M29W160EB90N1 datasheet, PDF - EEWORLD Datasheet

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M29W160EB90N1: DescriptionIC FLASH 16M PARALLEL 48TSOP; Categorystorage; File Size583KB，45 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

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M29W160EB90N1 Overview

IC FLASH 16M PARALLEL 48TSOP

M29W160EB90N1 Parametric

Parameter Name	Attribute value
memory type	non-volatile
memory format	flash memory
technology	FLASH - NOR
storage	16Mb （2M x 8，1M x 16）
Write cycle time - words, pages	90ns
interview time	90ns
memory interface	in parallel
Voltage - Power	2.7 V ~ 3.6 V
Operating temperature	0°C ~ 70°C（TA）
Installation type	surface mount
Package/casing	48-TFSOP (0.724", 18.40mm wide)
Supplier device packaging	48-TSOP

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16Mb: 3V Embedded Parallel NOR Flash

Features

Parallel NOR Flash Embedded Memory

M29W160ET, M29W160EB

Features

• Supply voltage

– V

= 2.7–3.6V (program, erase, read)

• Access times

– 70, 90ns

• Program time

– 10µs per byte/word (TYP)

• Memory organization

– 3 parameter and 31 main blocks

– 1 boot block (top or bottom location)

• Program/erase controller

– Embedded byte/word program algorithms

• Erase suspend and resume capability

– Read or program another block during an ERASE

SUSPEND operation

• UNLOCK BYPASS PROGRAM COMMAND

– Fast buffered/batch programming

• Temporary block unprotect mode

• Common Flash interface

– 64-bit security code

• Low power consumption: Standby and automatic

mode

• 100,000 PROGRAM/ERASE cycles per block

• Electronic signature

– Manufacturer code: 0020h

– Top device code M29W160ET: 22C4h

– Bottom device code M29W160EB: 2249h

• Packages

– 48-pin TSOP (N) 12mm x 20mm

– 48-ball TFBGA (ZA) 6mm x 8mm

– 64-ball FBGA (ZS) 11mm x 13mm

• Automotive grade parts available

PDF: 09005aef84e1488c

m29W_160e.pdf - Rev. B 06/13 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

16Mb: 3V Embedded Parallel NOR Flash

Features

Contents

General Description ......................................................................................................................................... 6

Signal Assignments ........................................................................................................................................... 8

Signal Descriptions ......................................................................................................................................... 11

Memory Organization .................................................................................................................................... 13

Memory Configuration ............................................................................................................................... 13

Memory Map, x8 – 16Mb Density ................................................................................................................ 13

Memory Map, x16 – 16Mb Density .............................................................................................................. 14

Bus Operations ............................................................................................................................................... 15

Read .......................................................................................................................................................... 15

Write .......................................................................................................................................................... 15

Standby and Automatic Standby ................................................................................................................. 15

Output Disable ........................................................................................................................................... 16

Commands .................................................................................................................................................... 16

READ Operations ........................................................................................................................................... 17

READ/RESET Command ............................................................................................................................ 17

READ CFI Command .................................................................................................................................. 17

AUTO SELECT Operations .............................................................................................................................. 18

AUTO SELECT Command ........................................................................................................................... 18

Read Device ID ............................................................................................................................................... 18

Block and Chip Protection .............................................................................................................................. 19

BLOCK PROTECT Command ...................................................................................................................... 19

Block Protection Using Programmer Equipment .......................................................................................... 20

In-System Block Protection ......................................................................................................................... 22

BYPASS Operations ......................................................................................................................................... 24

UNLOCK BYPASS Command ...................................................................................................................... 24

UNLOCK BYPASS RESET Command ............................................................................................................ 24

PROGRAM Operations .................................................................................................................................... 24

PROGRAM Command ................................................................................................................................ 24

UNLOCK BYPASS PROGRAM Command ..................................................................................................... 24

ERASE Operations .......................................................................................................................................... 25

CHIP ERASE Command .............................................................................................................................. 25

BLOCK ERASE Command ........................................................................................................................... 25

ERASE SUSPEND Command ....................................................................................................................... 26

ERASE RESUME Command ........................................................................................................................ 26

Status Register ................................................................................................................................................ 27

Data Polling Bit (DQ7) ................................................................................................................................ 27

Toggle Bit (DQ6) ......................................................................................................................................... 27

Error Bit (DQ5) ........................................................................................................................................... 27

Erase Timer Bit (DQ3) ................................................................................................................................. 28

Alternative Toggle Bit (DQ2) ........................................................................................................................ 28

Absolute Ratings and Operating Conditions ..................................................................................................... 31

DC Characteristics .......................................................................................................................................... 33

Read AC Characteristics .................................................................................................................................. 34

Write AC Characteristics ................................................................................................................................. 36

Program/Erase Characteristics ........................................................................................................................ 40

Reset Characteristics ...................................................................................................................................... 41

Package Dimensions ....................................................................................................................................... 42

Revision History ............................................................................................................................................. 45

Rev. B – 06/13 ............................................................................................................................................. 45

Rev. A – 07/12 ............................................................................................................................................. 45

PDF: 09005aef84e1488c

m29W_160e.pdf - Rev. B 06/13 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

16Mb: 3V Embedded Parallel NOR Flash

Features

List of Figures

Figure 1: Logic Diagram ................................................................................................................................... 7

Figure 2: 48-Pin TSOP 160ET/B ........................................................................................................................ 8

Figure 3: 48-Ball TFBGA 160ET/B ..................................................................................................................... 9

Figure 4: 64-Ball FBGA 160ET/B ..................................................................................................................... 10

Figure 5: Block Protect Flowchart – Programmer Equipment ........................................................................... 20

Figure 6: Chip Unprotect Flowchart – Programmer Equipment ....................................................................... 21

