MA4P4001B-402 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> diode> MA4P4001B-402

MA4P4001B-402: DescriptionPIN Diodes; CategoryDiscrete semiconductor diode; File Size2MB，13 Pages; ManufacturerMACOM; Websitehttp://www.macom.com; Environmental Compliance

Download Datasheet Parametric Compare View All

MA4P4001B-402 Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	MA4P4001B-402	-	-	View	Buy Now

MA4P4001B-402 Overview

PIN Diodes

MA4P4001B-402 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
package instruction	O-CALF-W2
Contacts	2
Manufacturer packaging code	CASE 1072
Reach Compliance Code	compliant
ECCN code	EAR99
Other features	LOW DISTORTION
application	ATTENUATOR; SWITCHING
Minimum breakdown voltage	100 V
Shell connection	ISOLATED
Configuration	SINGLE
Maximum diode capacitance	2.2 pF
Nominal diode capacitance	2.2 pF
Diode component materials	SILICON
Maximum diode forward resistance	0.5 Ω
Diode resistance test current	100 mA
Diode resistance test frequency	100 MHz
Diode type	PIN DIODE
frequency band	HIGH FREQUENCY TO ULTRA HIGH FREQUENCY
JESD-30 code	O-CALF-W2
Minority carrier nominal lifetime	6 µs
Number of components	1
Number of terminals	2
Maximum operating temperature	175 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
Package shape	ROUND
Package form	LONG FORM
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Maximum power dissipation	2.5 W
Certification status	Not Qualified
Reverse test voltage	100 V
surface mount	NO
technology	POSITIVE-INTRINSIC-NEGATIVE
Terminal form	WIRE
Terminal location	AXIAL
Maximum time at peak reflow temperature	NOT SPECIFIED
Base Number Matches	1

Preview

Download Datasheet

View All

MA4P MELF & HIPAX Series

High Power PIN Diodes

V16

Features



High Power Handling

Low Loss / Low Distortion

Voltage Ratings up to 1000 Volts

Passivated Chip for Low Leakage Current

Low Theta (θ) Due to Full Face Chip Bonding

Leadless Low Inductance MELF Packages

Various Package Options

Available as Chips

Fully RoHS Compliant

Non-Magnetic Packages Available for MRI

Package Styles

401 & 402

1072 & 1091

Description

The MELF and HIPAX PIN diode series are

designed for usage in switch and attenuator

applications requiring high power handling and low

distortion. These diodes incorporate a fully

passivated PIN diode chip resulting in an extremely

low reverse bias leakage current. The

semiconductor technology utilized in the MELF and

HIPAX families draws on MACOM ’s substantial

experience in PIN diode design and wafer

fabrication. The result is a device which has a thick

I-region and long carrier lifetime while maintaining

low series resistance and capacitance values. The

chips of the MELF and HIPAX PIN diodes are

enclosed in a rugged ceramic package and is full

face bonded to metal pins on both the anode and

cathode. The result is a low loss PIN diode with low

thermal resistance due to symmetrical thermal

paths. The parts are offered in either magnetic or

non-magnetic, HIPAX (axial leaded) or MELF (Metal

Electrode Leadless Faced) surface mount packages

for MRI applications. The MELF is a rectangular

SMQ, package which is designed for high volume

tape and reel assembly. This easy to use package

design makes automatic pick and place, indexing

and assembly, extremely easy. The parallel flat sur-

faces are suitable for most key jaw or vacuum pick-

up techniques. All of the solderable surfaces are tin

plated and compatible with industry standard reflow

and vapor phase soldering processes. See Applica-

tion Note

M538

for a typical solder reflow profile.

Many of MACOM’s HIPAX PIN diodes are also

available as chips. Please consult the “Silicon PIN

Chip Datasheet” for availability and specifications.

Applications

HIPAX PIN diodes are designed for use in a wide

variety of switch and attenuator applications from

HF through UHF frequencies and at power levels

above 1 kW, CW. The internal chip as well as each

diode assembly has been comprehensively tested

and characterized to ensure predictable and

repeatable performance.

