A range of dc rated multi-layer chip capacitors from
0.47pF to 22µF and in case sizes 0603 to 8060 in
C0G/NP0 and X7R dielectrics. Suitable for all general
purpose and high reliability applications where package
size and reliability are important. All are manufactured
using Syfer’s unique wet process and incorporate
precious metal electrodes.
Dissipation Factor
Ageing Rate
Range Dimensions – Standard MLCC Ranges
Length
(L1)
mm/inches
1.6 ± 0.2
0.063 ± 0.008
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
5.7 ± 0.4
0.225 ± 0.016
5.7 ± 0.4
0.225 ± 0.016
9.2 ± 0.5
0.36 ± 0.02
14.0 ± 0.5
0.55 ± 0.02
20.3 ± 0.5
0.8 ± 0.02
Width
(W)
mm/inches
0.8 ± 0.2
0.031 ± 0.008
1.25 ± 0.2
0.05 ± 0.008
1.6 ± 0.2
0.063 ± 0.008
2.5 ± 0.3
0.1 ± 0.012
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
6.30 ± 0.4
0.25 ± 0.016
5.0 ± 0.4
0.197 ± 0.016
6.3 ± 0.4
0.25 ± 0.016
10.16 ± 0.5
0.4 ± 0.02
12.7 ± 0.5
0.5 ± 0.02
15.24 ± 0.5
0.6 ± 0.02
Max. Thickness
(T)
mm/inches
0.8
0.013
1.3
0.051
1.6
0.063
2.0
0.08
2.0
0.08
2.5
0.1
2.5
0.1
4.2
0.16
4.2
0.16
2.5
0.1
4.2
0.16
2.5
0.1
Termination Band
(L2)
mm/inches
min
0.10
0.004
0.13
0.005
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.5
0.02
0.5
0.02
0.5
0.02
max
0.40
0.015
0.75
0.03
0.75
0.03
0.75
0.03
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.5
0.06
1.5
0.06
1.5
0.06
Size
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
5550
8060
Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to the sales office.
Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request – please refer
The author originally developed an IOT smart LED lamp using ESP32-C3. This time, in order to replace ESP32 with GD32L233C, the ESP32 code needs to be ported to GD32L233C, and random numbers are needed...
[font=宋体] [font=Arial][size=10.5pt][font=宋体][/font][/size][/font][/font] [font=Arial][size=10.5pt][font=宋体]The new year is coming, and various media have counted the top ten news events[/font][/size][...
I have worked hard for nearly two years to come up with this set of things. Sharp-eyed friends can probably guess their uses, but the key is that the links are not ideal and need to be improved. Are t...
I'm porting cosii to str71x recently. I refer to other experts' porting examples, but I haven't succeeded. I always encounter problems when executing the msr cpsr_c, r0 instruction. After this sentenc...
Hello! I want to use the NANDWriter of OMAP-L138_FlashAndBootUtils_2_40 to program Nand Flash. However, my TMS320C6748 board does not have DDR and can only run in L2RAM and Shared RAM. How do I modify...
The ECDS-MUI V1.0 full-function evaluation version released this time includes the compiled examples of ECDS-MUI V1.0, all the C++ source code of the examples, and development documents. We recommend ...
At present, the development of wireless power supply technology for electric vehicles (EVs) is becoming more and more active. In 2012, Volvo of Sweden established Volvo Technology Japan in Tokyo as...[Details]
Traditional broadcasting systems generally need to be operated manually at a fixed time, and can only realize one-way broadcasting with few functions. Traditional bell ringing equipment has a singl...[Details]
1. Circuit composition
The whole circuit consists of two parts:
1. Power saving control circuit
As shown in the figure below. Including delay circuit and drive circuit.
(1) Delay ci...[Details]
1. Introduction
With the growth of parking demand, the scale of parking lots is becoming larger and larger. A lot of research has been done on intelligent parking lots in China, but most of th...[Details]
Automotive applications are particularly sensitive to EMI events, which are unavoidable in a noisy electrical environment consisting of a central battery, bundled wiring harnesses, various inductiv...[Details]
Converged processors meet scalability requirements
In current embedded system design, solutions based on MCU, DSP, FPGA and ASIC account for more than 90% of the market share. These solutions ...[Details]
In order to highlight the concept of "energy saving and environmental protection" of intelligent buildings, solar street lights are designed for intelligent communities. The inclination and capacit...[Details]
Introduction
Power subsystems are becoming more and more integrated into the overall system. Power systems have moved from being separate "essential dangerous devices" to being monitorable...[Details]
Although it is relatively easy to check the stability of a simple amplifier at lower frequencies, it may be much more difficult to evaluate the stability of a more complex circuit. This artic...[Details]
1. System Structure
This system is a simulation system of indoor air-conditioning temperature/humidity control system. The data acquisition and control center collects temperature/humidity...[Details]
Smart lighting control systems provide high controllability for various buildings and further enhance the level of green energy. They are the core products of energy conservation and digital techn...[Details]
With the continuous consumption of earth's energy and the scarcity of resources, the harm of greenhouse effect to human beings, and the serious pollution of the atmosphere to the earth, the intern...[Details]
LED lamps and bulbs are now rapidly replacing incandescent, halogen and CFL (compact fluorescent lamp) light sources in many general lighting applications. Flyback DC/DC converters are the power su...[Details]
The traditional display screen using 51 single-chip microcomputer to control LED dot matrix has relatively simple functions. If it is to achieve diversified functions, it often takes a lot of time ...[Details]
GD32 MCU
京公网安备 11010802033920号
EEWORLD
