16Mb: 3V Embedded Parallel NOR Flash
Features
Parallel NOR Flash Embedded Memory
M29W160ET, M29W160EB
Features
• Supply voltage
– V
CC
= 2.7–3.6V (program, erase, read)
• Access times
– 70, 90ns
• Program time
– 10µs per byte/word (TYP)
• Memory organization
– 3 parameter and 31 main blocks
– 1 boot block (top or bottom location)
• Program/erase controller
– Embedded byte/word program algorithms
• Erase suspend and resume capability
– Read or program another block during an ERASE
SUSPEND operation
• UNLOCK BYPASS PROGRAM COMMAND
– Fast buffered/batch programming
• Temporary block unprotect mode
• Common Flash interface
– 64-bit security code
• Low power consumption: Standby and automatic
mode
• 100,000 PROGRAM/ERASE cycles per block
• Electronic signature
– Manufacturer code: 0020h
– Top device code M29W160ET: 22C4h
– Bottom device code M29W160EB: 2249h
• Packages
– 48-pin TSOP (N) 12mm x 20mm
– 48-ball TFBGA (ZA) 6mm x 8mm
– 64-ball FBGA (ZS) 11mm x 13mm
• Automotive grade parts available
PDF: 09005aef84e1488c
m29W_160e.pdf - Rev. B 06/13 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2012 Micron Technology, Inc. All rights reserved.
16Mb: 3V Embedded Parallel NOR Flash
Features
Part Numbering Information
Devices are shipped from the factory with memory content bits erased to 1. For available options, such as pack-
ages or speed, or for further information, contact your Micron sales representative. Part numbers can be verified at
www.micron.com.
Feature and specification comparison by device type is available at
www.micron.com/products.
Contact the factory for devices not found.
Table 1: Part Number Information
Part Number
Category
Device Type
Operating Voltage
Device function
Configuration
Speed
Category Details
M29 = Parallel Flash memory
W = 2.7 to 3.6V
160E = 16Mb memory array
T = Top boot
B = Bottom boot
7A = 70ns
70 = 70 ns
80 = 80ns
90 = 90ns
Package
N = 48-pin TSOP, 12mm x 20mm
ZA = 48-ball TFBGA, 6mm x 8mm, 0.80mm pitch
ZS = 64-ball Fortified BGA, 11mm x 13mm, 1mm pitch
Temperature Range
Voltage Extension
Shipping Options
6 = –40° to 85°C
3 = –40°C to 125°C
Blank = Standard option
S = V
CC,min
extension to 2.5V of V
CC
and available only with 80ns speed class option
Blank = Standard packing
T = Tape and reel packing
E = RoHS-compliant package, standard packing
F = RoHS-compliant package, tape and reel packing
Notes:
1. Device speed in conjunction with temperature range = 6 to denote automotive grade (–40° to 85°C) parts.
2. Device speed in conjunction with temperature range = 6 to denote industrial grade (–40° to 85°C) parts, or
in conjunction with temperature range = 3 to denote automotive grade (–40° to 125°C) parts.
3. Access time, automotive device, in conjunction with temperature range = 3 and voltage extension = S.
4. Device speed in conjunction with temperature range = 6 to denote industrial grade (–40° to 85°C) parts.
1
2
3
4
Notes
PDF: 09005aef84e1488c
m29W_160e.pdf - Rev. B 06/13 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2012 Micron Technology, Inc. All rights reserved.
16Mb: 3V Embedded Parallel NOR Flash
Features
Contents
General Description ......................................................................................................................................... 6
Signal Assignments ........................................................................................................................................... 8
Signal Descriptions ......................................................................................................................................... 11
Memory Organization .................................................................................................................................... 13
Memory Configuration ............................................................................................................................... 13
Memory Map, x8 – 16Mb Density ................................................................................................................ 13
Memory Map, x16 – 16Mb Density .............................................................................................................. 14
Bus Operations ............................................................................................................................................... 15
Read .......................................................................................................................................................... 15
Write .......................................................................................................................................................... 15
Standby and Automatic Standby ................................................................................................................. 15
Output Disable ........................................................................................................................................... 16
Commands .................................................................................................................................................... 16
READ Operations ........................................................................................................................................... 17
READ/RESET Command ............................................................................................................................ 17
READ CFI Command .................................................................................................................................. 17
AUTO SELECT Operations .............................................................................................................................. 18
AUTO SELECT Command ........................................................................................................................... 18
Read Device ID ............................................................................................................................................... 18
Block and Chip Protection .............................................................................................................................. 19
BLOCK PROTECT Command ...................................................................................................................... 19
Block Protection Using Programmer Equipment .......................................................................................... 20
In-System Block Protection ......................................................................................................................... 22
BYPASS Operations ......................................................................................................................................... 24
UNLOCK BYPASS Command ...................................................................................................................... 24
UNLOCK BYPASS RESET Command ............................................................................................................ 24
PROGRAM Operations .................................................................................................................................... 24
PROGRAM Command ................................................................................................................................ 24
UNLOCK BYPASS PROGRAM Command ..................................................................................................... 24
ERASE Operations .......................................................................................................................................... 25
CHIP ERASE Command .............................................................................................................................. 25
BLOCK ERASE Command ........................................................................................................................... 25
ERASE SUSPEND Command ....................................................................................................................... 26
ERASE RESUME Command ........................................................................................................................ 26
Status Register ................................................................................................................................................ 27
Data Polling Bit (DQ7) ................................................................................................................................ 27
Toggle Bit (DQ6) ......................................................................................................................................... 27
Error Bit (DQ5) ........................................................................................................................................... 27
Erase Timer Bit (DQ3) ................................................................................................................................. 28
Alternative Toggle Bit (DQ2) ........................................................................................................................ 28
Absolute Ratings and Operating Conditions ..................................................................................................... 31
DC Characteristics .......................................................................................................................................... 33
Read AC Characteristics .................................................................................................................................. 34
Write AC Characteristics ................................................................................................................................. 36
Program/Erase Characteristics ........................................................................................................................ 40
Reset Characteristics ...................................................................................................................................... 41
Package Dimensions ....................................................................................................................................... 42
Revision History ............................................................................................................................................. 45
Rev. B – 06/13 ............................................................................................................................................. 45
Rev. A – 07/12 ............................................................................................................................................. 45
PDF: 09005aef84e1488c
m29W_160e.pdf - Rev. B 06/13 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2012 Micron Technology, Inc. All rights reserved.
