High-speed Complex Programmable Logic Device

| ATF750CL | ATF750C-15XC | ATF750C-15JI | ATF750C-10SC | ATF750C-15JC | ATF750C-10XC | ATF750C-10SI | ATF750C-10PC | ATF750C | ATF750C-10JC | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | High-speed Complex Programmable Logic Device | High-speed Complex Programmable Logic Device | High-speed Complex Programmable Logic Device | High-speed Complex Programmable Logic Device | High-speed Complex Programmable Logic Device | High-speed Complex Programmable Logic Device | High-speed Complex Programmable Logic Device | High-speed Complex Programmable Logic Device | High-speed Complex Programmable Logic Device | High-speed Complex Programmable Logic Device |
| Is it Rohs certified? | - | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | - | incompatible |
| Parts packaging code | - | TSSOP | LCC | SOIC | LCC | TSSOP | SOIC | DIP | - | LCC |
| package instruction | - | TSSOP, TSSOP24,.25 | QCCJ, LDCC28,.5SQ | SOP, SOP24,.4 | QCCJ, LDCC28,.5SQ | TSSOP, TSSOP24,.25 | SOP, SOP24,.4 | DIP, DIP24,.3 | - | QCCJ, LDCC28,.5SQ |
| Contacts | - | 24 | 28 | 24 | 28 | 24 | 24 | 24 | - | 28 |
| Reach Compliance Code | - | compli | compli | compli | compli | compli | compli | compli | - | compli |
| Other features | - | NO | NO | NO | NO | NO | NO | NO | - | NO |
| maximum clock frequency | - | 55 MHz | 55 MHz | 83 MHz | 55 MHz | 83 MHz | 83 MHz | 83 MHz | - | 83 MHz |
| In-system programmable | - | NO | NO | NO | NO | NO | NO | NO | - | NO |
| JESD-30 code | - | R-PDSO-G24 | S-PQCC-J28 | R-PDSO-G24 | S-PQCC-J28 | R-PDSO-G24 | R-PDSO-G24 | R-PDIP-T24 | - | S-PQCC-J28 |
| JESD-609 code | - | e0 | e0 | e0 | e0 | e0 | e0 | e0 | - | e0 |
| JTAG BST | - | NO | NO | NO | NO | NO | NO | NO | - | NO |
| length | - | 7.8 mm | 11.5062 mm | 15.4 mm | 11.5062 mm | 7.8 mm | 15.4 mm | 31.877 mm | - | 11.5062 mm |
| Humidity sensitivity level | - | 2 | 2 | 2 | 2 | 2 | 2 | 1 | - | 2 |
| Dedicated input times | - | 11 | 11 | 11 | 11 | 11 | 11 | 11 | - | 11 |
| Number of I/O lines | - | 10 | 10 | 10 | 10 | 10 | 10 | 10 | - | 10 |
| Number of macro cells | - | 10 | 10 | 10 | 10 | 10 | 10 | 10 | - | 10 |
| Number of terminals | - | 24 | 28 | 24 | 28 | 24 | 24 | 24 | - | 28 |
| Maximum operating temperature | - | 70 °C | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | - | 70 °C |
| organize | - | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | - | 11 DEDICATED INPUTS, 10 I/O |
| Output function | - | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | - | MACROCELL |
| Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| encapsulated code | - | TSSOP | QCCJ | SOP | QCCJ | TSSOP | SOP | DIP | - | QCCJ |
| Encapsulate equivalent code | - | TSSOP24,.25 | LDCC28,.5SQ | SOP24,.4 | LDCC28,.5SQ | TSSOP24,.25 | SOP24,.4 | DIP24,.3 | - | LDCC28,.5SQ |
| Package shape | - | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | SQUARE |
| Package form | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER | SMALL OUTLINE | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | IN-LINE | - | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | - | 240 | 225 | 240 | 225 | 240 | 240 | 225 | - | 225 |
| power supply | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V |
| Programmable logic type | - | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | - | EE PLD |
| propagation delay | - | 15 ns | 15 ns | 10 ns | 15 ns | 10 ns | 10 ns | 10 ns | - | 10 ns |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| Maximum seat height | - | 1.2 mm | 4.572 mm | 2.65 mm | 4.572 mm | 1.2 mm | 2.65 mm | 5.334 mm | - | 4.572 mm |
| Maximum supply voltage | - | 5.25 V | 5.5 V | 5.25 V | 5.25 V | 5.25 V | 5.5 V | 5.25 V | - | 5.25 V |
| Minimum supply voltage | - | 4.75 V | 4.5 V | 4.75 V | 4.75 V | 4.75 V | 4.5 V | 4.75 V | - | 4.75 V |
| Nominal supply voltage | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V |
| surface mount | - | YES | YES | YES | YES | YES | YES | NO | - | YES |
| technology | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS |
| Temperature level | - | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | - | COMMERCIAL |
| Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| Terminal form | - | GULL WING | J BEND | GULL WING | J BEND | GULL WING | GULL WING | THROUGH-HOLE | - | J BEND |
| Terminal pitch | - | 0.65 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm | 1.27 mm | 2.54 mm | - | 1.27 mm |
| Terminal location | - | DUAL | QUAD | DUAL | QUAD | DUAL | DUAL | DUAL | - | QUAD |
| Maximum time at peak reflow temperature | - | 30 | 30 | 30 | 30 | 30 | 30 | 30 | - | 30 |
| width | - | 4.4 mm | 11.5062 mm | 7.5 mm | 11.5062 mm | 4.4 mm | 7.5 mm | 7.62 mm | - | 11.5062 mm |