Technical Data Sheet
Fast Cure Thermally Conductive Adhesive
Description
8329TCF is a thermally conductive, fast-cure two-part epoxy adhesive. It is off-white, smooth, viscous,
thixotropic, and bonds well to a wide variety of substrates. It is also flame retardant and meets the UL
94V-0 standard. For a 1 mL quantity, a minimal service cure can be achieved in 15 minutes at room
temperature, and a full cure in 3 hours.
This product is used to bond heat sinks, LEDs and other heat-generating components in electronic
assemblies. It is suitable for use with dual-syringes, mix-tips and automatic dispensing systems.
8329TCF has been designed for maximum thermal conductivity with a high viscosity. For a lower
viscosity, use 8329TFF. For a longer working life, use 8329TCM or 8329TCS.
8329TCF
Features and Benefits
• Thermal conductivity of 1.0 W/(m·K)
• 1:1 mix ratio
• Working life: 4 minutes
• Set time: 15 minutes
• Cure time: 3 hours at room temperature or 15 minutes at 65 °C (149 °F)
• Flame retardant—meets UL 94V-0 standard
• Provides strong electrical insulation
• Low CTE prior Tg
• High tensile and compressive strength
• Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons
• Shelf life:
≥3
years
• RoHS 3 compliant
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 06 April 2018 / Ver. 2.00
Page 1
8329TCF
Usage Parameters
Properties
Working life @22 °C [72 °F]
Shelf life @22 °C [72 °F]
Set time @22 °C [72 °F]
Full cure @22 °C [72 °F]
Full cure @65 °C [149 °F]
Value
4 min
≥3
y
15 min
3h
15 min
Temperature Ranges
Properties
Constant service temperature
Maximum Intermittent temperature
a)
Storage temperature
Value
-40 to 150 °C [-40 to 302 °F]
175 °C [347 °F]
22 to 27 °C [72 to 81 °F]
a)
Temperature that can be withstood for short periods without sustaining damage.
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 06 April 2018 / Ver. 2.00
Page 2
8329TCF
Cured Properties
Physical Properties
Color
Density @25 °C [77 °F]
Hardness
Tensile strength
Young’s modulus
Compressive strength
Lap shear strength (stainless steel)
Lap shear strength (aluminum)
Lap shear strength (copper)
Lap shear strength (brass)
Lap shear strength (polycarbonate)
Lap shear strength (ABS)
Flammability
Method
Visual
ASTM D 1475
Shore D Durometer
ASTM D 638
ASTM D 638
ASTM D 695
ASTM D 1002
ASTM D 1002
ASTM D 1002
ASTM D 1002
ASTM D 1002
ASTM D 1002
UL 94
Value
a)
Off white
1.75 g/mL
82D
13 N/mm
2
[1 900 lb/in
2
]
1 700 N/mm
2
[250 000 lb/in
2
]
36 N/mm
2
[5 200 lb/in
2
]
11 N/mm
2
[1 600 lb/in
2
]
8.2 N/mm
2
[1 200 lb/in
2
]
11 N/mm
2
[1 600 lb/in
2
]
10 N/mm
2
[1 500 lb/in
2
]
2.6 N/mm
2
[380 lb/in
2
]
1.5 N/mm
2
[210 lb/in
2
]
Meets 94 V-0
Note: Specifications are for epoxy samples cured at 22 °C for 24 h and conditioned at ambient temperature
and humidity.
a)
N/mm
2
= mPa; lb/in
2
= psi
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 06 April 2018 / Ver. 2.00
Page 3
8329TCF
Cured Properties
Electrical Properties
Breakdown voltage @2.1 mm
Dielectric strength @2.1 mm
Breakdown voltage @3.175 mm [1/8"]
Dielectric strength @3.175 mm [1/8"]
Volume resistivity
Volume conductivity
Method
ASTM D 149
ASTM D 149
Reference fit
a)
Reference fit
a)
ASTM D 257
ASTM D 257
Value
35 300 V [35.3 kV]
412 V/mil [16.2 kV/mm]
42 700 V [42.7 kV]
342 V/mil [13.1 kV/mm]
3 x 10
12
Ω·cm
3.3 x 10
-13
S/cm
Thermal Properties
Glass transition temperature (T
g
)
CTE
b)
prior T
g
after T
g
Thermal conductivity @25 °C [77 °F]
@50 °C [222 °F]
@100 °C [212 °F]
Thermal diffusivity @25 °C [77 °F]
Specific heat capacity @25 °C [77 °F]
Method
ASTM E 3418
ASTM E 831
ASTM E 831
ASTM E 1461 92
ASTM E 1461 92
ASTM E 1461 92
ASTM E 1461 92
ASTM E 1461 92
Value
88 °C [175 °F]
23 ppm/°C [73 ppm/°F]
107 ppm/°C [225 ppm/°F]
1.0 W/(m·K)
1.0 W/(m·K)
0.9 W/(m·K)
0.4 mm
2
/s
1.3 J/(g·K)
Note: Specifications are for epoxy samples cured at 22 °C for 24 h and conditioned at ambient temperature
and humidity.
a)
To allow comparison between products, the dielectric strength was recalculated with the Tautscher
equation fitted to 5 experimental values and extrapolated to a standard thickness of 1/8” (3.175 mm).
b)
Coefficient of Thermal Expansion (CTE) units are in ppm/°C = in/in/°C × 10
-6
= unit/unit/°C × 10
-6
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 06 April 2018 / Ver. 2.00
Page 4
8329TCF
Uncured Properties
Physical Properties
Color
Viscosity
Density
Mix ratio by volume
Mix ratio by weight
Solids content (w/w)
Mixture (A:B)
Off white
Thixotropic
1.73 g/mL
1:1
1:0.9
100%
Physical Properties
Color
Viscosity @25 °C [77 °F]
Density
Odor
Part A
White
9 500 000 cP [9 500 Pa·s]
a)
1.88 g/mL
Mild
Part B
Slight yellow
800 000 cP [800 Pa·s]
b)
1.59 g/mL
Mercaptan
a)
Brookfield viscometer at 1 rpm with spindle RV F96
b)
Brookfield viscometer at 1 rpm with spindle RV C93
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 06 April 2018 / Ver. 2.00
Page 5
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