TLE49613MXTMA1 datasheet, PDF - EEWORLD Datasheet

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TLE49613MXTMA1: DescriptionBoard Mount Hall Effect / Magnetic Sensors POSITION&CURRENT SENSORS; CategoryThe sensor Sensor/transducer; File Size1MB，26 Pages; ManufacturerInfineon; Websitehttp://www.infineon.com/; Environmental Compliance

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TLE49613MXTMA1 Overview

Board Mount Hall Effect / Magnetic Sensors POSITION&CURRENT SENSORS

TLE49613MXTMA1 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Infineon
Reach Compliance Code	compliant
Factory Lead Time	26 weeks
Samacsys Description	Board Mount Hall Effect / Magnetic Sensors POSITION&CURRENT SENSORS
Other features	REVERSE POLARITY PROTECTION, OPEN DRAIN OUTPUT
body width	1.3 mm
body height	1 mm
Body length or diameter	2.9 mm
shell	PLASTIC
lag	15 mT
JESD-609 code	e3
Maximum magnetic field range	10.4 mT
Minimum magnetic field range	-10.4 mT
Installation features	SURFACE MOUNT
Maximum working current	2.5 mA
Maximum output current	25 mA
Output range	0-25mA
Output type	CURRENT OUTPUT
Package Shape/Form	RECTANGULAR
Sensor/Transducer Type	MAGNETIC FIELD SENSOR,HALL EFFECT
Maximum supply voltage	32 V
Minimum supply voltage	3 V
surface mount	YES
Terminal surface	Tin (Sn)
Termination type	SOLDER
Base Number Matches	1

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TLE4961-3M

High Precision Automotive Hall Effect Latch

Data Sheet

Revision 1.0, 2012-07-20

Sense & Control

TLE4961-3M

Revision History

Page or Item

Subjects (major changes since previous revision)

Revision 1.0, 2012-07-20

Trademarks of Infineon Technologies AG

AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, EconoPACK™, CoolMOS™, CoolSET™,

CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPIM™,

EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™, MIPAQ™,

ModSTACK™, my-d™, NovalithIC™, OptiMOS™, ORIGA™, PRIMARION™, PrimePACK™, PrimeSTACK™,

PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™,

SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™.

Other Trademarks

Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,

PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR

development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™,

FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.

FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of

Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data

Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of

MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics

Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™

of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc.,

OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc.

RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc.

SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden

Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA.

UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™

of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of

Diodes Zetex Limited.

Last Trademarks Update 2011-02-24

Data Sheet

Revision 1.0, 2012-07-20

TLE4961-3M

Table of Contents

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

List of Figures

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

List of Tables

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

1.1

1.2

1.3

2.1

2.2

2.3

2.4

2.5

2.6

3.1

3.2

3.3

3.4

3.5

4.1

4.2

4.3

4.4

4.5

Product Description

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Target Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Functional Description

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Pin Configuration (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Functional Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Default Start-up Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Specification

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Electrical and Magnetic Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Electro Magnetic Compatibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package Information

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package Outline PG-SOT23-3-15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Packing Information PG-SOT23-3-15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Footprint PG-SC59-3-5 and PG-SOT23-3-15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PG-SOT23-3-15 Distance between Chip and Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Graphs of the Magnetic Parameters

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Graphs of the Electrical Parameters

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Data Sheet

Revision 1.0, 2012-07-20

TLE4961-3M

List of Figures

Figure 1-1

Figure 2-1

Figure 2-2

Figure 2-3

Figure 2-4

Figure 2-5

Figure 3-1

Figure 3-2

Figure 3-3

Figure 3-4

Figure 4-1

Figure 4-2

Figure 4-3

Figure 4-4

Figure 4-5

Figure 5-1

Figure 5-2

Figure 5-3

Figure 6-1

Figure 6-2

Figure 6-3

Figure 6-4

Figure 6-5

Figure 6-6

Figure 6-7

Figure 6-8

Figure 6-9

Figure 6-10

Figure 6-11

Figure 6-12

Figure 6-13

Figure 6-14

Figure 6-15

Image of TLE4961-3M in the PG-SOT23-3-15 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Pin Configuration and Center of Sensitive Area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Functional Block Diagram TLE4961-3M . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Timing Diagram TLE4961-3M. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Output Signal TLE4961-3M . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Illustration of the Start-up Behavior of the TLE4961-3M. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Application Circuit 1: With External Resistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Application Circuit 2: Without External Resistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Definition of Magnetic Field Direction PG-SOT23-3-15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

