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AT17F16-30JI

Description
FPGA Configuration Flash Memory
Categorystorage    storage   
File Size199KB,18 Pages
ManufacturerAtmel (Microchip)
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AT17F16-30JI Overview

FPGA Configuration Flash Memory

AT17F16-30JI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerAtmel (Microchip)
Parts packaging codeLPCC
package instructionQCCJ, LDCC20,.4SQ
Contacts20
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum clock frequency (fCLK)33 MHz
Durability10000 Write/Erase Cycles
JESD-30 codeS-PQCC-J20
JESD-609 codee0
length8.9662 mm
memory density16777216 bit
Memory IC TypeCONFIGURATION MEMORY
memory width1
Humidity sensitivity level2
Number of functions1
Number of terminals20
word count16777216 words
character code16000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize16MX1
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC20,.4SQ
Package shapeSQUARE
Package formCHIP CARRIER
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)225
power supply3.3 V
Certification statusNot Qualified
Maximum seat height4.572 mm
Maximum standby current0.002 A
Maximum slew rate0.04 mA
Maximum supply voltage (Vsup)3.63 V
Minimum supply voltage (Vsup)2.97 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
typeNOR TYPE
width8.9662 mm
Maximum write cycle time (tWC)0.03 ms
Base Number Matches1
Features
Programmable 16,777,216 x 1-bit Serial Memories Designed to Store Configuration
Programs for Field Programmable Gate Arrays (FPGAs)
3.3V Output Capability
5V Tolerant I/O Pins
Program Support using the Atmel ATDH2200E System or Industry Third Party
Programmers
In-System Programmable (ISP) via 2-wire Bus
Simple Interface to SRAM FPGAs
Compatible with Atmel AT40K and AT94K Devices, Altera FLEX
®
, APEX
Devices,
Lucent ORCA
®
FPGAs, Xilinx XC3000
, XC4000
, XC5200
, Spartan
®
, Virtex
®
FPGAs,
Motorola MPA1000 FPGAs
Cascadable Read-back to Support Additional Configurations or Higher-density Arrays
Low-power CMOS FLASH Process
Available in 6 mm x 6 mm x 1 mm 8-lead LAP (Pin-compatible with 8-lead SOIC/VOIC
Footprint Packages), 20-lead PLCC, 44-lead PLCC and 44-lead TQFP Packages
Emulation of Atmel’s AT24CXXX Serial EEPROMs
Low-power Standby Mode
Single Device Capable of Holding 4 Bit Stream Files Allowing Simple System
Reconfiguration
Fast Serial Download Speeds up to 33 MHz
Endurance: 10,000 Write Cycles Typical
FPGA
Configuration
Flash Memory
AT17F16
Description
The AT17F Series of In-System Programmable Configuration PROMs (Configurators)
provide an easy-to-use, cost-effective configuration memory for Field Programmable
Gate Arrays. The AT17F Series device is packaged in the 8-lead LAP, 20-lead PLCC,
44-lead PLCC and 44-lead TQFP, see Table 1. The AT17F Series Configurator uses a
simple serial-access procedure to configure one or more FPGA devices.
The AT17F Series Configurators can be programmed with industry-standard program-
mers, Atmel’s ATDH2200E Programming Kit or Atmel’s ATDH2225 ISP Cable.
Table 1.
AT17F Series Packages
Package
8-lead LAP
20-lead PLCC
44-lead PLCC
44-lead TQFP
AT17F16
Yes
Yes
Yes
Yes
Advance
Information
Rev. 3392A–CNFG–10/03
1

AT17F16-30JI Related Products

AT17F16-30JI AT17F16 AT17F16-30CC
Description FPGA Configuration Flash Memory FPGA Configuration Flash Memory FPGA Configuration Flash Memory
Is it Rohs certified? incompatible - incompatible
Maker Atmel (Microchip) - Atmel (Microchip)
Parts packaging code LPCC - SOIC
package instruction QCCJ, LDCC20,.4SQ - SON, SOLCC8,.25
Contacts 20 - 8
Reach Compliance Code compliant - compliant
ECCN code EAR99 - EAR99
Maximum clock frequency (fCLK) 33 MHz - 33 MHz
Durability 10000 Write/Erase Cycles - 10000 Write/Erase Cycles
JESD-30 code S-PQCC-J20 - S-XDSO-N8
JESD-609 code e0 - e0
length 8.9662 mm - 5.99 mm
memory density 16777216 bit - 16777216 bit
Memory IC Type CONFIGURATION MEMORY - CONFIGURATION MEMORY
memory width 1 - 1
Humidity sensitivity level 2 - 3
Number of functions 1 - 1
Number of terminals 20 - 8
word count 16777216 words - 16777216 words
character code 16000000 - 16000000
Operating mode SYNCHRONOUS - SYNCHRONOUS
Maximum operating temperature 85 °C - 70 °C
organize 16MX1 - 16MX1
Package body material PLASTIC/EPOXY - UNSPECIFIED
encapsulated code QCCJ - SON
Encapsulate equivalent code LDCC20,.4SQ - SOLCC8,.25
Package shape SQUARE - SQUARE
Package form CHIP CARRIER - SMALL OUTLINE
Parallel/Serial SERIAL - SERIAL
Peak Reflow Temperature (Celsius) 225 - 240
power supply 3.3 V - 3.3 V
Certification status Not Qualified - Not Qualified
Maximum seat height 4.572 mm - 1.14 mm
Maximum standby current 0.002 A - 0.002 A
Maximum slew rate 0.04 mA - 0.04 mA
Maximum supply voltage (Vsup) 3.63 V - 3.63 V
Minimum supply voltage (Vsup) 2.97 V - 2.97 V
Nominal supply voltage (Vsup) 3.3 V - 3.3 V
surface mount YES - YES
technology CMOS - CMOS
Temperature level INDUSTRIAL - COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb)
Terminal form J BEND - NO LEAD
Terminal pitch 1.27 mm - 1.27 mm
Terminal location QUAD - DUAL
Maximum time at peak reflow temperature 30 - 30
type NOR TYPE - NOR TYPE
width 8.9662 mm - 5.99 mm
Maximum write cycle time (tWC) 0.03 ms - 0.03 ms
Base Number Matches 1 - 1

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