SILICON
MICROSTRUCTURES
INCORPORATED
•
HIGH SENSITIVITY, LOW-PRESSURE SILICON DIE
SM5103
Low-Pressure Die
DESCRIPTION
The SM5103 is a silicon micro-machined,
piezoresistive low pressure sensing chip.
These devices are available in full-scale
ranges from 0.3 to 3.0 psi and are ideal for
OEM and high volume applications.
Provided in die form, these sensors can be
mounted on ceramic or PC board substrates
as part of an OEM system. They also may
be packaged into proprietary or application-
specified sensor lines.
Die are probed, inked and diced, and
shipped on tape.
Custom pressure ranges available in high-
volume applications.
FEATURES
•
•
•
•
Low Pressure (from 0-0.3 to 0-3.0 PSI)
High Performance at Low Pressures
Constant Current or Constant Voltage
Drive
High Volume, Low Cost
High Millivolt Output
•
APPLICATIONS
•
•
•
•
•
Air Flow
Level Detection
HVAC
Instrumentation
Gas Analysis
Rev 1.2 8_02
2001-2002
Silicon Microstructures, Inc.
♦
1701 McCarthy Blvd.
♦
Milpitas, CA 95035 USA
Tel: 408-577-0100
♦
Fax: 408-577-0123
♦
Sales@Si-Micro.Com
♦
WWW.Si-Micro.Com
SM5103
CHARACTERISTICS FOR SM5103 -
SPECIFICATIONS
All parameters are measured at 5.000V supply at room temperature, unless otherwise specified.
Min.
Excitation Voltage
Excitation Current
Span (FS Range)
0.3 PSI
0.8 PSI
1.5 PSI
3.0 PSI
Offset
TC Span
TC Offset
TC Resistance
Linearity
Bridge Impedance
Proof Pressure
Burst Pressure
Operating Temperature
Storage Temperature
0
0
25
25
25
25
-75
-24
-7
24
-0.3
2.7
10X
15X
-40
-55
Typ.
5.0
1.5
50
50
50
50
0
-19
-1
27.5
+0.1
3.3
Max.
10.0
3.0
75
75
75
75
25
-15.5
+7
33
0.3
4.0
Units
V
mA
mV
mV
mV
mV
mV
%FS/100°C
%FS/100°C
%/100°C
%FS
kΩ
Rated FS
Rated FS
°C
°C
Notes
1
1
2
3
3
4
5
125
150
Notes:
1. Bridge may be driven with positive or negative excitation as long as Vsub is not connected. SMI does recommend connecting
the Vsub to the highest voltage in the bridge for added offset stability.
2. Measured at 5V constant voltage excitation.
3. Measured from 0 to 70 C
4.
Defined as best straight line; 0.3 PSI linearity is
+
0.5% FS (max).
5. Burst Pressure is the pressure where the part can survive the overpressure but may degrade over repeated cycles.
0.5
mm
+Vexc1
1.0
mm
Vsub
1.0
mm
Sig-
0.5
mm
3.15
mm
3.4
mm
Positive output for pressure
applied to the top (circuit) side of
the sensor
Die dimensions in mm
Pressure Ranges
ORDERING INFORMATION:
Model Number
SM5103 - 003 - G
Pressure
range
Pressure
Type
PSI
0.3
0.8
1.5
3.0
5103
003
008
015
030
Sig+
Sig-
+Vexc
0.5 mm
0.375 mm
0.375 mm
-Vexc
-Vexc1
+Vexc1
Gage only.
Custom ranges available
in high volumes
SM5103 Die (3.4X3.2 mm as sawn)
Covered under USA Mask-Copyright
See separate Application Notes for typical range of variation in Saw
dimensions.
Notice:
Silicon Microstructures, Inc. reserves the right to make changes to the product contained in this publication. Silicon Microstructures, Inc. assumes no responsibility for the use of any
circuits described herein, conveys no license under any patent or other right, and makes no representation that the circuits are free of patent infringement. While the information in this
publication has been checked, no responsibility, however, is assumed for inaccuracies.
Silicon Microstructures, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to
cause failure of a life-support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications.
Rev 1.2 8_02
2001-2002
Silicon Microstructures, Inc.
♦
1701 McCarthy Blvd.
♦
Milpitas, CA 95035 USA
Tel: 408-577-0100
♦
Fax: 408-577-0123
♦
Sales@Si-Micro.Com
♦
WWW.Si-Micro.Com
Domestic Chip Exchange
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