EEWORLDEEWORLDEEWORLD

Part Number

Search

74LVC27D,118

Description
IC GATE NOR 3CH 3-INP 14SO
Categorylogic    logic   
File Size116KB,14 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric Compare View All

74LVC27D,118 Overview

IC GATE NOR 3CH 3-INP 14SO

74LVC27D,118 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerNXP
package instructionSOP, SOP14,.25
Reach Compliance Codecompliant
seriesLVC/LCX/Z
JESD-30 codeR-PDSO-G14
JESD-609 codee4
length8.65 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeNOR GATE
MaximumI(ol)0.024 A
Humidity sensitivity level1
Number of functions3
Number of entries3
Number of terminals14
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP14,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Prop。Delay @ Nom-Sup5.9 ns
propagation delay (tpd)7 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height1.75 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)1.2 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width3.9 mm
74LVC27
Triple 3-input NOR gate
Rev. 6 — 27 October 2011
Product data sheet
1. General description
The 74LVC27 provides three 3-input NOR functions.
2. Features and benefits
Wide supply voltage range from 1.2 V to 3.6 V
Inputs accept voltages up to 5.5 V
CMOS low power consumption
Direct interface with TTL levels
Complies with JEDEC standard:
JESD8-7A (1.65 V to 1.95 V)
JESD8-5A (2.3 V to 2.7 V)
JESD8-C/JESD36 (2.7 V to 3.6 V)
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-B exceeds 200 V
CDM JESD22-C101E exceeds 1000 V
Specified from
40 C
to +85
C
and
40 C
to +125
C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74LVC27D
74LVC27DB
74LVC27PW
74LVC27BQ
40 C
to +125
C
40 C
to +125
C
40 C
to +125
C
40 C
to +125
C
Name
SO14
SSOP14
TSSOP14
Description
plastic small outline package; 14 leads;
body width 3.9 mm
plastic shrink small outline package; 14 leads;
body width 5.3 mm
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
Version
SOT108-1
SOT337-1
SOT402-1
SOT762-1
Type number
DHVQFN14 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 14 terminals;
body 2.5
3
0.85 mm

74LVC27D,118 Related Products

74LVC27D,118 74LVC27D,112 74LVC27PW,118 74LVC27PW,112 74LVC27DB,118 74LVC27DB,112 74LVC27BQ,115 74LVC27BQ
Description IC GATE NOR 3CH 3-INP 14SO IC GATE NOR 3CH 3-INP 14SO IC GATE NOR 3CH 3-INP 14TSSOP IC GATE NOR 3CH 3-INP 14TSSOP IC GATE NOR 3CH 3-INP 14SSOP IC GATE NOR 3CH 3-INP 14SSOP IC GATE NOR 3CH 3-INP 14DHVQFN LVC/LCX/Z SERIES, TRIPLE 3-INPUT NOR GATE, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14
Is it lead-free? Lead free Lead free Lead free Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to
Maker NXP NXP NXP NXP NXP NXP NXP NXP
package instruction SOP, SOP14,.25 SOP, SOP14,.25 TSSOP, TSSOP14,.25 TSSOP, TSSOP14,.25 SSOP, SSOP14,.3 SSOP, SSOP14,.3 HVQCCN, LCC14,.1X.12,20 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant
series LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z
JESD-30 code R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PQCC-N14 R-PQCC-N14
JESD-609 code e4 e4 e4 e4 e4 e4 e4 e4
length 8.65 mm 8.65 mm 5 mm 5 mm 6.2 mm 6.2 mm 3 mm 3 mm
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type NOR GATE NOR GATE NOR GATE NOR GATE NOR GATE NOR GATE NOR GATE NOR GATE
MaximumI(ol) 0.024 A 0.024 A 0.024 A 0.024 A 0.024 A 0.024 A 0.024 A 0.024 A
Humidity sensitivity level 1 1 1 1 1 1 1 1
Number of functions 3 3 3 3 3 3 3 3
Number of entries 3 3 3 3 3 3 3 3
Number of terminals 14 14 14 14 14 14 14 14
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP SOP TSSOP TSSOP SSOP SSOP HVQCCN HVQCCN
Encapsulate equivalent code SOP14,.25 SOP14,.25 TSSOP14,.25 TSSOP14,.25 SSOP14,.3 SSOP14,.3 LCC14,.1X.12,20 LCC14,.1X.12,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260 260 260
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Prop。Delay @ Nom-Sup 5.9 ns 5.9 ns 5.9 ns 5.9 ns 5.9 ns 5.9 ns 6.8 ns 5.9 ns
propagation delay (tpd) 7 ns 13.4 ns 7 ns 13.4 ns 7 ns 13.4 ns 7 ns 13.4 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO NO NO NO NO NO
Maximum seat height 1.75 mm 1.75 mm 1.1 mm 1.1 mm 2 mm 2 mm 1 mm 1 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V
Nominal supply voltage (Vsup) 3.3 V 1.8 V 3.3 V 1.8 V 3.3 V 1.8 V 3.3 V 1.8 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING NO LEAD NO LEAD
Terminal pitch 1.27 mm 1.27 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.5 mm 0.5 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL QUAD QUAD
Maximum time at peak reflow temperature 30 30 30 NOT SPECIFIED 30 30 30 30
width 3.9 mm 3.9 mm 4.4 mm 4.4 mm 5.3 mm 5.3 mm 2.5 mm 2.5 mm
method of packing TAPE AND REEL TUBE TAPE AND REEL TUBE TR TUBE TAPE AND REEL -
Parts packaging code - SOIC - TSSOP - SSOP QFN QFN
Contacts - 14 - 14 - 14 14 14

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1740  157  2265  2477  745  36  4  46  50  15 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号