .............................. 48
5.1.3
Temperature Analog Front End Configuration (T_Config, EEPROM Word 11
HEX
) ............................. 49
5.1.4
Customer Configuration Register (Cust_Config, EEPROM Word 1C
HEX
) ........................................... 50
6 Calibration and Signal Conditioning Math ......................................................................................................... 51
6.1
Capacitance Signal Conditioning ............................................................................................................... 51
6.2
Temperature Signal Compensation ............................................................................................................ 53
6.3
Limits on Coefficient Ranges ...................................................................................................................... 53
13 Part Ordering Codes ......................................................................................................................................... 61
14 Related Documents ........................................................................................................................................... 61
I C™ Measurement Packet Reads ...................................................................................................... 34
SPI Output Packet with Positive Edge Sampling................................................................................. 35
2
I C™ MR .............................................................................................................................................. 36
Time Periods between Capacitance Measurements and Temperature Measurements for Different
Mult, Resolution and Update Rates ..................................................................................................... 26
Status Table ......................................................................................................................................... 30