TMS320C6727ZDHA250 datasheet, PDF

Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> TMS320C6727ZDHA250

TMS320C6727ZDHA250: DescriptionIC FLOATING POINT DSP 256-BGA; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，114 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

Stay tuned Parametric Compare

TMS320C6727ZDHA250 Overview

IC FLOATING POINT DSP 256-BGA

TMS320C6727ZDHA250 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	BGA, BGA256,16X16,40
Contacts	256
Reach Compliance Code	unknown
Other features	32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY
Address bus width	32
barrel shifter	NO
bit size	32
boundary scan	YES
maximum clock frequency	25 MHz
External data bus width	32
Format	FLOATING POINT
Internal bus architecture	MULTIPLE
JESD-30 code	S-PBGA-B256
length	17 mm
low power mode	NO
Number of terminals	256
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA256,16X16,40
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.2,3.3 V
Certification status	Not Qualified
RAM (number of words)	262144
Maximum seat height	2.02 mm
Maximum supply voltage	1.32 V
Minimum supply voltage	1.14 V
Nominal supply voltage	1.2 V
surface mount	YES
technology	CMOS
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	17 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER

TMS320C6727ZDHA250 Related Products

	TMS320C6727ZDHA250	TMS320C6727ZDH300	TMS320C6727GDH300	TMS320C6722RFPA225	TMS320C6726RFPA225	TMS320C6727GDH250	TMS320C6727GDHA250	TMS320C6727ZDH250	TMS320C6726RFP250	TMS320C6722RFP250
Description	IC FLOATING POINT DSP 256-BGA	Digital Signal Processors & Controllers - DSP, DSC Floating-Pt Dig Sig Proc	Digital Signal Processors & Controllers - DSP, DSC Floating-Pt Dig Sig Proc	IC FLOATING POINT DSP 144-HTQFP	IC FLOATING POINT DSP 144-HTQFP	IC FLOATING POINT DSP 256-BGA	IC FLOATING POINT DSP 256-BGA	IC FLOATING POINT DSP 256-BGA	IC FLOATING-POINT DSP 144-HTQFP	IC FLOATING-POINT DSP 144-HTQFP
Is it Rohs certified?	conform to	conform to	incompatible	conform to	conform to	incompatible	incompatible	conform to	conform to	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	BGA	BGA	BGA	QFP	QFP	BGA	BGA	BGA	QFP	QFP
package instruction	BGA, BGA256,16X16,40	BGA, BGA256,16X16,40	BGA, BGA256,16X16,40	HTFQFP, TQFP144,.9SQ	HTFQFP, TQFP144,.9SQ	BGA, BGA256,16X16,40	BGA, BGA256,16X16,40	BGA, BGA256,16X16,40	HTFQFP, TQFP144,.9SQ	HTFQFP, TQFP144,.9SQ
Contacts	256	256	256	144	144	256	256	256	144	144
Reach Compliance Code	unknown	unknow	_compli	unknown	unknown	not_compliant	not_compliant	unknown	unknown	not_compliant
Other features	32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY	32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY	32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY	32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY	32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY	32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY	32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY	32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY	32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY	32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY
Address bus width	32	32	32	32	32	32	32	32	32	32
barrel shifter	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
bit size	32	32	32	32	32	32	32	32	32	32
boundary scan	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
maximum clock frequency	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz
External data bus width	32	32	32	32	32	32	32	32	32	32
Format	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
Internal bus architecture	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE
JESD-30 code	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PQFP-G144	S-PQFP-G144	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PQFP-G144	S-PQFP-G144
length	17 mm	17 mm	17 mm	20 mm	20 mm	17 mm	17 mm	17 mm	20 mm	20 mm
low power mode	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
Number of terminals	256	256	256	144	144	256	256	256	144	144
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	HTFQFP	HTFQFP	BGA	BGA	BGA	HTFQFP	HTFQFP
Encapsulate equivalent code	BGA256,16X16,40	BGA256,16X16,40	BGA256,16X16,40	TQFP144,.9SQ	TQFP144,.9SQ	BGA256,16X16,40	BGA256,16X16,40	BGA256,16X16,40	TQFP144,.9SQ	TQFP144,.9SQ
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	GRID ARRAY	GRID ARRAY	GRID ARRAY	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	260	NOT SPECIFIED	260	260	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	260	NOT SPECIFIED
power supply	1.2,3.3 V	1.2,3.3 V	1.2,3.3 V	1.2,3.3 V	1.2,3.3 V	1.2,3.3 V	1.2,3.3 V	1.2,3.3 V	1.2,3.3 V	1.2,3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (number of words)	262144	262144	262144	262144	262144	262144	262144	262144	262144	262144
Maximum seat height	2.02 mm	2.02 mm	2.02 mm	1.2 mm	1.2 mm	2.02 mm	2.02 mm	2.02 mm	1.2 mm	1.2 mm
Maximum supply voltage	1.32 V	1.32 V	1.32 V	1.32 V	1.32 V	1.32 V	1.32 V	1.32 V	1.32 V	1.32 V
Minimum supply voltage	1.14 V	1.14 V	1.14 V	1.14 V	1.14 V	1.14 V	1.14 V	1.14 V	1.14 V	1.14 V
Nominal supply voltage	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal form	BALL	BALL	BALL	GULL WING	GULL WING	BALL	BALL	BALL	GULL WING	GULL WING
Terminal pitch	1 mm	1 mm	1 mm	0.5 mm	0.5 mm	1 mm	1 mm	1 mm	0.5 mm	0.5 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	QUAD	QUAD	BOTTOM	BOTTOM	BOTTOM	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	17 mm	17 mm	17 mm	20 mm	20 mm	17 mm	17 mm	17 mm	20 mm	20 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER

Recommended Resources

LED backlight driver module circuit diagram

Highly integrated analog front-end signal conditioning circuit diagram

Light-controlled bidirectional rotation motor drive circuit

Quartz Crystal Temperature/Frequency Circuit

Bridge structure of magnetoresistive element

SONY G3F-K power supply-2

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components