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M29W160EB90N6

Description
IC FLASH 16M PARALLEL 48TSOP
Categorystorage    storage   
File Size583KB,45 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
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M29W160EB90N6 Overview

IC FLASH 16M PARALLEL 48TSOP

M29W160EB90N6 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicron Technology
package instruction12 X 20 MM, TSOP-48
Reach Compliance Codeunknown
Maximum access time90 ns
Spare memory width8
startup blockBOTTOM
JESD-30 codeR-PDSO-G48
length18.4 mm
memory density16777216 bit
Memory IC TypeFLASH
memory width16
Number of functions1
Number of terminals48
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/SerialPARALLEL
Programming voltage3 V
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
typeNOR TYPE
width12 mm
16Mb: 3V Embedded Parallel NOR Flash
Features
Parallel NOR Flash Embedded Memory
M29W160ET, M29W160EB
Features
• Supply voltage
– V
CC
= 2.7–3.6V (program, erase, read)
• Access times
– 70, 90ns
• Program time
– 10µs per byte/word (TYP)
• Memory organization
– 3 parameter and 31 main blocks
– 1 boot block (top or bottom location)
• Program/erase controller
– Embedded byte/word program algorithms
• Erase suspend and resume capability
– Read or program another block during an ERASE
SUSPEND operation
• UNLOCK BYPASS PROGRAM COMMAND
– Fast buffered/batch programming
• Temporary block unprotect mode
• Common Flash interface
– 64-bit security code
• Low power consumption: Standby and automatic
mode
• 100,000 PROGRAM/ERASE cycles per block
• Electronic signature
– Manufacturer code: 0020h
– Top device code M29W160ET: 22C4h
– Bottom device code M29W160EB: 2249h
• Packages
– 48-pin TSOP (N) 12mm x 20mm
– 48-ball TFBGA (ZA) 6mm x 8mm
– 64-ball FBGA (ZS) 11mm x 13mm
• Automotive grade parts available
PDF: 09005aef84e1488c
m29W_160e.pdf - Rev. B 06/13 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2012 Micron Technology, Inc. All rights reserved.

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Description IC FLASH 16M PARALLEL 48TSOP IC FLASH 16M PARALLEL 48TSOP IC FLASH 16M PARALLEL 48TSOP IC FLASH 16M PARALLEL 48TFBGA IC FLASH 16M PARALLEL 48TSOP IC FLASH 16M PARALLEL 48TFBGA IC FLASH 16M PARALLEL 48TFBGA
technology CMOS FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR
memory type - non-volatile non-volatile non-volatile non-volatile non-volatile non-volatile
memory format - flash memory flash memory flash memory flash memory flash memory flash memory
storage - 16Mb (2M x 8,1M x 16) 16Mb (2M x 8,1M x 16) 16Mb (2M x 8,1M x 16) 16Mb (2M x 8,1M x 16) 16Mb (2M x 8,1M x 16) 16Mb (2M x 8,1M x 16)
Write cycle time - words, pages - 90ns 70ns 80ns 70ns 70ns 70ns
interview time - 90ns 70ns 80ns 70ns 70ns 70ns
memory interface - in parallel in parallel in parallel in parallel in parallel in parallel
Voltage - Power - 2.7 V ~ 3.6 V 2.7 V ~ 3.6 V 2.7 V ~ 3.6 V 2.7 V ~ 3.6 V 2.7 V ~ 3.6 V 2.7 V ~ 3.6 V
Operating temperature - 0°C ~ 70°C(TA) -40°C ~ 125°C(TA) -40°C ~ 125°C(TA) -40°C ~ 125°C(TA) -40°C ~ 85°C(TA) -40°C ~ 85°C(TA)
Installation type - surface mount surface mount surface mount surface mount surface mount surface mount
Package/casing - 48-TFSOP (0.724", 18.40mm wide) 48-TFSOP (0.724", 18.40mm wide) 48-TFBGA 48-TFSOP (0.724", 18.40mm wide) 48-TFBGA 48-TFBGA
Supplier device packaging - 48-TSOP 48-TSOP 48-TFBGA(6x8) 48-TSOP 48-TFBGA(6x8) 48-TFBGA(6x8)
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