ISD2532PY datasheet, PDF - EEWORLD Datasheet

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ISD2532PY: DescriptionSpeech Synthesizer With RCDG, 32s, CMOS, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28; CategoryAnalog mixed-signal IC Consumption circuit; File Size353KB，41 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw; Environmental Compliance

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ISD2532PY Overview

Speech Synthesizer With RCDG, 32s, CMOS, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28

ISD2532PY Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Winbond Electronics Corporation
Parts packaging code	DIP
package instruction	DIP, DIP28,.6
Contacts	28
Reach Compliance Code	unknown
application	CAR STEREO; HANDSET; TRANSFORMER
Commercial integrated circuit types	SPEECH SYNTHESIZER WITH RCDG
JESD-30 code	R-PDIP-T28
length	36.83 mm
Number of functions	1
Number of terminals	28
On-chip memory type	EEPROM
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum read time	32 s
Maximum seat height	4.83 mm
Maximum slew rate	30 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm

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ISD2532/40/48/64

SINGLE-CHIP, MULTIPLE-MESSAGES,

VOICE RECORD/PLAYBACK DEVICE

32-, 40-, 48-, AND 64-SECOND DURATION

-1-

Publication Release Date: April 24, 2006

Revision 1.2

ISD2532/40/48/64

4. TABLE OF CONTENTS

1. GENERAL DESCRIPTION.................................................................................................................. 2

2. FEATURES ......................................................................................................................................... 2

3. BLOCK DIAGRAM .............................................................................................................................. 3

4. TABLE OF CONTENTS ...................................................................................................................... 4

5. PIN CONFIGURATION ....................................................................................................................... 5

6. PIN DESCRIPTION ............................................................................................................................. 6

7. FUNCTIONAL DESCRIPTION.......................................................................................................... 10

7.1. Detailed Description.................................................................................................................... 10

7.2. Operational Modes ..................................................................................................................... 11

7.2.1. Operational Modes Description............................................................................................ 12

8. TIMING DIAGRAMS.......................................................................................................................... 16

9. ABSOLUTE MAXIMUM RATINGS.................................................................................................... 19

9.1 Operating Conditions ................................................................................................................... 20

10. ELECTRICAL CHARACTERISTICS ............................................................................................... 21

10.1. Parameters For Packaged Parts .............................................................................................. 21

10.1.1. Typical Parameter Variation with Voltage and Temperature - Packaged Parts ................ 24

10.2. Parameters For Die .................................................................................................................. 25

10.2.1. Typical Parameter Variation with Voltage and Temperature - Die .................................... 28

10.3. Parameters For Push-Button Mode.......................................................................................... 29

11. TYPICAL APPLICATION CIRCUIT ................................................................................................. 30

12. PACKAGE DRAWING AND DIMENSIONS .................................................................................... 35

12.1. 28-Lead 300-Mil Plastic Small Outline IC (SOIC)..................................................................... 35

12.2. 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) ............................................................... 36

12.3. Die Bonding Physical Layout

[1]

................................................................................................ 37

13. ORDERING INFORMATION........................................................................................................... 39

14. VERSION HISTORY ....................................................................................................................... 40

-4-

ISD2532PY Related Products

	ISD2532PY	ISD2548SY	ISD2532SY
Description	Speech Synthesizer With RCDG, 32s, CMOS, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28	Speech Synthesizer With RCDG, 48s, CMOS, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28	Speech Synthesizer With RCDG, 32s, CMOS, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28
Is it Rohs certified?	conform to	conform to	conform to
Maker	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation
Parts packaging code	DIP	SOIC	SOIC
package instruction	DIP, DIP28,.6	SOP, SOP28,.4	SOP, SOP28,.4
Contacts	28	28	28
Reach Compliance Code	unknown	unknown	unknown
application	CAR STEREO; HANDSET; TRANSFORMER	CAR STEREO; HANDSET; TRANSFORMER	CAR STEREO; HANDSET; TRANSFORMER
Commercial integrated circuit types	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG
JESD-30 code	R-PDIP-T28	R-PDSO-G28	R-PDSO-G28
length	36.83 mm	17.93 mm	17.93 mm
Number of functions	1	1	1
Number of terminals	28	28	28
On-chip memory type	EEPROM	EEPROM	EEPROM
Maximum operating temperature	70 °C	70 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	SOP
Encapsulate equivalent code	DIP28,.6	SOP28,.4	SOP28,.4
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	245	245
power supply	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum read time	32 s	48 s	32 s
Maximum seat height	4.83 mm	2.64 mm	2.64 mm
Maximum slew rate	30 mA	30 mA	30 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V
surface mount	NO	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	GULL WING	GULL WING
Terminal pitch	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	40	40
width	15.24 mm	7.52 mm	7.52 mm

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