LMU16DME65 datasheet, PDF - EEWORLD Datasheet

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LMU16DME65: DescriptionMultiplier, 16-Bit, CMOS, CDIP64, 0.900 INCH, CAVITY DOWN, HERMETIC SEALED, SIDE BRAZED, DIP-64; CategoryMicrocontrollers and processors; File Size249KB，7 Pages; ManufacturerLOGIC Devices; Websitehttp://www.logicdevices.com/

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LMU16DME65 Overview

Multiplier, 16-Bit, CMOS, CDIP64, 0.900 INCH, CAVITY DOWN, HERMETIC SEALED, SIDE BRAZED, DIP-64

LMU16DME65 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	LOGIC Devices
Parts packaging code	DIP
package instruction	DIP, DIP64,.9
Contacts	64
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Is Samacsys	N
Other features	2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ
boundary scan	NO
maximum clock frequency	15.38 MHz
External data bus width	16
JESD-30 code	R-CDIP-T64
JESD-609 code	e0
length	81.28 mm
low power mode	NO
Humidity sensitivity level	3
Number of terminals	64
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output data bus width	32
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Encapsulate equivalent code	DIP64,.9
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	225
power supply	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883 Class B (Modified)
Maximum seat height	3.81 mm
Maximum slew rate	25 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	22.86 mm
uPs/uCs/peripheral integrated circuit type	DSP PERIPHERAL, MULTIPLIER
Base Number Matches	1

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LMU16DME65 Related Products

	LMU16DME65	LMU16DME55	LMU16DME75	LMU16GME75	LMU216KME65	LMU16PC65	LMU216KME75	LMU216KME55	LMU16PC45
Description	Multiplier, 16-Bit, CMOS, CDIP64, 0.900 INCH, CAVITY DOWN, HERMETIC SEALED, SIDE BRAZED, DIP-64	Multiplier, 16-Bit, CMOS, CDIP64, 0.900 INCH, CAVITY DOWN, HERMETIC SEALED, SIDE BRAZED, DIP-64	Multiplier, 16-Bit, CMOS, CDIP64, 0.900 INCH, CAVITY DOWN, HERMETIC SEALED, SIDE BRAZED, DIP-64	Multiplier, 16-Bit, CMOS, CPGA68, CAVITY-DOWN, PGA-68	Multiplier, 16-Bit, CMOS, CQCC68, 0.950 X 0.950 INCH, CERAMIC, LCC-68	Multiplier, 16-Bit, CMOS, PDIP64, 0.900 INCH, PLASTIC, DIP-64	Multiplier, 16-Bit, CMOS, CQCC68, 0.950 X 0.950 INCH, CERAMIC, LCC-68	Multiplier, 16-Bit, CMOS, CQCC68, 0.950 X 0.950 INCH, CERAMIC, LCC-68	Multiplier, 16-Bit, CMOS, PDIP64, 0.900 INCH, PLASTIC, DIP-64
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	LOGIC Devices	LOGIC Devices	LOGIC Devices	LOGIC Devices	LOGIC Devices	LOGIC Devices	LOGIC Devices	LOGIC Devices	LOGIC Devices
Parts packaging code	DIP	DIP	DIP	PGA	LCC	DIP	LCC	LCC	DIP
package instruction	DIP, DIP64,.9	DIP, DIP64,.9	DIP, DIP64,.9	PGA, PGA68,11X11	QCCN, LCC68,.95SQ	DIP,	QCCN, LCC68,.95SQ	QCCN, LCC68,.95SQ	DIP, DIP64,.9
Contacts	64	64	64	68	68	64	68	68	64
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Other features	2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ	2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ	2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ	2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ	2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ	2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ	2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ	2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ	2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ
boundary scan	NO	NO	NO	NO	NO	NO	NO	NO	NO
maximum clock frequency	15.38 MHz	18.18 MHz	13.33 MHz	13.33 MHz	15.38 MHz	15.38 MHz	13.33 MHz	18.18 MHz	22.22 MHz
External data bus width	16	16	16	16	16	16	16	16	16
JESD-30 code	R-CDIP-T64	R-CDIP-T64	R-CDIP-T64	S-CPGA-P68	S-CQCC-N68	R-PDIP-T64	S-CQCC-N68	S-CQCC-N68	R-PDIP-T64
length	81.28 mm	81.28 mm	81.28 mm	29.21 mm	24.1935 mm	81.28 mm	24.1935 mm	24.1935 mm	81.28 mm
low power mode	NO	NO	NO	NO	NO	NO	NO	NO	NO
Humidity sensitivity level	3	3	3	3	3	3	3	3	3
Number of terminals	64	64	64	68	68	64	68	68	64
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	70 °C	125 °C	125 °C	70 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-	-55 °C	-55 °C	-
Output data bus width	32	32	32	32	32	32	32	32	32
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	PGA	QCCN	DIP	QCCN	QCCN	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	GRID ARRAY	CHIP CARRIER	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.81 mm	3.81 mm	3.81 mm	4.445 mm	3.048 mm	5.588 mm	3.048 mm	3.048 mm	5.588 mm
Maximum slew rate	25 mA	25 mA	25 mA	25 mA	25 mA	25 mA	25 mA	25 mA	25 mA
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.25 V	5.5 V	5.5 V	5.25 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.75 V	4.5 V	4.5 V	4.75 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	YES	NO	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL	MILITARY	MILITARY	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	PIN/PEG	NO LEAD	THROUGH-HOLE	NO LEAD	NO LEAD	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	PERPENDICULAR	QUAD	DUAL	QUAD	QUAD	DUAL
width	22.86 mm	22.86 mm	22.86 mm	29.21 mm	24.1935 mm	22.86 mm	24.1935 mm	24.1935 mm	22.86 mm
uPs/uCs/peripheral integrated circuit type	DSP PERIPHERAL, MULTIPLIER	DSP PERIPHERAL, MULTIPLIER	DSP PERIPHERAL, MULTIPLIER	DSP PERIPHERAL, MULTIPLIER	DSP PERIPHERAL, MULTIPLIER	DSP PERIPHERAL, MULTIPLIER	DSP PERIPHERAL, MULTIPLIER	DSP PERIPHERAL, MULTIPLIER	DSP PERIPHERAL, MULTIPLIER
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	-	3A001.A.2.C	3A001.A.2.C	-
JESD-609 code	e0	e0	e0	e0	e0	-	e0	e0	e0
Encapsulate equivalent code	DIP64,.9	DIP64,.9	DIP64,.9	PGA68,11X11	LCC68,.95SQ	-	LCC68,.95SQ	LCC68,.95SQ	DIP64,.9
Peak Reflow Temperature (Celsius)	225	225	225	225	225	-	225	225	225
power supply	5 V	5 V	5 V	5 V	5 V	-	5 V	5 V	5 V
Filter level	MIL-STD-883 Class B (Modified)	MIL-STD-883 Class B (Modified)	MIL-STD-883 Class B (Modified)	MIL-STD-883 Class B (Modified)	MIL-STD-883 Class B (Modified)	-	MIL-STD-883 Class B (Modified)	MIL-STD-883 Class B (Modified)	-
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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