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AT17F16

Description
FPGA Configuration Flash Memory
File Size199KB,18 Pages
ManufacturerAtmel (Microchip)
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AT17F16 Overview

FPGA Configuration Flash Memory

Features
Programmable 16,777,216 x 1-bit Serial Memories Designed to Store Configuration
Programs for Field Programmable Gate Arrays (FPGAs)
3.3V Output Capability
5V Tolerant I/O Pins
Program Support using the Atmel ATDH2200E System or Industry Third Party
Programmers
In-System Programmable (ISP) via 2-wire Bus
Simple Interface to SRAM FPGAs
Compatible with Atmel AT40K and AT94K Devices, Altera FLEX
®
, APEX
Devices,
Lucent ORCA
®
FPGAs, Xilinx XC3000
, XC4000
, XC5200
, Spartan
®
, Virtex
®
FPGAs,
Motorola MPA1000 FPGAs
Cascadable Read-back to Support Additional Configurations or Higher-density Arrays
Low-power CMOS FLASH Process
Available in 6 mm x 6 mm x 1 mm 8-lead LAP (Pin-compatible with 8-lead SOIC/VOIC
Footprint Packages), 20-lead PLCC, 44-lead PLCC and 44-lead TQFP Packages
Emulation of Atmel’s AT24CXXX Serial EEPROMs
Low-power Standby Mode
Single Device Capable of Holding 4 Bit Stream Files Allowing Simple System
Reconfiguration
Fast Serial Download Speeds up to 33 MHz
Endurance: 10,000 Write Cycles Typical
FPGA
Configuration
Flash Memory
AT17F16
Description
The AT17F Series of In-System Programmable Configuration PROMs (Configurators)
provide an easy-to-use, cost-effective configuration memory for Field Programmable
Gate Arrays. The AT17F Series device is packaged in the 8-lead LAP, 20-lead PLCC,
44-lead PLCC and 44-lead TQFP, see Table 1. The AT17F Series Configurator uses a
simple serial-access procedure to configure one or more FPGA devices.
The AT17F Series Configurators can be programmed with industry-standard program-
mers, Atmel’s ATDH2200E Programming Kit or Atmel’s ATDH2225 ISP Cable.
Table 1.
AT17F Series Packages
Package
8-lead LAP
20-lead PLCC
44-lead PLCC
44-lead TQFP
AT17F16
Yes
Yes
Yes
Yes
Advance
Information
Rev. 3392A–CNFG–10/03
1

AT17F16 Related Products

AT17F16 AT17F16-30CC AT17F16-30JI
Description FPGA Configuration Flash Memory FPGA Configuration Flash Memory FPGA Configuration Flash Memory
Is it Rohs certified? - incompatible incompatible
Maker - Atmel (Microchip) Atmel (Microchip)
Parts packaging code - SOIC LPCC
package instruction - SON, SOLCC8,.25 QCCJ, LDCC20,.4SQ
Contacts - 8 20
Reach Compliance Code - compliant compliant
ECCN code - EAR99 EAR99
Maximum clock frequency (fCLK) - 33 MHz 33 MHz
Durability - 10000 Write/Erase Cycles 10000 Write/Erase Cycles
JESD-30 code - S-XDSO-N8 S-PQCC-J20
JESD-609 code - e0 e0
length - 5.99 mm 8.9662 mm
memory density - 16777216 bit 16777216 bit
Memory IC Type - CONFIGURATION MEMORY CONFIGURATION MEMORY
memory width - 1 1
Humidity sensitivity level - 3 2
Number of functions - 1 1
Number of terminals - 8 20
word count - 16777216 words 16777216 words
character code - 16000000 16000000
Operating mode - SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature - 70 °C 85 °C
organize - 16MX1 16MX1
Package body material - UNSPECIFIED PLASTIC/EPOXY
encapsulated code - SON QCCJ
Encapsulate equivalent code - SOLCC8,.25 LDCC20,.4SQ
Package shape - SQUARE SQUARE
Package form - SMALL OUTLINE CHIP CARRIER
Parallel/Serial - SERIAL SERIAL
Peak Reflow Temperature (Celsius) - 240 225
power supply - 3.3 V 3.3 V
Certification status - Not Qualified Not Qualified
Maximum seat height - 1.14 mm 4.572 mm
Maximum standby current - 0.002 A 0.002 A
Maximum slew rate - 0.04 mA 0.04 mA
Maximum supply voltage (Vsup) - 3.63 V 3.63 V
Minimum supply voltage (Vsup) - 2.97 V 2.97 V
Nominal supply voltage (Vsup) - 3.3 V 3.3 V
surface mount - YES YES
technology - CMOS CMOS
Temperature level - COMMERCIAL INDUSTRIAL
Terminal surface - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form - NO LEAD J BEND
Terminal pitch - 1.27 mm 1.27 mm
Terminal location - DUAL QUAD
Maximum time at peak reflow temperature - 30 30
type - NOR TYPE NOR TYPE
width - 5.99 mm 8.9662 mm
Maximum write cycle time (tWC) - 0.03 ms 0.03 ms
Base Number Matches - 1 1

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