BQ4013YMA-85 datasheet, PDF - EEWORLD Datasheet

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BQ4013YMA-85: DescriptionNVRAM 128Kx8 Nonvolatile SRAM; Categorystorage storage; File Size335KB，15 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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BQ4013YMA-85 Overview

NVRAM 128Kx8 Nonvolatile SRAM

BQ4013YMA-85 Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Contains lead
Is it Rohs certified?	conform to
Maker	Texas Instruments
package instruction	ROHS COMPLIANT, PLASTIC, DIP-32
Reach Compliance Code	unknow
ECCN code	EAR99
Factory Lead Time	1 week
Samacsys Descripti	IC NVSRAM 1M PARALLEL 32DIP
Maximum access time	85 ns
JESD-30 code	R-PDMA-P32
length	42.8 mm
memory density	1048576 bi
Memory IC Type	NON-VOLATILE SRAM MODULE
memory width	8
Number of functions	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX8
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP32,.6
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	9.53 mm
Maximum standby current	0.004 A
Maximum slew rate	0.105 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm

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Description	NVRAM 128Kx8 Nonvolatile SRAM	NVRAM 128Kx8 Nonvolatile	NVRAM 128Kx8 Nonvolatile SRAM	NVRAM 128Kx8 Nonvolatile SRAM	NVRAM 128k x 8 NonVolatile	NVRAM 128Kx8 Nonvolatile SRAM	NVRAM 128Kx8 Nonvolatile SRAM	NVRAM 128kx8 NONVOL SRAM 3.3V Inp Vltg
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
package instruction	ROHS COMPLIANT, PLASTIC, DIP-32	ROHS COMPLIANT, PLASTIC, DIP-32	ROHS COMPLIANT, PLASTIC, DIP-32	ROHS COMPLIANT, PLASTIC, DIP-32	DIP, DIP32,.6	DIP, DIP32,.6	DIP, DIP32,.6	DIP, DIP32,.6
Reach Compliance Code	unknow	compli	compli	compli	compli	compli	compli	compli
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	85 ns	85 ns	70 ns	70 ns	120 ns	85 ns	120 ns	70 ns
JESD-30 code	R-PDMA-P32	R-PDMA-P32	R-PDMA-P32	R-PDMA-P32	R-PDMA-P32	R-PDMA-P32	R-PDMA-P32	R-PDMA-P32
length	42.8 mm	42.8 mm	42.8 mm	42.8 mm	42.8 mm	42.8 mm	42.8 mm	42.8 mm
memory density	1048576 bi	1048576 bi	1048576 bi	1048576 bi	1048576 bi	1048576 bi	1048576 bi	1048576 bi
Memory IC Type	NON-VOLATILE SRAM MODULE	NON-VOLATILE SRAM MODULE	NON-VOLATILE SRAM MODULE	NON-VOLATILE SRAM MODULE	NON-VOLATILE SRAM MODULE	NON-VOLATILE SRAM MODULE	NON-VOLATILE SRAM MODULE	NON-VOLATILE SRAM MODULE
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32	32	32
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	85 °C	70 °C	70 °C	70 °C	70 °C	85 °C
organize	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP32,.6	DIP32,.6	DIP32,.6	DIP32,.6	DIP32,.6	DIP32,.6	DIP32,.6	DIP32,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	9.53 mm	9.53 mm	9.53 mm	9.53 mm	9.53 mm	9.53 mm	9.53 mm	9.53 mm
Maximum standby current	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.001 A
Maximum slew rate	0.105 mA	0.105 mA	0.105 mA	0.105 mA	0.105 mA	0.105 mA	0.105 mA	0.05 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	3.6 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.75 V	4.75 V	3 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	3.3 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal form	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	-	Texas Instruments	-	Texas Instruments

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