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AM29DL322GB70WMI

Description
2M X 16 FLASH 3V PROM, 90 ns, PDSO48
Categorystorage    storage   
File Size865KB,58 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Download Datasheet Parametric View All

AM29DL322GB70WMI Overview

2M X 16 FLASH 3V PROM, 90 ns, PDSO48

AM29DL322GB70WMI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSPANSION
Parts packaging codeBGA
package instruction6 X 12 MM, 0.80 MM PITCH, FBGA-48
Contacts48
Reach Compliance Code_compli
ECCN code3A991.B.1.A
Maximum access time70 ns
Spare memory width8
startup blockBOTTOM
command user interfaceYES
Universal Flash InterfaceYES
Data pollingYES
JESD-30 codeR-PBGA-B48
JESD-609 codee0
length12 mm
memory density33554432 bi
Memory IC TypeFLASH
memory width16
Humidity sensitivity level3
Number of functions1
Number of departments/size8,63
Number of terminals48
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Encapsulate equivalent codeBGA48,6X8,32
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
power supply3/3.3 V
Programming voltage3 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1.2 mm
Department size8K,64K
Maximum standby current0.000005 A
Maximum slew rate0.045 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
switch bitYES
typeNOR TYPE
width6 mm
Am29DL32xG
Data Sheet
RETIRED
PRODUCT
This product has been retired and is not recommended for designs. For new and current designs,
S29JL032H (for TSOP packages) and S29PL032J (for FBGA packages) supersede AM29DL32xG as
the factory-recommended migration path. Please refer to each respective datasheets for specifica-
tions and ordering information. Availability of this document is retained for reference and historical
purposes only.
The following document contains information on Spansion memory products.
Continuity of Specifications
There is no change to this data sheet as a result of offering the device as a Spansion product. Any
changes that have been made are the result of normal data sheet improvement and are noted in the
document revision summary.
For More Information
Please contact your local sales office for additional information about Spansion memory solutions.
Publication Number
25686
Revision
B
Amendment
10
Issue Date
December 4, 2006
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