Operating Temperature Range ...........................-40°C to +85°C
GND, DACREF....................................-1V to (AV
DD3.3
+ 0.3V)
CLKP, CLKN to GND, DACREF..............-0.3V to (AV
CLK
+ 0.3V)
Junction Temperature ......................................................+150°C
A15/B15–A0/B0, XOR, SELIQ to
Storage Temperature Range .............................-60°C to +150°C
GND, DACREF .....................................-0.3V to (DV
DD3.3
+ 0.3V)
Lead Temperature (soldering, 10s) .................................+300°C
TORB,
DORI,
PD to GND, DACREF ....-0.3V to (DV
DD3.3
+ 0.3V)
Note 1:
Thermal resistors based on a multilayer board with 4 x 4 via array in exposed paddle area.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(AV
DD3.3
= DV
DD3.3
= AV
CLK
= 3.3V, AV
DD1.8
= DV
DD1.8
= 1.8V, GND = 0, f
CLK
= f
DAC
, external reference V
REFIO
= 1.25V, output load
50Ω double-terminated, transformer-coupled output, I
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Embedded System
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