Figure 7: Block Protect Flowchart – In-System Equipment ............................................................................... 22

Figure 8: Chip Protection Flowchart – In-System Equipment ........................................................................... 23

Figure 9: Data Polling Flowchart .................................................................................................................... 29

Figure 10: Data Toggle Flowchart ................................................................................................................... 30

Figure 11: AC Measurement Load Circuit ....................................................................................................... 32

Figure 12: AC Measurement I/O Waveform ..................................................................................................... 32

Figure 13: Random AC Timing ....................................................................................................................... 35

Figure 14: WE#-Controlled AC Timing ............................................................................................................ 37

Figure 15: CE#-Controlled AC Timing ............................................................................................................. 39

Figure 16: Reset/Block Temporary Unprotect AC Waveforms ........................................................................... 41

Figure 17: 48-Pin TSOP – 12mm x 20mm ........................................................................................................ 42

Figure 18: 48-Ball TFBGA – 6mm x 8mm ......................................................................................................... 43

Figure 19: 64-Ball FBGA – 11mm x 13mm ....................................................................................................... 44

PDF: 09005aef84e1488c

m29W_160e.pdf - Rev. B 06/13 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

16Mb: 3V Embedded Parallel NOR Flash

Features

List of Tables

Table 1: Part Number Information ................................................................................................................... 2

Table 2: Signal Names ...................................................................................................................................... 7

Table 3: Signal Descriptions ........................................................................................................................... 11

Table 4: x8 Top Boot, Blocks [34:0] .................................................................................................................. 13

Table 5: x8 Bottom Boot, Blocks [34:0] ............................................................................................................ 13

Table 6: x16 Top Boot, Blocks [34:0] ................................................................................................................ 14

Table 7: x16 Bottom Boot, Blocks [34:0] .......................................................................................................... 14

Table 8: Bus Operations ................................................................................................................................. 15

Table 9: Commands – 16-Bit Mode (BYTE# = V

) ............................................................................................ 16

Table 10: Commands – 8-Bit Mode (BYTE# = V

) ............................................................................................ 17

Table 11: Read Electronic Signature ............................................................................................................... 18

Table 12: Block and Chip Protection Signal Settings ........................................................................................ 19

Table 13: Status Register Bits .......................................................................................................................... 28

Table 14: Absolute Maximum/Minimum Ratings ............................................................................................ 31

Table 15: Operating Conditions ...................................................................................................................... 31

Table 16: Input/Output Capacitance .............................................................................................................. 32

Table 17: DC Current Characteristics .............................................................................................................. 33

Table 18: DC Voltage Characteristics .............................................................................................................. 33

Table 19: Read AC Characteristics .................................................................................................................. 34

Table 20: WE#-Controlled Write AC Characteristics ......................................................................................... 36

Table 21: CE#-Controlled Write AC Characteristics ......................................................................................... 38

Table 22: Program/Erase Times and Endurance Cycles ................................................................................... 40

Table 23: Reset/Block Temporary Unprotect AC Characteristics ...................................................................... 41

PDF: 09005aef84e1488c

m29W_160e.pdf - Rev. B 06/13 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

M29W160EB90N1 Related Products

	M29W160EB90N1	M29W160EB70N3F TR	M29W160EB80ZA3SE TR	M29W160ET70N3F TR	M29W160ET7AZA6F TR	M29W160EB90N6	M29W160EB7AZA6F TR
Description	IC FLASH 16M PARALLEL 48TSOP	IC FLASH 16M PARALLEL 48TSOP	IC FLASH 16M PARALLEL 48TFBGA	IC FLASH 16M PARALLEL 48TSOP	IC FLASH 16M PARALLEL 48TFBGA	IC FLASH 16M PARALLEL 48TSOP	IC FLASH 16M PARALLEL 48TFBGA
technology	FLASH - NOR	FLASH - NOR	FLASH - NOR	FLASH - NOR	FLASH - NOR	CMOS	FLASH - NOR
memory type	non-volatile	non-volatile	non-volatile	non-volatile	non-volatile	-	non-volatile
memory format	flash memory	flash memory	flash memory	flash memory	flash memory	-	flash memory
storage	16Mb （2M x 8，1M x 16）	16Mb （2M x 8，1M x 16）	16Mb （2M x 8，1M x 16）	16Mb （2M x 8，1M x 16）	16Mb （2M x 8，1M x 16）	-	16Mb （2M x 8，1M x 16）
Write cycle time - words, pages	90ns	70ns	80ns	70ns	70ns	-	70ns
interview time	90ns	70ns	80ns	70ns	70ns	-	70ns
memory interface	in parallel	in parallel	in parallel	in parallel	in parallel	-	in parallel
Voltage - Power	2.7 V ~ 3.6 V	2.7 V ~ 3.6 V	2.7 V ~ 3.6 V	2.7 V ~ 3.6 V	2.7 V ~ 3.6 V	-	2.7 V ~ 3.6 V
Operating temperature	0°C ~ 70°C（TA）	-40°C ~ 125°C（TA）	-40°C ~ 125°C（TA）	-40°C ~ 125°C（TA）	-40°C ~ 85°C（TA）	-	-40°C ~ 85°C（TA）
Installation type	surface mount	surface mount	surface mount	surface mount	surface mount	-	surface mount
Package/casing	48-TFSOP (0.724", 18.40mm wide)	48-TFSOP (0.724", 18.40mm wide)	48-TFBGA	48-TFSOP (0.724", 18.40mm wide)	48-TFBGA	-	48-TFBGA
Supplier device packaging	48-TSOP	48-TSOP	48-TFBGA（6x8）	48-TSOP	48-TFBGA（6x8）	-	48-TFBGA（6x8）

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