EEWORLDEEWORLDEEWORLD

Part Number

Search

AR215A471K4R

Description
Multilayer Ceramic Capacitors MLCC - Leaded 50volts 470pF 10% C0G
CategoryPassive components   
File Size109KB,5 Pages
ManufacturerAVX
Environmental Compliance
Download Datasheet Parametric View All

AR215A471K4R Online Shopping

Suppliers Part Number Price MOQ In stock  
AR215A471K4R - - View Buy Now

AR215A471K4R Overview

Multilayer Ceramic Capacitors MLCC - Leaded 50volts 470pF 10% C0G

AR215A471K4R Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerAVX
Product CategoryMultilayer Ceramic Capacitors MLCC - Leaded
RoHSDetails
Termination StyleRadial
Capacitance470 pF
Voltage Rating DC50 VDC
DielectricC0G (NP0)
Tolerance10 %
Lead Spacing0.2 in
Case StyleConformally Coated
Minimum Operating Temperature- 55 C
Maximum Operating Temperature+ 150 C
ProductAutomotive MLCCs
Length0.2 in
Width0.2 in
Height0.2 in
QualificationAEC-Q200
PackagingBulk
Operating Temperature Range- 55 C to + 150 C
Voltage Rating50 V
Capacitance - nF0.47 nF
Factory Pack Quantity1000
Temperature Coefficient / CodeC0G (NP0)
Radial Leads/SkyCap
®
/AR Series
AUTOMOTIVE
GENERAL INFORMATION
AVX AR Series
Conformally Coated Radial Leaded MLC
Temperature Coefficients:
C0G (NP0), X7R, X8R
3000, 2000, 1000, 200, 100, 50 Volts
Case Material:
Epoxy
Lead Material:
RoHS Compliant, 100% Tin
Qualified:
to AEC-Q200, PPAP Available
Temperature Range:
up to 150ºC
LD
Nom.
L.S.
Styles AR15, AR20,
AR30, AR40
L.S.
Style AR21
1.0" Min.
H Max.
Dimensions: Millimeters (Inches)
W
Max.
H Max.
LD
Nom.
W
Max.
T
Max.
1.52 (0.060)
Max.
T
Max.
See Note
1.0" Min.
Note: Coating clean .784 (0.031) min.
above
seating
plane
Drawings are for illustrative purposes only.
Actual lead form shape could vary within stated tolerances based on body size.
HOW TO ORDER
AR21
AVX Style
5
F
104
Capacitance
M
Capacitance
4
Failure Rate
4 = AEC-Q200
R
Leads
R = RoHS
Long Lead
1.0" minimum
TR1
Packaging
Blank = Bulk Packaging
T = Trimmed Leads
.230"± .030"
Bulk packaging
TR1 = Tape and Reel
Packaging
AP1 = Ammopack
Packaging
See packaging specification
page 33-34.
5 = 50V
1 = 100V
2 = 200V
A = 1000V
G = 2000V
H = 3000V
Voltage Temperature
Coefficient
A = C0G (NP0)
C = X7R
F = X8R
First two digits are the
Tolerance
significant figures of
C0G (NP0):
X7R:
capacitance. Third digit
C = ±.25pF
J = ±5%
indicates the additional
D = ±.5pF
K = ±10%
number of zeros. For
F = ±1%
M = ±20%
example, order 100,000
(>50pF only)
pF as 104. (For values
G = ±2%
X8R:
below 10pF use “R” in
(>25pF only)
J = ±5%
place of decimal point,
J = ±5%
K = ±10%
e.g., 1R4 = 1.4pF.)
K = ±10%
M = ±20%
MARKING
FRONT
XXX
X X X
Capacitance Code
Tolerance Code
Voltage Code
Temp. Char. Code
PACKAGING REQUIREMENTS
BACK
XXX
A XX
3 Digit Date Code
Lot Code
AVX Logo
AR15, 20, 21, 30
AR40
Quantity per Bag
1000 Pieces
500 Pieces
Note: AR15, AR20, AR21, AR30, and AR40 available on tape and reel per EIA
specifications RS-468. See pages 33 and 34.
22
EEWORLD University - Introduction to Atmel Software Framework (ASF) (Part 1)
Atmel Software Framework (ASF) Introduction (Part 1) : https://training.eeworld.com.cn/course/462Get to know more about Atmel Software Framework , a collection of product source code such as drivers, ...
dongcuipin Embedded System
Method of reverse deducing schematic diagram during PCB copying
[color=#000][font=Tahoma, Arial, Helvetica, snas-serif][size=14px]How to reverse the PCB schematic diagram, and what details should be paid attention to in the reverse process? [/size][/font][/color] ...
方学放 PCB Design
Download the kernel using tftp under U-boot and load the kernel
[i=s] This post was last edited by sdwuyawen on 2014-7-20 14:04 [/i] After S3C2416 is started through U-Boot, U-Boot will automatically execute bootcmd to load the kernel. Section 3.3.4 of "Jun Yixing...
sdwuyawen Embedded System
Simple bare board programming problem..? Ask for advice..
I want to put a 320*240 image on the 2440 development board. But I found that after I converted the image to *.c, I copied the code to the original image code in ADS and replaced the original code pos...
3108009356 Embedded System
How to quickly implement drive test of ST sensor through STM32 microcontroller
Today I will introduce to you how to quickly implement the drive test of ST sensors through the STM32 microcontroller . The sensor we use this time is LSM6DSOX . Because the SensorTile.box development...
littleshrimp ST Sensors & Low Power Wireless Technology Forum
About the call of structure in multiple files
[i=s]This post was last edited by Li Jiahui on 2016-12-21 16:19[/i] I encountered such a problem. I want to pack data and put it into a structure. I defined a structure in the Pack.h file, used this s...
李嘉辉 Programming Basics

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2355  2440  2706  390  926  48  50  55  8  19 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号