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SST39VF6402B-70-4C-EKE

Description
NOR Flash 64M (4Mx16) 70ns Commercial Temp
Categorystorage    storage   
File Size4MB,39 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
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SST39VF6402B-70-4C-EKE Overview

NOR Flash 64M (4Mx16) 70ns Commercial Temp

SST39VF6402B-70-4C-EKE Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicrochip
Parts packaging codeTSOP1
package instructionTSOP1, TSSOP48,.8,20
Contacts48
Reach Compliance Codecompliant
ECCN code3A991.B.1.A
Factory Lead Time5 weeks
Samacsys Description2.7 to 3.6V 64Mbit Multi-Purpose Flash
Maximum access time70 ns
Other featuresTOP BOOT BLOCK
startup blockTOP
command user interfaceYES
Universal Flash InterfaceYES
Data pollingYES
JESD-30 codeR-PDSO-G48
JESD-609 codee3
length18.4 mm
memory density67108864 bit
Memory IC TypeFLASH
memory width16
Humidity sensitivity level3
Number of functions1
Number of departments/size2K
Number of terminals48
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize4MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Encapsulate equivalent codeTSSOP48,.8,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply3/3.3 V
Programming voltage2.7 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Department size2K
Maximum standby current0.00002 A
Maximum slew rate0.035 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceMatte Tin (Sn) - annealed
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
switch bitYES
typeNOR TYPE
width12 mm
Not recommended for new designs.
Please use SST38VF6401/6402/6403/6404.
64 Mbit (x16) Multi-Purpose Flash Plus
SST39VF6401B / SST39VF6402B
Not Recommended for New Designs
The SST39VF6401B / SST39VF6402B devices are 4M x16, CMOS Multi-Purpose
Flash Plus (MPF+) manufactured with proprietary, high performance CMOS
SuperFlash technology. The split-gate cell design and thick-oxide tunneling injec-
tor attain better reliability and manufacturability compared with alternate
approaches. The SST39VF6401B / SST39VF6402B write (Program or Erase)
with a 2.7-3.6V power supply. These devices conform to JEDEC standard pinouts
for x16 memories and are command set compatible with other Flash devices,
enabling customers to save time and resources in implementation.
Features
• Organized as 4M x16
• Single Voltage Read and Write Operations
– 2.7-3.6V
• Fast Read Access Time:
– 70 ns
• Latched Address and Data
• Fast Erase and Word-Program:
– Sector-Erase Time: 18 ms (typical)
– Block-Erase Time: 18 ms (typical)
– Chip-Erase Time: 40 ms (typical)
– Word-Program Time: 7 µs (typical)
• Superior Reliability
– Endurance: 100,000 Cycles (Typical)
– Greater than 100 years Data Retention
• Low Power Consumption (typical values at 5 MHz)
– Active Current: 9 mA (typical)
– Standby Current: 3 µA (typical)
– Auto Low Power Mode: 3 µA (typical)
• Automatic Write Timing
– Internal V
PP
Generation
• Hardware Block-Protection/WP# Input Pin
– Top Block-Protection (top 32 KWord)
for SST39VF6402B
– Bottom Block-Protection (bottom 32 KWord)
for SST39VF6401B
• End-of-Write Detection
– Toggle Bits
– Data# Polling
• CMOS I/O Compatibility
• JEDEC Standard
– Flash EEPROM Pin Assignments
– Software command sequence compatibility
- Address format is 11 bits, A
10
-A
0
- Block-Erase 6th Bus Write Cycle is 30H
- Sector-Erase 6th Bus Write Cycle is 50H
• Sector-Erase Capability
– Uniform 2 KWord sectors
• Block-Erase Capability
– Uniform 32 KWord blocks
• Chip-Erase Capability
• Erase-Suspend/Erase-Resume Capabilities
• Hardware Reset Pin (RST#)
• Security-ID Feature
– Microchip: 128 bits; User: 128 bits
• Packages Available
– 48-lead TSOP (12mm x 20mm)
– 48-ball TFBGA (8mm x 10mm)
• All devices are RoHS compliant
©2015-2018
www.microchip.com
DS20005008C

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Description NOR Flash 64M (4Mx16) 70ns Commercial Temp NOR Flash 64M (4Mx16) 70ns Commercial Temp NOR Flash 64M (4Mx16) 70ns 2.7-3.6V Commercial NOR Flash 2.7 to 3.6V 64Mbit Multi-Purpose Flash NOR Flash 2.7 to 3.6V 64Mbit Multi-Purpose Flash NOR Flash 2.7 to 3.6V 64Mbit Multi-Purpose Flash
Is it Rohs certified? conform to conform to conform to conform to conform to conform to
Maker Microchip Microchip Microchip Microchip Microchip Microchip
Reach Compliance Code compliant compliant compliant compliant compliant compliant
Factory Lead Time 5 weeks 6 weeks 7 weeks 5 weeks 11 weeks 9 weeks
Maximum access time 70 ns 70 ns 70 ns 70 ns 70 ns 70 ns
startup block TOP TOP TOP BOTTOM BOTTOM TOP
command user interface YES YES YES YES YES YES
Universal Flash Interface YES YES YES YES YES YES
Data polling YES YES YES YES YES YES
JESD-30 code R-PDSO-G48 R-PBGA-B48 R-PBGA-B48 R-PDSO-G48 R-PDSO-G48 R-PBGA-B48
JESD-609 code e3 e1 e1 e3 e3 e1
memory density 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH FLASH FLASH FLASH FLASH
memory width 16 16 16 16 16 16
Number of departments/size 2K 2K 2K 2K 2K 2K
Number of terminals 48 48 48 48 48 48
word count 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words
character code 4000000 4000000 4000000 4000000 4000000 4000000
Maximum operating temperature 70 °C 70 °C 85 °C 70 °C 85 °C 85 °C
organize 4MX16 4MX16 4MX16 4MX16 4MX16 4MX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP1 TFBGA TFBGA TSSOP TSSOP FBGA
Encapsulate equivalent code TSSOP48,.8,20 BGA48,6X8,32 BGA48,6X8,32 TSSOP48,.8,20 TSSOP48,.8,20 BGA48,6X8,32
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, FINE PITCH
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Department size 2K 2K 2K 2K 2K 2K
Maximum standby current 0.00002 A 0.00002 A 0.00002 A 0.00002 A 0.00002 A 0.00002 A
Maximum slew rate 0.035 mA 0.035 mA 0.035 mA 0.035 mA 0.035 mA 0.035 mA
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL
Terminal surface Matte Tin (Sn) - annealed Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form GULL WING BALL BALL GULL WING GULL WING BALL
Terminal pitch 0.5 mm 0.8 mm 0.8 mm 0.5 mm 0.5 mm 0.8 mm
Terminal location DUAL BOTTOM BOTTOM DUAL DUAL BOTTOM
switch bit YES YES YES YES YES YES
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
package instruction TSOP1, TSSOP48,.8,20 TFBGA, BGA48,6X8,32 TFBGA, BGA48,6X8,32 - - FBGA, BGA48,6X8,32
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