74LVC27D,112 datasheet, PDF - EEWORLD Datasheet

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74LVC27D,112: DescriptionIC GATE NOR 3CH 3-INP 14SO; Categorylogic logic; File Size116KB，14 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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74LVC27D,112 Overview

IC GATE NOR 3CH 3-INP 14SO

74LVC27D,112 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	SOIC
package instruction	SOP, SOP14,.25
Contacts	14
Reach Compliance Code	compliant
series	LVC/LCX/Z
JESD-30 code	R-PDSO-G14
JESD-609 code	e4
length	8.65 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	NOR GATE
MaximumI(ol)	0.024 A
Humidity sensitivity level	1
Number of functions	3
Number of entries	3
Number of terminals	14
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP14,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
method of packing	TUBE
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Prop。Delay @ Nom-Sup	5.9 ns
propagation delay (tpd)	13.4 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	1.75 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	1.2 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	3.9 mm

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74LVC27

Triple 3-input NOR gate

Rev. 6 — 27 October 2011

Product data sheet

1. General description

The 74LVC27 provides three 3-input NOR functions.

2. Features and benefits



Wide supply voltage range from 1.2 V to 3.6 V

Inputs accept voltages up to 5.5 V

CMOS low power consumption

Direct interface with TTL levels

Complies with JEDEC standard:



JESD8-7A (1.65 V to 1.95 V)



JESD8-5A (2.3 V to 2.7 V)



JESD8-C/JESD36 (2.7 V to 3.6 V)



ESD protection:



HBM JESD22-A114F exceeds 2000 V



MM JESD22-A115-B exceeds 200 V



CDM JESD22-C101E exceeds 1000 V



Specified from

40 C

to +85

C

and

40 C

to +125

C

3. Ordering information

Table 1.

Ordering information

Package

Temperature range

74LVC27D

74LVC27DB

74LVC27PW

74LVC27BQ

40 C

to +125

C

40 C

to +125

C

40 C

to +125

C

40 C

to +125

C

Name

SO14

SSOP14

TSSOP14

Description

plastic small outline package; 14 leads;

body width 3.9 mm

plastic shrink small outline package; 14 leads;

body width 5.3 mm

plastic thin shrink small outline package; 14 leads;

body width 4.4 mm

Version

SOT108-1

SOT337-1

SOT402-1

SOT762-1

Type number

DHVQFN14 plastic dual in-line compatible thermal enhanced very

thin quad flat package; no leads; 14 terminals;

body 2.5



0.85 mm

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	74LVC27D,112	74LVC27D,118	74LVC27PW,118	74LVC27PW,112	74LVC27DB,118	74LVC27DB,112	74LVC27BQ,115	74LVC27BQ
Description	IC GATE NOR 3CH 3-INP 14SO	IC GATE NOR 3CH 3-INP 14SO	IC GATE NOR 3CH 3-INP 14TSSOP	IC GATE NOR 3CH 3-INP 14TSSOP	IC GATE NOR 3CH 3-INP 14SSOP	IC GATE NOR 3CH 3-INP 14SSOP	IC GATE NOR 3CH 3-INP 14DHVQFN	LVC/LCX/Z SERIES, TRIPLE 3-INPUT NOR GATE, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	NXP	NXP	NXP	NXP	NXP	NXP	NXP	NXP
package instruction	SOP, SOP14,.25	SOP, SOP14,.25	TSSOP, TSSOP14,.25	TSSOP, TSSOP14,.25	SSOP, SSOP14,.3	SSOP, SSOP14,.3	HVQCCN, LCC14,.1X.12,20	2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
series	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z
JESD-30 code	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PQCC-N14	R-PQCC-N14
JESD-609 code	e4	e4	e4	e4	e4	e4	e4	e4
length	8.65 mm	8.65 mm	5 mm	5 mm	6.2 mm	6.2 mm	3 mm	3 mm
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	NOR GATE	NOR GATE	NOR GATE	NOR GATE	NOR GATE	NOR GATE	NOR GATE	NOR GATE
MaximumI(ol)	0.024 A	0.024 A	0.024 A	0.024 A	0.024 A	0.024 A	0.024 A	0.024 A
Humidity sensitivity level	1	1	1	1	1	1	1	1
Number of functions	3	3	3	3	3	3	3	3
Number of entries	3	3	3	3	3	3	3	3
Number of terminals	14	14	14	14	14	14	14	14
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	SOP	TSSOP	TSSOP	SSOP	SSOP	HVQCCN	HVQCCN
Encapsulate equivalent code	SOP14,.25	SOP14,.25	TSSOP14,.25	TSSOP14,.25	SSOP14,.3	SSOP14,.3	LCC14,.1X.12,20	LCC14,.1X.12,20
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260	260	260
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Prop。Delay @ Nom-Sup	5.9 ns	5.9 ns	5.9 ns	5.9 ns	5.9 ns	5.9 ns	6.8 ns	5.9 ns
propagation delay (tpd)	13.4 ns	7 ns	7 ns	13.4 ns	7 ns	13.4 ns	7 ns	13.4 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	NO	NO	NO	NO	NO	NO	NO
Maximum seat height	1.75 mm	1.75 mm	1.1 mm	1.1 mm	2 mm	2 mm	1 mm	1 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V
Nominal supply voltage (Vsup)	1.8 V	3.3 V	3.3 V	1.8 V	3.3 V	1.8 V	3.3 V	1.8 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.5 mm	0.5 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	QUAD	QUAD
Maximum time at peak reflow temperature	30	30	30	NOT SPECIFIED	30	30	30	30
width	3.9 mm	3.9 mm	4.4 mm	4.4 mm	5.3 mm	5.3 mm	2.5 mm	2.5 mm
Parts packaging code	SOIC	-	-	TSSOP	-	SSOP	QFN	QFN
Contacts	14	-	-	14	-	14	14	14
method of packing	TUBE	TAPE AND REEL	TAPE AND REEL	TUBE	TR	TUBE	TAPE AND REEL	-

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