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5962-9669107HYX

Description
Standard SRAM, 128KX8, 35ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32
Categorystorage   
File Size1MB,11 Pages
ManufacturerMercury Systems Inc
Download Datasheet Parametric View All

5962-9669107HYX Overview

Standard SRAM, 128KX8, 35ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32

5962-9669107HYX Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMercury Systems Inc
package instructionDIP,
Reach Compliance Codecompliant
ECCN code3A001.A.2.C
Maximum access time35 ns
Other featuresTTL COMPATIBLE INPUTS AND OUTPUTS
JESD-30 codeR-CDIP-T32
JESD-609 codee4
length42.2 mm
memory density1048576 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize128KX8
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusQualified
Filter levelMIL-STD-883
Maximum seat height5.13 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceGold (Au)
Terminal formTHROUGH-HOLE
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1
WMS128K8-XXX
128Kx8 MONOLITHIC SRAM, SMD 5962-96691
FEATURES

Access Times 15, 17, 20, 25, 35, 45, 55ns

Revolutionary, Center Power/Ground Pinout JEDEC
Approved
• 32 lead Ceramic SOJ (Package 101)
• 36 lead Ceramic Flat Pack (Package 226)

Evolutionary, Corner Power/Ground Pinout JEDEC
Approved
• 32 pin Ceramic DIP (Package 300)
• 32 lead Ceramic SOJ (Package 101)
• 32 lead Ceramic Flat Pack (Package 206)
This product is subject to change without notice.

32 pin, Rectangular Ceramic Leadless Chip Carrier
(Package 601)

MIL-STD-883 Compliant Devices Available

Commercial, Industrial and Military Temperature Range

5 Volt Power Supply

Low Power CMOS

2V Data Retention Devices Available (Low Power Version)

TTL Compatible Inputs and Outputs
Revolutionary Pinout
32 DIP
Evolutionary Pinout
32 CSOJ (DE)
36 FLAT PACK
Top View
32 CSOJ (DR)
Top View
32 FLATPACK (FE)
Top View
32 CLCC
Top View
A12
A14
A16
A18
V
CC
A15
A17
4 3 2 1 32 31 30
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
5
6
7
8
9
10
11
12
13
29
28
27
26
25
24
23
22
21
14 15 16 17 18 19 20
I/O1
I/02
V
SS
I/O3
I/O4
I/O5
I/O6
WE#
A13
A8
A9
A11
OE#
A10
CS#
I/O7
NC
A0
A1
A2
A3
CS#
I/O0
I/O1
V
CC
GND
I/O2
I/O3
WE#
A4
A5
A6
A7
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
NC
A16
A15
A14
A13
OE#
I/O7
I/O6
GND
V
CC
I/O5
I/O4
A12
A11
A10
A9
A8
NC
A0
A1
A2
A3
CS#
I/O1
I/O2
V
CC
GND
I/O3
I/O4
WE#
A4
A5
A6
A7
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
A16
A15
A14
A13
OE#
I/O8
I/O7
GND
V
CC
I/O6
I/O5
A12
A11
A10
A9
A8
NC
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
V
CC
A15
NC
WE#
A13
A8
A9
A11
OE#
A10
CS#
I/O7
I/O6
I/O5
I/O4
I/O3
Pin Description
A
0-16
I/O
0-7
CS
OE
WE
V
CC
GND
Address Inputs
Data Input/Output
Chip Select
Output Enable
Write Enable
+5.0V Power
Ground
Microsemi Corporation reserves the right to change products or specifications without notice.
March 2011
Rev. 6
© 2011 Microsemi Corporation. All rights reserved.
1
Microsemi Corporation • (602) 437-1520 • www.microsemi.com
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