All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner.
The information furnished in this publication is
PRELIMINARY
and subject to changes without notice.
ZSSC3026
Low Power 16 Bit Sensor Signal Conditioner IC
ZSSC3026 Block Diagram
Ordering Information
Ordering Examples *
ZSSC3026CC1B
ZSSC3026CI1B
ZSSC3026CI4
ZSSC30x6KIT
Description
Temperature range: –40°C to +85 °C,
Consumer-Level: Parameter according Data Sheet
Temperature range: –40°C to +85 °C,
Industrial-Level: 10 years MTP-Data Retention
Temperature range: –40°C to +110 °C, Industrial
Evaluation Kit for ZSSC30x6 Product Family
Package
Chips, Wafer (304um) unsawn, tested
Chips, Wafer (304um) unsawn, tested
PQFN24 4x4, tested
Boards, cable, software-CD, 1 sample
* Please contact ZMDI Sales for additional options.
Sales and Further Information
Zentrum Mikroelektronik
Dresden AG
Grenzstrasse 28
01109 Dresden
Germany
Phone
Fax
+49 (0)351.8822.7.772
+49 (0)351.8822.87.772
www.zmdi.com
Zentrum Mikroelektronik
Dresden AG, Japan Office
2nd Floor, Shinbashi Tokyu Bldg.
4-21-3, Shinbashi, Minato-ku
Tokyo, 105-0004
Japan
Phone
Fax
+81.3.6895.7410
+81.3.6895.7301
sales@zmdi.com
ZMD FAR EAST, Ltd.
3F, No. 51, Sec. 2,
Keelung Road
11052 Taipei
Taiwan
Phone
Fax
+886.2.2377.8189
+886.2.2377.8199
ZMD America, Inc.
8413 Excelsior Drive
Suite 200
Madison, WI 53717
USA
Phone
Fax
+1 (608) 829-1987
+1 (631) 549-2882
DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are
PRELIMINARY
and subject to change without notice. Zentrum
Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The information furnished hereby is believed to be true
and accurate. However, under no circumstances shall ZMD AG be liable to any customer, licensee, or any other third party for any special, indirect, incidental, or consequential damages of
any kind or nature whatsoever arising out of or in any way related to the furnishing, performance, or use of this technical data. ZMD AG hereby expressly disclaims any liability of ZMD AG
to any customer, licensee or any other third party, and any such customer, licensee and any other third party hereby waives any liability of ZMD AG for any damages in connection with or
arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty, tort (including negligence), strict liability, or otherwise
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner.
ZSSC3026
Low Power 16 Bit Sensor Signal Conditioner IC
Table of Contents
1
IC Characteristics .......................................................................................................................................... 7
1.1.
1.2.
1.3.
1.4.
2
2.1.
2.2.
2.3.
Absolute Maximum Ratings.................................................................................................................... 7
Digital Section....................................................................................................................................... 17
Power Up.............................................................................................................................................. 19
I C .................................................................................................................................................. 27
Quality and Reliability..................................................................................................................................44
Related Documents..................................................................................................................................... 45
Figure 3.10 I C Read Data................................................................................................................................ 28
Figure 3.11 Memory Program Operation. ......................................................................................................... 29
Figure 4.1
Figure 4.2
ZSSC3026 Pad Placement............................................................................................................ 41
General PQFN24 Package Dimensions. ....................................................................................... 43
List of Tables
Table 1.1
Table 1.2
Table 1.3
Table 1.4
Table 2.1
Table 2.2
Table 2.3
Table 2.4
Table 2.5
Table 2.6
Table 2.7
Table 3.1
Data Sheet
May 15, 2012
Maximum Ratings. ........................................................................................................................... 7
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Embedded System
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