Design Recommendations



Low Distortion Attenuators

MA4P4301B



Surface Mount Switches

MA4P7101F



Cellular Radio Antenna Switches

MA4P1200, MA4P1250

Absolute Maximum Ratings

= +25°C

(Unless Otherwise Noted)

Parameter

DC Reverse Voltage (V

)

Operating Chip Junction

Temperature

Storage Temperature

Installation Temperature

ESD

Absolute Maximum

(See Tables)

-55°C to +175°C

-55°C to +200°C

+280°C for 30 Seconds

Class 1A, HBM

Notes

1. Operation of this device above any one of these

parameters may cause permanent damage.

MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit

www.macom.com

for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

MA4P4001B-402 Related Products

	MA4P4001B-402	MA4P4002F-1091T
Description	PIN Diodes	PIN Diodes Rs=.5 Ohm Ct=2.2pF Vf=1Volt
Is it lead-free?	Lead free	Lead free
Is it Rohs certified?	conform to	conform to
package instruction	O-CALF-W2	O-CELF-R2
Contacts	2	2
Manufacturer packaging code	CASE 1072	CASE 1072
Reach Compliance Code	compliant	compliant
ECCN code	EAR99	EAR99
Other features	LOW DISTORTION	LOW DISTORTION
application	ATTENUATOR; SWITCHING	ATTENUATOR; SWITCHING
Minimum breakdown voltage	100 V	200 V
Shell connection	ISOLATED	ISOLATED
Configuration	SINGLE	SINGLE
Maximum diode capacitance	2.2 pF	2.2 pF
Nominal diode capacitance	2.2 pF	2.2 pF
Diode component materials	SILICON	SILICON
Maximum diode forward resistance	0.5 Ω	0.5 Ω
Diode resistance test current	100 mA	100 mA
Diode resistance test frequency	100 MHz	100 MHz
Diode type	PIN DIODE	PIN DIODE
frequency band	HIGH FREQUENCY TO ULTRA HIGH FREQUENCY	HIGH FREQUENCY TO ULTRA HIGH FREQUENCY
JESD-30 code	O-CALF-W2	O-CELF-R2
Minority carrier nominal lifetime	6 µs	6 µs
Number of components	1	1
Number of terminals	2	2
Maximum operating temperature	175 °C	175 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
Package shape	ROUND	ROUND
Package form	LONG FORM	LONG FORM
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED
Maximum power dissipation	2.5 W	7.5 W
Certification status	Not Qualified	Not Qualified
Reverse test voltage	100 V	100 V
surface mount	NO	YES
technology	POSITIVE-INTRINSIC-NEGATIVE	POSITIVE-INTRINSIC-NEGATIVE
Terminal form	WIRE	WRAP AROUND
Terminal location	AXIAL	END
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
Base Number Matches	1	1

Recommended Resources

Basic application circuit diagram of TL431

Tone generator circuit

Use MC34063 to make 3.6V electrical to 9V circuit diagram

Digital pulse width measurement circuit

PROM7488 constitutes a code group conversion circuit

Voltage-divided current negative feedback bias circuit

Linear Technology Launches 100% Duty Cycle DC/DC Current Mode Controller for Automotive Applications: Linear Technology Corporation has introduced the LTC3824, a 4V to 60V input range, 100% duty cycle , low IQ, adjustable switching frequency DC/DC current mode controller. This controller is very suita...; frozenviolet Automotive Electronics

Help! I turned on 360 and it turned out like this: [i=s] This post was last edited by Wang Shuangxi on 2016-6-12 10:45 [/i] How can I solve this problem?...; 王双喜很有喜感 TI Technology Forum

I would like to ask, will all DLLs under the WINCE registry [HKEY_LOCAL_MACHINE\Drivers\BuiltIn] be loaded by the device manager?: I am porting the SDIO driver SDHC_SC2440.dll, and its entries in the registry are as follows. However, I feel that its entry function DllEntry and initialization function SDH_Init are not executed. I ...; feifei Embedded System

Help IAR error when downloading the program: Newbie seeking guidance!...; cdc风 Microcontroller MCU

【GD32307E-START】+Serial communication function test: [i=s]This post was last edited by jinglixixi on 2020-11-9 22:20[/i]The official website provides a routine for serial communication function, but the weird thing is the hardware design. Since the GD-L...; jinglixixi Domestic Chip Exchange

EK_LM3S811 Questions and Answers (Q&A): :) I saw a lot of information about LM3S811 scattered everywhere in the forum, so I made a rough summary, hoping that it will be helpful to friends in the forum. I also hope that everyone can continue...; EEWORLD社区 Microcontroller MCU

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components