16Mb: 3V Embedded Parallel NOR Flash
Features
List of Figures
Figure 1: Logic Diagram ................................................................................................................................... 7
Figure 2: 48-Pin TSOP 160ET/B ........................................................................................................................ 8
Figure 3: 48-Ball TFBGA 160ET/B ..................................................................................................................... 9
Figure 4: 64-Ball FBGA 160ET/B ..................................................................................................................... 10
Figure 5: Block Protect Flowchart – Programmer Equipment ........................................................................... 20
Figure 6: Chip Unprotect Flowchart – Programmer Equipment ....................................................................... 21
Figure 7: Block Protect Flowchart – In-System Equipment ............................................................................... 22
Figure 8: Chip Protection Flowchart – In-System Equipment ........................................................................... 23
Figure 9: Data Polling Flowchart .................................................................................................................... 29
Figure 10: Data Toggle Flowchart ................................................................................................................... 30
Figure 11: AC Measurement Load Circuit ....................................................................................................... 32
Figure 12: AC Measurement I/O Waveform ..................................................................................................... 32
Figure 13: Random AC Timing ....................................................................................................................... 35
Figure 14: WE#-Controlled AC Timing ............................................................................................................ 37
Figure 15: CE#-Controlled AC Timing ............................................................................................................. 39
Figure 16: Reset/Block Temporary Unprotect AC Waveforms ........................................................................... 41
Figure 17: 48-Pin TSOP – 12mm x 20mm ........................................................................................................ 42
Figure 18: 48-Ball TFBGA – 6mm x 8mm ......................................................................................................... 43
Figure 19: 64-Ball FBGA – 11mm x 13mm ....................................................................................................... 44
PDF: 09005aef84e1488c
m29W_160e.pdf - Rev. B 06/13 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2012 Micron Technology, Inc. All rights reserved.
16Mb: 3V Embedded Parallel NOR Flash
Features
List of Tables
Table 1: Part Number Information ................................................................................................................... 2
Table 2: Signal Names ...................................................................................................................................... 7
Table 3: Signal Descriptions ........................................................................................................................... 11
Table 4: x8 Top Boot, Blocks [34:0] .................................................................................................................. 13
Table 5: x8 Bottom Boot, Blocks [34:0] ............................................................................................................ 13
Table 6: x16 Top Boot, Blocks [34:0] ................................................................................................................ 14
Table 7: x16 Bottom Boot, Blocks [34:0] .......................................................................................................... 14
Table 8: Bus Operations ................................................................................................................................. 15
Table 9: Commands – 16-Bit Mode (BYTE# = V
IL
) ............................................................................................ 16
Table 10: Commands – 8-Bit Mode (BYTE# = V
IL
) ............................................................................................ 17
Table 11: Read Electronic Signature ............................................................................................................... 18
Table 12: Block and Chip Protection Signal Settings ........................................................................................ 19
Table 13: Status Register Bits .......................................................................................................................... 28
Table 14: Absolute Maximum/Minimum Ratings ............................................................................................ 31
Table 15: Operating Conditions ...................................................................................................................... 31
Table 16: Input/Output Capacitance .............................................................................................................. 32
Table 17: DC Current Characteristics .............................................................................................................. 33
Table 18: DC Voltage Characteristics .............................................................................................................. 33
Table 19: Read AC Characteristics .................................................................................................................. 34
Table 20: WE#-Controlled Write AC Characteristics ......................................................................................... 36
Table 21: CE#-Controlled Write AC Characteristics ......................................................................................... 38
Table 22: Program/Erase Times and Endurance Cycles ................................................................................... 40
Table 23: Reset/Block Temporary Unprotect AC Characteristics ...................................................................... 41
PDF: 09005aef84e1488c
m29W_160e.pdf - Rev. B 06/13 EN
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2012 Micron Technology, Inc. All rights reserved.
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