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ATF750C-15XC

Description
High-speed Complex Programmable Logic Device
CategoryProgrammable logic devices    Programmable logic   
File Size323KB,16 Pages
ManufacturerAtmel (Microchip)
Download Datasheet Parametric Compare View All

ATF750C-15XC Overview

High-speed Complex Programmable Logic Device

ATF750C-15XC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeTSSOP
package instructionTSSOP, TSSOP24,.25
Contacts24
Reach Compliance Codecompli
Other featuresNO
maximum clock frequency55 MHz
In-system programmableNO
JESD-30 codeR-PDSO-G24
JESD-609 codee0
JTAG BSTNO
length7.8 mm
Humidity sensitivity level2
Dedicated input times11
Number of I/O lines10
Number of macro cells10
Number of terminals24
Maximum operating temperature70 °C
Minimum operating temperature
organize11 DEDICATED INPUTS, 10 I/O
Output functionMACROCELL
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP24,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)240
power supply5 V
Programmable logic typeEE PLD
propagation delay15 ns
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage5.25 V
Minimum supply voltage4.75 V
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width4.4 mm
Base Number Matches1
Features
Advanced, High-speed, Electrically-erasable Programmable Logic Device
– Superset of 22V10
– Enhanced Logic Flexibility
– Backward Compatible with ATV750B/BL and ATV750/L
Low-power Edge-sensing “L” Option with 1 mA Standby Current
D- or T-type Flip-flop
Product Term or Direct Input Pin Clocking
7.5 ns Maximum Pin-to-pin Delay with 5V Operation
Highest Density Programmable Logic Available in 24-pin Package
– Advanced Electrically-erasable Technology
– Reprogrammable
– 100% Tested
Increased Logic Flexibility
– 42 Array Inputs, 20 Sum Terms and 20 Flip-flops
Enhanced Output Logic Flexibility
– All 20 Flip-flops Feed Back Internally
– 10 Flip-flops are also Available as Outputs
Programmable Pin-keeper Circuits
Dual-in-line and Surface Mount Package in Standard Pinouts
Commercial and Industrial Temperature Ranges
20-year Data Retention
2000V ESD Protection
1000 Erase/Write Cycles
High-speed
Complex
Programmable
Logic Device
ATF750C
ATF750CL
Block Diagram
(OE PRODUCT TERMS)
12
INPUT
PINS
PROGRAMMABLE
INTERCONNECT
AND
COMBINATORIAL
LOGIC ARRAY
4 TO 8
PRODUCT
TERMS
LOGIC
OPTION
(UP T0 20
FLIP-FLOPS)
OUTPUT
OPTION
10
I/O
PINS
(CLOCK PIN)
Description
The ATF750C(L)s are twice as powerful as most other 24-pin programmable logic
devices. Increased product terms, sum terms, flip-flops and output logic configurations
translate into more usable gates. High-speed logic and uniform, predictable delays
(continued)
Pin Configurations
Pin Name
CLK
IN
I/O
*
VCC
Function
Clock
Logic Inputs
Bi-directional Buffers
No Internal Connection
+5V Supply
DIP/SOIC/TSSOP
CLK/IN
IN
IN
IN
IN
IN
IN
IN
IN
IN
IN
GND
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
VCC
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
IN
PLCC
IN
IN
CLK/IN
*
VCC
I/O
I/O
4
3
2
1
28
27
26
IN
IN
GND
*
IN
I/O
I/O
12
13
14
15
16
17
18
IN
IN
IN
*
IN
IN
IN
5
6
7
8
9
10
11
25
24
23
22
21
20
19
I/O
I/O
I/O
*
I/O
I/O
I/O
Rev. 0776F–01/00
1

