EEWORLDEEWORLDEEWORLD

Part Number

Search

PTFA092211ELV4XWSA1

Description
FET RF LDMOS 220W H33288-2
CategoryDiscrete semiconductor    The transistor   
File Size418KB,10 Pages
ManufacturerInfineon
Websitehttp://www.infineon.com/
Download Datasheet Parametric Compare View All

PTFA092211ELV4XWSA1 Overview

FET RF LDMOS 220W H33288-2

PTFA092211ELV4XWSA1 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
package instructionFLANGE MOUNT, R-XDFM-F2
Contacts2
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresHGH RELIABILITY
Shell connectionSOURCE
ConfigurationSINGLE
Minimum drain-source breakdown voltage65 V
FET technologyMETAL-OXIDE SEMICONDUCTOR
highest frequency bandULTRA HIGH FREQUENCY BAND
JESD-30 codeR-XDFM-F2
Number of components1
Number of terminals2
Operating modeENHANCEMENT MODE
Maximum operating temperature200 °C
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeN-CHANNEL
Certification statusNot Qualified
surface mountYES
Terminal formFLAT
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
transistor applicationsAMPLIFIER
Transistor component materialsSILICON
Base Number Matches1
PTFA092211EL
PTFA092211FL
Confidential, Limited Internal Distribution
Thermally-Enhanced High Power RF LDMOS FETs
220 W, 920 – 960 MHz
Description
The PTFA092211EL and PTFA092211FL are 220-watt, internally-
matched LDMOS FETs intended for EDGE and WCDMA applications
in the 920 to 960 MHz band. Manufactured with Infineon's advanced
LDMOS process, these devices provide excellent thermal
performance and superior reliability.
PTFA092211EL
Package H-33288-2
PTFA092211FL
Package H-34288-2
Two-carrier WCDMA Performance
V
DD
= 30 V, I
DQ
= 1.50 A, ƒ = 940 MHz, 3GPP WCDMA
signal, PAR = 6.5 dB, 5 MHz carrier spacing
40
35
-20
-25
Features
Broadband internal matching
Typical two-carrier WCDMA performance at
940 MHz, 30 V
- Average output power = 50 W
- Linear Gain = 18.0 dB
- Efficiency = 30%
- Intermodulation distortion = –37 dBc
Typical CW performance, 940 MHz, 30 V
- Output power at P–1dB = 250 W
- Gain = 17.0 dB
- Efficiency = 59%
Integrated ESD protection: Human Body Model,
Class 2 (minimum)
Excellent thermal stability, low HCI drift
Capable of handling 10:1 VSWR @ 30 V,
220 W (CW) output power
Pb-free, RoHS-compliant and thermally-enhanced
packages
Drain Efficiency (%)
ACPR (dBc)
30
25
20
15
10
40
41
42
43
44
45
46
47
48
49
-30
Efficiency
-35
-40
ACP
-45
-50
Output Power, Avg. (dBm)
RF Characteristics
Two-carrier WCDMA Measurements
(tested in Infineon test fixture)
V
DD
= 30 V, I
DQ
= 1750 mA, P
OUT
= 50 W (AVG),
ƒ
1
= 937.5 MHz, ƒ
2
= 942.5 MHz, 3GPP signal, channel bandwidth = 3.84 MHz, peak/average = 7.5 dB @ 0.01% CCDF
Characteristic
Gain
Drain Efficiency
Intermodulation Distortion
Symbol
G
ps
Min
17.0
28.5
Typ
18.0
30
–34
Max
–32
Unit
dB
%
dBc
η
D
IMD
All published data at T
CASE
= 25 °C unless otherwise indicated
*See Infineon distributor for future availability.
ESD:
Electrostatic discharge sensitive device—observe handling precautions!
Data Sheet
1 of 10
Rev. 02, 2009-05-27

PTFA092211ELV4XWSA1 Related Products

PTFA092211ELV4XWSA1 PTFA092211ELV4R250XTMA1 PTFA092211FLV4XWSA1 PTFA092211FLV4R250XTMA1
Description FET RF LDMOS 220W H33288-2 FET RF LDMOS 220W H33288-3 IC FET RF LDMOS IC FET RF LDMOS
package instruction FLANGE MOUNT, R-XDFM-F2 FLANGE MOUNT, R-XDFM-F2 FLATPACK, R-XDFP-F2 FLATPACK, R-XDFP-F2
Reach Compliance Code unknown unknown unknown unknown
Other features HGH RELIABILITY HGH RELIABILITY HGH RELIABILITY HGH RELIABILITY
Shell connection SOURCE SOURCE SOURCE SOURCE
Configuration SINGLE SINGLE SINGLE SINGLE
Minimum drain-source breakdown voltage 65 V 65 V 65 V 65 V
FET technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
highest frequency band ULTRA HIGH FREQUENCY BAND ULTRA HIGH FREQUENCY BAND ULTRA HIGH FREQUENCY BAND ULTRA HIGH FREQUENCY BAND
JESD-30 code R-XDFM-F2 R-XDFM-F2 R-XDFP-F2 R-XDFP-F2
Number of components 1 1 1 1
Number of terminals 2 2 2 2
Operating mode ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE
Maximum operating temperature 200 °C 200 °C 200 °C 200 °C
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLANGE MOUNT FLANGE MOUNT FLATPACK FLATPACK
Polarity/channel type N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL
surface mount YES YES YES YES
Terminal form FLAT FLAT FLAT FLAT
Terminal location DUAL DUAL DUAL DUAL
transistor applications AMPLIFIER AMPLIFIER AMPLIFIER AMPLIFIER
Transistor component materials SILICON SILICON SILICON SILICON
Base Number Matches 1 1 1 1

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1953  1458  1247  138  1050  40  30  26  3  22 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号