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DS1249AB-85

Description
NVRAM 2048K NV SRAM
Categorystorage    storage   
File Size192KB,9 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
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DS1249AB-85 Overview

NVRAM 2048K NV SRAM

DS1249AB-85 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMaxim
Parts packaging codeMODULE
package instruction,
Contacts32
Reach Compliance Codecompliant
ECCN code3A991.B.2.A
JESD-30 codeR-XDMA-P32
JESD-609 codee0
memory density2097152 bit
Memory IC TypeNON-VOLATILE SRAM MODULE
memory width8
Number of functions1
Number of terminals32
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX8
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum supply voltage (Vsup)5.25 V
Minimum supply voltage (Vsup)4.75 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formPIN/PEG
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
19-5631; Rev 11/10
DS1249Y/AB
2048k Nonvolatile SRAM
www.maxim-ic.com
FEATURES
10 years minimum data retention in the
absence of external power
Data is automatically protected during power
loss
Unlimited write cycles
Low-power CMOS operation
Read and write access times of 70 ns
Lithium energy source is electrically
disconnected to retain freshness until power is
applied for the first time
Full
±
10% V
CC
operating range (DS1249Y)
Optional
±
5% V
CC
operating range
(DS1249AB)
Optional industrial temperature range of
-40°C to +85°C, designated IND
JEDEC standard 32-pin DIP package
PIN ASSIGNMENT
NC
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
V
CC
A15
A17
WE
A13
A8
A9
A11
OE
A10
CE
DQ7
DQ6
DQ5
DQ4
DQ3
32-Pin ENCAPSULATED PACKAGE
740-mil EXTENDED
PIN DESCRIPTION
A0 - A17
DQ0 - DQ7
CE
WE
OE
V
CC
GND
NC
- Address Inputs
- Data In/Data Out
- Chip Enable
- Write Enable
- Output Enable
- Power (+5V)
- Ground
- No Connect
DESCRIPTION
The DS1249 2048k Nonvolatile SRAMs are 2,097,152-bit, fully static, nonvolatile SRAMs organized as
262,144 words by 8 bits. Each NV SRAM has a self-contained lithium energy source and control circuitry
which constantly monitors V
CC
for an out-of-tolerance condition. When such a condition occurs, the
lithium energy source is automatically switched on and write protection is unconditionally enabled to
prevent data corruption. There is no limit on the number of write cycles which can be executed and no
additional support circuitry is required for microprocessor interfacing.
1 of 9

DS1249AB-85 Related Products

DS1249AB-85 DS1249Y-85 DS1249Y-100 DS1249Y-70IND DS1249AB-85IND DS1249Y-70 DS1249Y-85IND
Description NVRAM 2048K NV SRAM NVRAM 2048K NV SRAM NVRAM 2048K NV SRAM NVRAM 2048K NV SRAM NVRAM 2048K NV SRAM NVRAM 2048K NV SRAM NVRAM 2048K NV SRAM
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible -
Maker Maxim Maxim Maxim Maxim Maxim Maxim -
Parts packaging code MODULE DIP DIP MODULE MODULE DIP -
Contacts 32 32 32 32 32 32 -
Reach Compliance Code compliant not_compliant compliant compliant compliant compliant -
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A -
JESD-30 code R-XDMA-P32 R-PDIP-T32 R-XDMA-P32 R-XDMA-P32 R-XDMA-P32 R-XDMA-P32 -
JESD-609 code e0 e0 e0 e0 e0 e0 -
memory density 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit -
Memory IC Type NON-VOLATILE SRAM MODULE NON-VOLATILE SRAM MODULE NON-VOLATILE SRAM MODULE NON-VOLATILE SRAM MODULE NON-VOLATILE SRAM MODULE NON-VOLATILE SRAM MODULE -
memory width 8 8 8 8 8 8 -
Number of functions 1 1 1 1 1 1 -
Number of terminals 32 32 32 32 32 32 -
word count 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words -
character code 256000 256000 256000 256000 256000 256000 -
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS -
Maximum operating temperature 70 °C 70 °C 70 °C 85 °C 85 °C 70 °C -
organize 256KX8 256KX8 256KX8 256KX8 256KX8 256KX8 -
Package body material UNSPECIFIED PLASTIC/EPOXY UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED -
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR -
Package form MICROELECTRONIC ASSEMBLY IN-LINE MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY -
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL -
Peak Reflow Temperature (Celsius) NOT SPECIFIED 240 240 NOT SPECIFIED NOT SPECIFIED 240 -
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
Maximum supply voltage (Vsup) 5.25 V 5.5 V 5.5 V 5.5 V 5.25 V 5.5 V -
Minimum supply voltage (Vsup) 4.75 V 4.5 V 4.5 V 4.5 V 4.75 V 4.5 V -
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V -
surface mount NO NO NO NO NO NO -
technology CMOS CMOS CMOS CMOS CMOS CMOS -
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL -
Terminal surface TIN LEAD Tin/Lead (Sn/Pb) TIN LEAD TIN LEAD TIN LEAD TIN LEAD -
Terminal form PIN/PEG THROUGH-HOLE PIN/PEG PIN/PEG PIN/PEG PIN/PEG -
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL -
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
Is it lead-free? - Contains lead Contains lead Contains lead - Contains lead -
Maximum access time - 85 ns 100 ns 70 ns - 70 ns -
Other features - DATA RETENTION > 10 YEARS 10 YEAR DATA RETENTION 10 YEAR DATA RETENTION - 10 YEAR DATA RETENTION -

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