EMC Test Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

PG-SOT23-3-15 Package Outline (All Dimensions in mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Packing of the PG-SOT23-3-15 in a Tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Footprint PG-SC59-3-5 and PG-SOT23-3-15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Distance between Chip and Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Marking of TLE4961-3M . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Operating Point (B

) of the TLE4961-3M over Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Release Point (B

) of the TLE4961-3M over Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Hysteresis (B

Hys

) of the TLE4961-3M over Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Power On Time t

PON

of the TLE4961-3M over Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Signal Delay Time of the TLE4961-3M over Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Supply Current of the TLE4961-3M over Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Supply Current of the TLE4961-3M over Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Output Current Limit of the TLE4961-3M over Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Output Current Limit of the TLE4961-3M over applied Pull-up Voltage . . . . . . . . . . . . . . . . . . . . . 22

Output Fall Time of the TLE4961-3M over Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Output Fall Time of the TLE4961-3M over applied Pull-up Voltage . . . . . . . . . . . . . . . . . . . . . . . . 23

Output Rise Time of the TLE4961-3M over Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Output Rise Time of the TLE4961-3M over applied Pull-up Voltage . . . . . . . . . . . . . . . . . . . . . . . 23

Output Leakage Current of the TLE4961-3M over Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Saturation Voltage of the TLE4961-3M over Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Saturation Voltage of the TLE4961-3M over Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Effective Noise of the TLE4961-3M Thresholds over Temperature . . . . . . . . . . . . . . . . . . . . . . . . 25

Output Signal Jitter of the TLE4961-3M over Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Data Sheet

Revision 1.0, 2012-07-20

TLE49613MXTMA1 Related Products

	TLE49613MXTMA1	TLE49613MXTSA1
Description	Board Mount Hall Effect / Magnetic Sensors POSITION&CURRENT SENSORS	Board Mount Hall Effect / Magnetic Sensors MAGNETIC SENSOR IC'S
Is it lead-free?	Lead free	Contains lead
Is it Rohs certified?	conform to	conform to
Maker	Infineon	Infineon
Reach Compliance Code	compliant	compliant
Factory Lead Time	26 weeks	26 weeks
Other features	REVERSE POLARITY PROTECTION, OPEN DRAIN OUTPUT	REVERSE POLARITY PROTECTION, OPEN DRAIN OUTPUT
body width	1.3 mm	1.3 mm
body height	1 mm	1 mm
Body length or diameter	2.9 mm	2.9 mm
shell	PLASTIC	PLASTIC
lag	15 mT	15 mT
JESD-609 code	e3	e3
Maximum magnetic field range	10.4 mT	10.4 mT
Minimum magnetic field range	-10.4 mT	-10.4 mT
Installation features	SURFACE MOUNT	SURFACE MOUNT
Maximum working current	2.5 mA	2.5 mA
Maximum output current	25 mA	25 mA
Output range	0-25mA	0-25mA
Output type	CURRENT OUTPUT	CURRENT OUTPUT
Package Shape/Form	RECTANGULAR	RECTANGULAR
Sensor/Transducer Type	MAGNETIC FIELD SENSOR,HALL EFFECT	MAGNETIC FIELD SENSOR,HALL EFFECT
Maximum supply voltage	32 V	32 V
Minimum supply voltage	3 V	3 V
surface mount	YES	YES
Terminal surface	Tin (Sn)	Tin (Sn)
Termination type	SOLDER	SOLDER
Base Number Matches	1	1

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