ISD2548SY datasheet, PDF - EEWORLD Datasheet

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ISD2548SY: DescriptionSpeech Synthesizer With RCDG, 48s, CMOS, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28; CategoryConsumption circuit; File Size353KB，41 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw; Environmental Compliance

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ISD2548SY Overview

Speech Synthesizer With RCDG, 48s, CMOS, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28

ISD2548SY Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Winbond Electronics Corporation
Parts packaging code	SOIC
package instruction	SOP, SOP28,.4
Contacts	28
Reach Compliance Code	unknown
Is Samacsys	N
application	CAR STEREO; HANDSET; TRANSFORMER
Commercial integrated circuit types	SPEECH SYNTHESIZER WITH RCDG
JESD-30 code	R-PDSO-G28
length	17.93 mm
Number of functions	1
Number of terminals	28
On-chip memory type	EEPROM
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP28,.4
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	245
power supply	5 V
Certification status	Not Qualified
Maximum read time	48 s
Maximum seat height	2.64 mm
Maximum slew rate	30 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	7.52 mm
Base Number Matches	1

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ISD2532/40/48/64

SINGLE-CHIP, MULTIPLE-MESSAGES,

VOICE RECORD/PLAYBACK DEVICE

32-, 40-, 48-, AND 64-SECOND DURATION

-1-

Publication Release Date: April 24, 2006

Revision 1.2

ISD2532/40/48/64

4. TABLE OF CONTENTS

1. GENERAL DESCRIPTION.................................................................................................................. 2

2. FEATURES ......................................................................................................................................... 2

3. BLOCK DIAGRAM .............................................................................................................................. 3

4. TABLE OF CONTENTS ...................................................................................................................... 4

5. PIN CONFIGURATION ....................................................................................................................... 5

6. PIN DESCRIPTION ............................................................................................................................. 6

7. FUNCTIONAL DESCRIPTION.......................................................................................................... 10

7.1. Detailed Description.................................................................................................................... 10

7.2. Operational Modes ..................................................................................................................... 11

7.2.1. Operational Modes Description............................................................................................ 12

8. TIMING DIAGRAMS.......................................................................................................................... 16

9. ABSOLUTE MAXIMUM RATINGS.................................................................................................... 19

9.1 Operating Conditions ................................................................................................................... 20

10. ELECTRICAL CHARACTERISTICS ............................................................................................... 21

10.1. Parameters For Packaged Parts .............................................................................................. 21

10.1.1. Typical Parameter Variation with Voltage and Temperature - Packaged Parts ................ 24

10.2. Parameters For Die .................................................................................................................. 25

10.2.1. Typical Parameter Variation with Voltage and Temperature - Die .................................... 28

10.3. Parameters For Push-Button Mode.......................................................................................... 29

11. TYPICAL APPLICATION CIRCUIT ................................................................................................. 30

12. PACKAGE DRAWING AND DIMENSIONS .................................................................................... 35

12.1. 28-Lead 300-Mil Plastic Small Outline IC (SOIC)..................................................................... 35

12.2. 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) ............................................................... 36

12.3. Die Bonding Physical Layout

[1]

................................................................................................ 37

13. ORDERING INFORMATION........................................................................................................... 39

14. VERSION HISTORY ....................................................................................................................... 40

-4-

ISD2548SY Related Products

	ISD2548SY	ISD2532PY	ISD2532SY
Description	Speech Synthesizer With RCDG, 48s, CMOS, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28	Speech Synthesizer With RCDG, 32s, CMOS, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28	Speech Synthesizer With RCDG, 32s, CMOS, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28
Is it Rohs certified?	conform to	conform to	conform to
Maker	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation
Parts packaging code	SOIC	DIP	SOIC
package instruction	SOP, SOP28,.4	DIP, DIP28,.6	SOP, SOP28,.4
Contacts	28	28	28
Reach Compliance Code	unknown	unknown	unknown
application	CAR STEREO; HANDSET; TRANSFORMER	CAR STEREO; HANDSET; TRANSFORMER	CAR STEREO; HANDSET; TRANSFORMER
Commercial integrated circuit types	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG
JESD-30 code	R-PDSO-G28	R-PDIP-T28	R-PDSO-G28
length	17.93 mm	36.83 mm	17.93 mm
Number of functions	1	1	1
Number of terminals	28	28	28
On-chip memory type	EEPROM	EEPROM	EEPROM
Maximum operating temperature	70 °C	70 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	DIP	SOP
Encapsulate equivalent code	SOP28,.4	DIP28,.6	SOP28,.4
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	IN-LINE	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	245	NOT SPECIFIED	245
power supply	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum read time	48 s	32 s	32 s
Maximum seat height	2.64 mm	4.83 mm	2.64 mm
Maximum slew rate	30 mA	30 mA	30 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V
surface mount	YES	NO	YES
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	GULL WING	THROUGH-HOLE	GULL WING
Terminal pitch	1.27 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	40	NOT SPECIFIED	40
width	7.52 mm	15.24 mm	7.52 mm

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