EEWORLDEEWORLDEEWORLD

Part Number

Search

1PMT5939CE3/TR7

Description
Zener Diode, 39V V(Z), 2%, 3W, Silicon, Unidirectional, DO-216AA
CategoryDiscrete semiconductor    diode   
File Size111KB,2 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Download Datasheet Parametric View All

1PMT5939CE3/TR7 Overview

Zener Diode, 39V V(Z), 2%, 3W, Silicon, Unidirectional, DO-216AA

1PMT5939CE3/TR7 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid4019155162
package instructionDO-216, 2 PIN
Reach Compliance Codecompliant
Country Of OriginPhilippines
ECCN codeEAR99
Factory Lead Time20 weeks
YTEOL2
Shell connectionCATHODE
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JEDEC-95 codeDO-216AA
JESD-30 codeS-PSSO-G1
Number of components1
Number of terminals1
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
Package shapeSQUARE
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityUNIDIRECTIONAL
Maximum power dissipation3 W
Nominal reference voltage39 V
surface mountYES
technologyZENER
Terminal formGULL WING
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED
Maximum voltage tolerance2%
Working test current9.6 mA
POWERMITE
®
8700 E. Thomas Road
Scottsdale, AZ 85251
Tel: (480) 941-6300
Fax: (480) 947-1503
3.0 WATT
Zener Diodes
1PMT5913B
thru
1PMT5956B
DESCRIPTION
In Microsemi's Powermite surface mount package, these zener diodes
provide power-handling capabilities (3.0
WATTS)
found in larger packages.
In addition to its size advantages, Powermite package features include a
full metallic bottom that eliminates the possibility of solder flux entrapment
during assembly, and a unique locking tab acts as an integral heat sink. Its
innovative design makes this device ideal for use with automatic insertion
equipment.
®
®
DO-216
FEATURES
Surface Mount Packaging
Integral Heat Sink Locking Tabs
Compatible with automatic insertion equipment
Full metallic bottom eliminates flux entrapment
Zener voltage 3.3 to 200 Volts
Low reverse leakage
Tight tolerance available
ESD Rating of >16kV per human body model
CIRCUIT DIAGRAM
MECHANICAL CHARACTERISTICS
Cathode designated by TAB 1
Mounting position any way
Molded package
Weight: 0.016 gram (approximate)
Thermal resistance 30°C/W junction to TAB1
MAXIMUM RATINGS
Junction and storage temperatures: -55°C to +150°C
DC power dissipation: 3.0 watt with TAB 1 60°C
Forward voltage:
@ 200 mA 1.2 volts
Packaging
PACKAGING
EIA Standard 481
Tape & Reel
Tape & Reel EIA Standard 481
7 inch 3,000 pieces
13 inch 12,000 pieces
Mechanical Specifications
Mounting Pad Dimensions
All dimensions +/- .005 inches
Inches
MSC0995.PDF
ISO 9001 CERTIFIED
REV F 11/01/99
ATmega162 key input response speed issue
The compiler used is CodeVisionAVR. The button uses the PD port, and PD0 and PD1 are used for serial port output at the same time. After the program is running, press the button and wait for about 2 s...
xiaojiong886 Microchip MCU
MM32F031 Development Board Review 8: Simulating SPI to Drive 2.2-inch SPI Screen
Some people will look down upon analog SPI, and some will not even look at it. I am very happy. Why? I am a person who sees results. That is to say, if I cannot develop SPI one day, I will not die in ...
ddllxxrr Motor Drive Control(Motor Control)
LIS2DW12 three-axis accelerometer package and code
Data sheet:Code:Package:Official evaluation board gerber file:...
littleshrimp MEMS sensors
[Recommended] AAC, HE-AAC, HE-AAC V2 audio encoder/decoder optimized for ARM9 platform
EEE Audio AAC, HE-AAC, HE-AAC V2 Audio Codec Features: 1) Optimized for ARM9 platform 2) Passed MPEG-4 standard conformance test 3) Support AAC-LC, HE-AAC V1 (SBR) and V2 (PS) 4) Sampling rate 8-48 kh...
hzautek ARM Technology
Wince6.0 startup failure reason
I am running wince6.0 on the AM335X platform and have discovered that during startup, the system occasionally freezes after executing the OEMInit() function. What could be the reason?...
wodehai Embedded System
Sharing the process of WEBENCH design + designing the power supply circuit for 5CEBA2F17I7N
Requirements: Design a power supply circuit for 5CEBA2F17I7N. The design steps are as follows: Step 1, select FPGA,Step 2, view the details and submit project requirements,Step 3, wait for the project...
youzizhile Analogue and Mixed Signal

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 119  807  2562  1323  2526  3  17  52  27  51 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号