Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
SCL, SDA, CLKIO,
RST
to DGND .........................-0.3V to +4.5V
ENOUT,
FLT
to DGND..............................................-0.3V to +6V
Thermal Resistance from Junction to Exposed Pad ......2.7°C/W
Operating Temperature .......................................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature.........................................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) (Note 1) .........................+260°C
PACKAGE THERMAL CHARACTERISTICS (Note 2)
24 TQFN-EP
Junction-to-Ambient Thermal Resistance (θ
JA
) ............36°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ................2.7°C/W
Note 2:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
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Microchip MCU
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