DSPIC33EP256MU806T-E/MR datasheet, PDF

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DSPIC33EP256MU806T-E/MR: Description16-BIT, FLASH, 60 MHz, MICROCONTROLLER, PQCC64, 9 X 9 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, QFN-64; CategoryThe embedded processor and controller Microcontrollers and processors; File Size10MB，614 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com; Environmental Compliance

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DSPIC33EP256MU806T-E/MR Overview

16-BIT, FLASH, 60 MHz, MICROCONTROLLER, PQCC64, 9 X 9 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, QFN-64

DSPIC33EP256MU806T-E/MR Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Microchip
Parts packaging code	QFN
package instruction	QFN-64
Contacts	64
Reach Compliance Code	compli
ECCN code	3A991.A.2
Factory Lead Time	10 weeks
Has ADC	YES
Address bus width
bit size	16
boundary scan	YES
CPU series	DSPIC33
maximum clock frequency	60 MHz
DAC channel	NO
DMA channel	YES
External data bus width
Format	FLOATING-POINT
Integrated cache	NO
JESD-30 code	S-PQCC-N64
JESD-609 code	e3
length	9 mm
low power mode	YES
Humidity sensitivity level	3
Number of DMA channels	15
Number of external interrupt devices	5
Number of I/O lines	51
Number of serial I/Os
Number of terminals	64
Number of timers	9
On-chip data RAM width	8
On-chip program ROM width	8
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	HVQCCN
Encapsulate equivalent code	LCC64,.35SQ,20
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Certification status	Not Qualified
RAM (bytes)	28672
rom(word)	286720
ROM programmability	FLASH
Maximum seat height	1 mm
speed	60 MHz
Maximum slew rate	320 mA
Maximum supply voltage	3.6 V
Minimum supply voltage	3 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Matte Tin (Sn)
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	40
width	9 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

User Manual

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dsPIC33EPXXX(GP/MC/MU)806/810/814

and PIC24EPXXX(GP/GU)810/814

16-bit Microcontrollers and Digital Signal Controllers (up to 512 KB Flash

and 52 KB SRAM) with High-Speed PWM, USB, and Advanced Analog

Operating Conditions

• 3.0V to 3.6V, -40ºC to +125ºC, DC to 60 MIPS

•

3.0V to 3.6V, -40ºC to +85ºC, DC to 70 MIPS

Timers/Output Compare/Input Capture

• 27 General Purpose Timers:

- Nine 16-bit and up to four 32-bit Timers/Counters

- 16 OC modules configurable as Timers/Counters

- Two 32-bit Quadrature Encoder Interface (QEI)

modules configurable as Timers/Counters

• 16 IC modules

• Peripheral Pin Select (PPS) to allow function remap

• Real-Time Clock and Calendar (RTCC) module

Core: 16-bit dsPIC33E/PIC24E CPU

•

Code-efficient (C and Assembly) architecture

Two 40-bit wide accumulators

Single-cycle (MAC/MPY) with dual data fetch

Single-cycle mixed-sign MUL plus hardware divide

32-bit multiply support

Clock Management

•

2% internal oscillator

Programmable PLLs and oscillator clock sources

Fail-Safe Clock Monitor (FSCM)

Independent Watchdog Timer

Fast wake-up and start-up

Communication Interfaces

• USB 2.0 OTG-compliant full-speed interface

• Four UART modules (15 Mbps)

- Supports LIN 2.0 protocols and IrDA

• Four 4-wire SPI modules (15 Mbps)

• Two ECAN™ modules (1 Mbaud) CAN 2.0B support

• Two I

C modules (up to 1 Mbaud) with SMBus support

• Data Converter Interface (DCI) module with support for

S and Audio codecs

• PPS to allow function remap

• Parallel Master Port (PMP)

• Programmable Cyclic Redundancy Check (CRC)

Power Management

•

Low-power management modes (Sleep, Idle, Doze)

Integrated Power-on Reset and Brown-out Reset

1.0 mA/MHz dynamic current (typical)

60 µA I

current (typical)

High-Speed PWM

•

Up to seven PWM pairs with independent timing

Dead Time for rising and falling edges

8.32 ns PWM resolution

PWM support for:

- DC/DC, AC/DC, Inverters, PFC, Lighting

- BLDC, PMSM, ACIM, SRM

• Programmable Fault inputs

• Flexible trigger configurations for ADC conversions

Direct Memory Access (DMA)

• 15-channel DMA with user-selectable priority arbitration

• UART, USB, SPI, ADC, ECAN, IC, OC, Timers,

DCI/I

S, PMP

Input/Output

•

Sink/Source 10 mA on all pins

5V-tolerant pins

Selectable open drain, pull-ups, and pull-downs

Up to 5 mA overvoltage clamp current

External interrupts on all I/O pins

Advanced Analog Features

• Two independent ADC modules:

- One ADC configurable as 10-bit, 1.1 Msps with four

S&H or 12-bit, 500 ksps with one S&H

- One 10-bit ADC, 1.1 Msps with four S&H

- Eight S&H using both ADC 10-bit modules

- 24 analog channels (64-pin devices) up to 32 analog

channels (100/121/144-pin devices)

• Flexible and independent ADC trigger sources

• Comparators:

- Up to three Analog Comparator modules

- Programmable references with 32 voltage points

Qualification and Class B Support

• AEC-Q100 REVG (Grade 1 -40ºC to +125ºC) planned

• AEC-Q100 REVG (Grade 0 -40ºC to +150ºC) planned

• Class B Safety Library, IEC 60730

Debugger Development Support

•

In-circuit and in-application programming

Five program and three complex data breakpoints

IEEE 1149.2-compatible (JTAG) boundary scan

Trace and run-time watch

Packages

Type

QFN

TQFP

100

0.40

12x12x1

0.50

14x14x1

TFBGA

121

0.50

10x10x1.2

LQFP

144

122

0.50

20x20x1.4

Pin Count

144

I/O Pins (up to)

122

Contact/Lead Pitch

0.50

0.40

Dimensions

9x9x0.9

10x10x1

16x16x1

Note:

All dimensions are in millimeters (mm) unless specified.

2009-2012 Microchip Technology Inc.

Preliminary

DS70616F-page 1

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