ATF750C-15XC Related Products

ATF750C-15XC ATF750CL ATF750C-15JI ATF750C-10SC ATF750C-15JC ATF750C-10XC ATF750C-10SI ATF750C-10PC ATF750C ATF750C-10JC
Description High-speed Complex Programmable Logic Device High-speed Complex Programmable Logic Device High-speed Complex Programmable Logic Device High-speed Complex Programmable Logic Device High-speed Complex Programmable Logic Device High-speed Complex Programmable Logic Device High-speed Complex Programmable Logic Device High-speed Complex Programmable Logic Device High-speed Complex Programmable Logic Device High-speed Complex Programmable Logic Device
Is it Rohs certified? incompatible - incompatible incompatible incompatible incompatible incompatible incompatible - incompatible
Parts packaging code TSSOP - LCC SOIC LCC TSSOP SOIC DIP - LCC
package instruction TSSOP, TSSOP24,.25 - QCCJ, LDCC28,.5SQ SOP, SOP24,.4 QCCJ, LDCC28,.5SQ TSSOP, TSSOP24,.25 SOP, SOP24,.4 DIP, DIP24,.3 - QCCJ, LDCC28,.5SQ
Contacts 24 - 28 24 28 24 24 24 - 28
Reach Compliance Code compli - compli compli compli compli compli compli - compli
Other features NO - NO NO NO NO NO NO - NO
maximum clock frequency 55 MHz - 55 MHz 83 MHz 55 MHz 83 MHz 83 MHz 83 MHz - 83 MHz
In-system programmable NO - NO NO NO NO NO NO - NO
JESD-30 code R-PDSO-G24 - S-PQCC-J28 R-PDSO-G24 S-PQCC-J28 R-PDSO-G24 R-PDSO-G24 R-PDIP-T24 - S-PQCC-J28
JESD-609 code e0 - e0 e0 e0 e0 e0 e0 - e0
JTAG BST NO - NO NO NO NO NO NO - NO
length 7.8 mm - 11.5062 mm 15.4 mm 11.5062 mm 7.8 mm 15.4 mm 31.877 mm - 11.5062 mm
Humidity sensitivity level 2 - 2 2 2 2 2 1 - 2
Dedicated input times 11 - 11 11 11 11 11 11 - 11
Number of I/O lines 10 - 10 10 10 10 10 10 - 10
Number of macro cells 10 - 10 10 10 10 10 10 - 10
Number of terminals 24 - 28 24 28 24 24 24 - 28
Maximum operating temperature 70 °C - 85 °C 70 °C 70 °C 70 °C 85 °C 70 °C - 70 °C
organize 11 DEDICATED INPUTS, 10 I/O - 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O - 11 DEDICATED INPUTS, 10 I/O
Output function MACROCELL - MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL - MACROCELL
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code TSSOP - QCCJ SOP QCCJ TSSOP SOP DIP - QCCJ
Encapsulate equivalent code TSSOP24,.25 - LDCC28,.5SQ SOP24,.4 LDCC28,.5SQ TSSOP24,.25 SOP24,.4 DIP24,.3 - LDCC28,.5SQ
Package shape RECTANGULAR - SQUARE RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR - SQUARE
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - CHIP CARRIER SMALL OUTLINE CHIP CARRIER SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE IN-LINE - CHIP CARRIER
Peak Reflow Temperature (Celsius) 240 - 225 240 225 240 240 225 - 225
power supply 5 V - 5 V 5 V 5 V 5 V 5 V 5 V - 5 V
Programmable logic type EE PLD - EE PLD EE PLD EE PLD EE PLD EE PLD EE PLD - EE PLD
propagation delay 15 ns - 15 ns 10 ns 15 ns 10 ns 10 ns 10 ns - 10 ns
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified
Maximum seat height 1.2 mm - 4.572 mm 2.65 mm 4.572 mm 1.2 mm 2.65 mm 5.334 mm - 4.572 mm
Maximum supply voltage 5.25 V - 5.5 V 5.25 V 5.25 V 5.25 V 5.5 V 5.25 V - 5.25 V
Minimum supply voltage 4.75 V - 4.5 V 4.75 V 4.75 V 4.75 V 4.5 V 4.75 V - 4.75 V
Nominal supply voltage 5 V - 5 V 5 V 5 V 5 V 5 V 5 V - 5 V
surface mount YES - YES YES YES YES YES NO - YES
technology CMOS - CMOS CMOS CMOS CMOS CMOS CMOS - CMOS
Temperature level COMMERCIAL - INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL - COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb)
Terminal form GULL WING - J BEND GULL WING J BEND GULL WING GULL WING THROUGH-HOLE - J BEND
Terminal pitch 0.65 mm - 1.27 mm 1.27 mm 1.27 mm 0.65 mm 1.27 mm 2.54 mm - 1.27 mm
Terminal location DUAL - QUAD DUAL QUAD DUAL DUAL DUAL - QUAD
Maximum time at peak reflow temperature 30 - 30 30 30 30 30 30 - 30
width 4.4 mm - 11.5062 mm 7.5 mm 11.5062 mm 4.4 mm 7.5 mm 7.62 mm - 11.5062 mm
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